SG10201405742XA - Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece - Google Patents
Method For Simultaneously Cutting A Multiplicity Of Wafers From A WorkpieceInfo
- Publication number
- SG10201405742XA SG10201405742XA SG10201405742XA SG10201405742XA SG10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA
- Authority
- SG
- Singapore
- Prior art keywords
- multiplicity
- wafers
- workpiece
- simultaneously cutting
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
- B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
- B24B27/0691—Accessories therefor for controlling the feeding or return movement of the saw
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201310219468 DE102013219468B4 (de) | 2013-09-26 | 2013-09-26 | Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201405742XA true SG10201405742XA (en) | 2015-04-29 |
Family
ID=52623649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201405742XA SG10201405742XA (en) | 2013-09-26 | 2014-09-15 | Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece |
Country Status (7)
Country | Link |
---|---|
US (1) | US9333673B2 (zh) |
JP (1) | JP5853081B2 (zh) |
KR (1) | KR101670132B1 (zh) |
CN (1) | CN104511975B (zh) |
DE (1) | DE102013219468B4 (zh) |
SG (1) | SG10201405742XA (zh) |
TW (1) | TWI556933B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5590001B2 (ja) * | 2011-10-04 | 2014-09-17 | 信越半導体株式会社 | ワークの切断方法及びワイヤソー |
CN104802220B (zh) * | 2015-04-27 | 2017-11-21 | 深圳市远达明反光器材有限公司 | 柔性太阳能板加工方法、设备及太阳能道钉 |
JP6402700B2 (ja) * | 2015-10-20 | 2018-10-10 | 信越半導体株式会社 | ワークの切断方法及びワイヤソー |
JP6625926B2 (ja) * | 2016-04-13 | 2019-12-25 | 株式会社ディスコ | ウエーハの加工方法 |
JP6249319B1 (ja) * | 2017-03-30 | 2017-12-20 | パナソニックIpマネジメント株式会社 | ソーワイヤー及び切断装置 |
WO2018203448A1 (ja) * | 2017-05-02 | 2018-11-08 | 信越半導体株式会社 | ワークの切断方法及び接合部材 |
JP6751900B2 (ja) * | 2018-01-29 | 2020-09-09 | パナソニックIpマネジメント株式会社 | 金属線及びソーワイヤー |
DE102018218016A1 (de) | 2018-10-22 | 2020-04-23 | Siltronic Ag | Verfahren und Vorrichtung zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück |
JP7266398B2 (ja) * | 2018-12-11 | 2023-04-28 | 株式会社ディスコ | 切削装置及び切削装置を用いたウエーハの加工方法 |
DE102018221921A1 (de) * | 2018-12-17 | 2020-06-18 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge |
CN109676811A (zh) * | 2018-12-27 | 2019-04-26 | 江苏纳沛斯半导体有限公司 | 一种用于半导体晶圆生产的切段装置 |
DE102019207719A1 (de) * | 2019-05-27 | 2020-12-03 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von Werkstücken während einer Anzahl von Abtrennvorgängen mittels einer Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium |
EP3858569A1 (de) | 2020-01-28 | 2021-08-04 | Siltronic AG | Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen |
EP3943265A1 (de) | 2020-07-21 | 2022-01-26 | Siltronic AG | Verfahren und vorrichtung zum gleichzeitigen abtrennen einer vielzahl von scheiben von einem werkstück |
EP4047635A1 (de) | 2021-02-18 | 2022-08-24 | Siltronic AG | Verfahren zur herstellung von scheiben aus einem zylindrischen stab aus halbleitermaterial |
CN114714525B (zh) * | 2022-03-18 | 2023-09-05 | 浙江晶盛机电股份有限公司 | 并线检测方法、并线检测光学装置及并线检测系统 |
CN114420446B (zh) * | 2022-03-29 | 2022-08-16 | 绵阳聚贤自动化设备有限公司 | 网络滤波器的绕脚制作工艺 |
CN115791536A (zh) * | 2022-11-08 | 2023-03-14 | 西安奕斯伟材料科技有限公司 | 检查多线切割机的转轴的线槽中的污染颗粒的系统和方法 |
Family Cites Families (25)
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JPH05259016A (ja) * | 1992-03-12 | 1993-10-08 | Mitsubishi Electric Corp | ウエハ作製用基板及び半導体ウエハの製造方法 |
GB9317170D0 (en) | 1993-08-18 | 1993-10-06 | Applied Vision Ltd | Improvements in physical vapour deposition apparatus |
