SG10201502022QA - Polishing device and polishing method - Google Patents

Polishing device and polishing method

Info

Publication number
SG10201502022QA
SG10201502022QA SG10201502022QA SG10201502022QA SG10201502022QA SG 10201502022Q A SG10201502022Q A SG 10201502022QA SG 10201502022Q A SG10201502022Q A SG 10201502022QA SG 10201502022Q A SG10201502022Q A SG 10201502022QA SG 10201502022Q A SG10201502022Q A SG 10201502022QA
Authority
SG
Singapore
Prior art keywords
polishing
polishing device
polishing method
Prior art date
Application number
SG10201502022QA
Other languages
English (en)
Inventor
Yoichi Shiokawa
Keita Yagi
Yoichi Kobayashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201502022QA publication Critical patent/SG10201502022QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
SG10201502022QA 2014-03-20 2015-03-17 Polishing device and polishing method SG10201502022QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014057859 2014-03-20
JP2014228346A JP6266493B2 (ja) 2014-03-20 2014-11-10 研磨装置及び研磨方法

Publications (1)

Publication Number Publication Date
SG10201502022QA true SG10201502022QA (en) 2015-10-29

Family

ID=54111783

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201502022QA SG10201502022QA (en) 2014-03-20 2015-03-17 Polishing device and polishing method

Country Status (6)

Country Link
US (1) US9550269B2 (ja)
JP (1) JP6266493B2 (ja)
KR (1) KR101862441B1 (ja)
CN (1) CN104924198B (ja)
SG (1) SG10201502022QA (ja)
TW (1) TWI601599B (ja)

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CN107803744A (zh) * 2017-09-26 2018-03-16 合肥新汇成微电子有限公司 一种半导体晶圆的背面研磨方法
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KR102461597B1 (ko) * 2018-01-04 2022-11-01 주식회사 케이씨텍 기판 처리 시스템
CN110497317A (zh) * 2019-07-25 2019-11-26 杭州电子科技大学 一种适用于自动打磨设备的恒压装置
JP2021091033A (ja) 2019-12-10 2021-06-17 キオクシア株式会社 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法
JP7443169B2 (ja) 2020-06-29 2024-03-05 株式会社荏原製作所 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
CN111844831B (zh) * 2020-07-06 2022-03-22 大连理工大学 一种轻质基材薄壁反射镜的制作方法
JP7290140B2 (ja) * 2020-09-09 2023-06-13 株式会社Sumco ウェーハ研磨方法およびウェーハ研磨装置
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CN112936085B (zh) * 2021-02-04 2022-09-16 华海清科股份有限公司 一种化学机械抛光控制方法及控制系统
JP2022133042A (ja) 2021-03-01 2022-09-13 株式会社荏原製作所 研磨装置および研磨方法
JP2024508932A (ja) * 2021-03-05 2024-02-28 アプライド マテリアルズ インコーポレイテッド 基板歳差運動を伴う基板研磨のための処理パラメータの制御

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Also Published As

Publication number Publication date
US9550269B2 (en) 2017-01-24
KR101862441B1 (ko) 2018-05-29
TW201540424A (zh) 2015-11-01
JP2015193068A (ja) 2015-11-05
TWI601599B (zh) 2017-10-11
CN104924198B (zh) 2018-11-16
JP6266493B2 (ja) 2018-01-24
KR20150110347A (ko) 2015-10-02
CN104924198A (zh) 2015-09-23
US20150266159A1 (en) 2015-09-24

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