CH690845A5 (de) * | 1994-05-19 | 2001-02-15 | Tokyo Seimitsu Co Ltd | Verfahren zum Positionieren eines Werkstücks und Vorrichtung hierfür. |
US5937844A (en) * | 1996-03-26 | 1999-08-17 | Shin-Etsu Handotai Co., Ltd. | Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing |
JP3810170B2 (ja) * | 1997-01-29 | 2006-08-16 | 信越半導体株式会社 | ワイヤーソーによるワークの切断方法およびワイヤーソー |
JP3213563B2 (ja) * | 1997-03-11 | 2001-10-02 | 株式会社スーパーシリコン研究所 | ノッチレスウェーハの製造方法 |
JPH10249699A (ja) * | 1997-03-18 | 1998-09-22 | Sharp Corp | マルチワイヤーソー |
JPH11262917A (ja) * | 1998-03-18 | 1999-09-28 | Shin Etsu Handotai Co Ltd | 半導体単結晶インゴットのスライス方法 |
JP3389141B2 (ja) * | 1999-04-26 | 2003-03-24 | 株式会社スーパーシリコン研究所 | スライシング用スラリーの評価方法及びスラリー |
JP2001334452A (ja) * | 2000-05-30 | 2001-12-04 | Memc Japan Ltd | 円柱状ワークの切断方法 |
AU2000251024A1 (en) * | 2000-05-31 | 2001-12-11 | Memc Electronic Materials S.P.A. | Wire saw and process for slicing multiple semiconductor ingots |
US7045093B2 (en) | 2001-07-31 | 2006-05-16 | Neomax Co., Ltd. | Method for manufacturing sintered magnet |
KR100667690B1 (ko) * | 2004-11-23 | 2007-01-12 | 주식회사 실트론 | 웨이퍼 슬라이싱 방법 및 장치 |
JP2007301688A (ja) | 2006-05-12 | 2007-11-22 | Naoetsu Electronics Co Ltd | ワーク切断方法 |
DE102006060358A1 (de) * | 2006-12-20 | 2008-06-26 | Siltronic Ag | Vorrichtung und Verfahren zum Zersägen eines Werkstücks |
EP2165805A4 (en) * | 2007-06-27 | 2014-02-12 | Mitsubishi Electric Corp | MULTI-THREAD SAW AND CUTTING METHOD OF INGOT |
WO2009153877A1 (ja) * | 2008-06-19 | 2009-12-23 | 信濃電気製錬株式会社 | インゴットスライシング用フレットバー、該フレットバーを貼着したインゴット、及び該フレットバーを用いたインゴットの切断方法 |
CN201235584Y (zh) * | 2008-07-01 | 2009-05-13 | 内蒙古晟纳吉光伏材料有限公司 | 硅片线切割装置 |
WO2010120491A2 (en) * | 2009-04-01 | 2010-10-21 | Cabot Microelectronics Corporation | Self-cleaning wiresaw apparatus and method |
GB2476658A (en) | 2009-12-30 | 2011-07-06 | Rec Wafer Norway As | Process for cutting a block using a planar array of wires |
DE102010007459B4 (de) | 2010-02-10 | 2012-01-19 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial |
TW201206813A (en) * | 2010-08-11 | 2012-02-16 | Furukawa Electric Co Ltd | Wafer processing tape |
CN102285010B (zh) | 2011-08-08 | 2012-10-03 | 江西金葵能源科技有限公司 | 一种使用金刚石线切割的太阳能级硅晶薄片及其切割方法 |
WO2013041140A1 (en) | 2011-09-22 | 2013-03-28 | APPLIED MATERIALS SWITZERLAND SàRL | Method and apparatus for cutting semiconductor workpieces |
DE102014208187B4 (de) * | 2014-04-30 | 2023-07-06 | Siltronic Ag | Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben mit besonders gleichmäßiger Dicke von einem Werkstück |
-
2013
- 2013-09-26 DE DE201310219468 patent/DE102013219468B4/de active Active
-
2014
- 2014-09-12 CN CN201410464796.6A patent/CN104511975B/zh active Active
- 2014-09-15 SG SG10201405742XA patent/SG10201405742XA/en unknown
- 2014-09-19 JP JP2014191338A patent/JP5853081B2/ja active Active
- 2014-09-23 US US14/493,445 patent/US9333673B2/en active Active
- 2014-09-25 TW TW103133206A patent/TWI556933B/zh active
- 2014-09-26 KR KR1020140128948A patent/KR101670132B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN104511975A (zh) | 2015-04-15 |
TWI556933B (zh) | 2016-11-11 |
JP5853081B2 (ja) | 2016-02-09 |
US9333673B2 (en) | 2016-05-10 |
DE102013219468A1 (de) | 2015-03-26 |
CN104511975B (zh) | 2016-10-12 |
TW201511909A (zh) | 2015-04-01 |
US20150083104A1 (en) | 2015-03-26 |
KR101670132B1 (ko) | 2016-10-27 |
JP2015066677A (ja) | 2015-04-13 |
KR20150034658A (ko) | 2015-04-03 |
DE102013219468B4 (de) | 2015-04-23 |
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