SG10201405742XA - Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece - Google Patents

Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece

Info

Publication number
SG10201405742XA
SG10201405742XA SG10201405742XA SG10201405742XA SG10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA
Authority
SG
Singapore
Prior art keywords
multiplicity
wafers
workpiece
simultaneously cutting
cutting
Prior art date
Application number
SG10201405742XA
Other languages
English (en)
Inventor
Georg Pietsch
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG10201405742XA publication Critical patent/SG10201405742XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B24B27/0691—Accessories therefor for controlling the feeding or return movement of the saw

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201405742XA 2013-09-26 2014-09-15 Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece SG10201405742XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201310219468 DE102013219468B4 (de) 2013-09-26 2013-09-26 Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück

Publications (1)

Publication Number Publication Date
SG10201405742XA true SG10201405742XA (en) 2015-04-29

Family

ID=52623649

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201405742XA SG10201405742XA (en) 2013-09-26 2014-09-15 Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece

Country Status (7)

Country Link
US (1) US9333673B2 (ja)
JP (1) JP5853081B2 (ja)
KR (1) KR101670132B1 (ja)
CN (1) CN104511975B (ja)
DE (1) DE102013219468B4 (ja)
SG (1) SG10201405742XA (ja)
TW (1) TWI556933B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5590001B2 (ja) * 2011-10-04 2014-09-17 信越半導体株式会社 ワークの切断方法及びワイヤソー
CN104802220B (zh) * 2015-04-27 2017-11-21 深圳市远达明反光器材有限公司 柔性太阳能板加工方法、设备及太阳能道钉
JP6402700B2 (ja) * 2015-10-20 2018-10-10 信越半導体株式会社 ワークの切断方法及びワイヤソー
JP6625926B2 (ja) * 2016-04-13 2019-12-25 株式会社ディスコ ウエーハの加工方法
JP6249319B1 (ja) * 2017-03-30 2017-12-20 パナソニックＩｐマネジメント株式会社 ソーワイヤー及び切断装置
WO2018203448A1 (ja) * 2017-05-02 2018-11-08 信越半導体株式会社 ワークの切断方法及び接合部材
JP6751900B2 (ja) * 2018-01-29 2020-09-09 パナソニックＩｐマネジメント株式会社 金属線及びソーワイヤー
DE102018218016A1 (de) 2018-10-22 2020-04-23 Siltronic Ag Verfahren und Vorrichtung zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück
JP7266398B2 (ja) * 2018-12-11 2023-04-28 株式会社ディスコ 切削装置及び切削装置を用いたウエーハの加工方法
DE102018221921A1 (de) * 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge
CN109676811A (zh) * 2018-12-27 2019-04-26 江苏纳沛斯半导体有限公司 一种用于半导体晶圆生产的切段装置
DE102019207719A1 (de) 2019-05-27 2020-12-03 Siltronic Ag Verfahren zum Abtrennen einer Vielzahl von Scheiben von Werkstücken während einer Anzahl von Abtrennvorgängen mittels einer Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
EP3858569A1 (de) 2020-01-28 2021-08-04 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen
EP3943265A1 (de) 2020-07-21 2022-01-26 Siltronic AG Verfahren und vorrichtung zum gleichzeitigen abtrennen einer vielzahl von scheiben von einem werkstück
EP4047635A1 (de) 2021-02-18 2022-08-24 Siltronic AG Verfahren zur herstellung von scheiben aus einem zylindrischen stab aus halbleitermaterial
CN114193644A (zh) * 2021-12-27 2022-03-18 烟台力凯数控科技有限公司 一种线切割作业方法
CN114714525B (zh) * 2022-03-18 2023-09-05 浙江晶盛机电股份有限公司 并线检测方法、并线检测光学装置及并线检测系统
CN114420446B (zh) * 2022-03-29 2022-08-16 绵阳聚贤自动化设备有限公司 网络滤波器的绕脚制作工艺
CN115791536A (zh) * 2022-11-08 2023-03-14 西安奕斯伟材料科技有限公司 检查多线切割机的转轴的线槽中的污染颗粒的系统和方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259016A (ja) * 1992-03-12 1993-10-08 Mitsubishi Electric Corp ウエハ作製用基板及び半導体ウエハの製造方法
GB9317170D0 (en) 1993-08-18 1993-10-06 Applied Vision Ltd Improvements in physical vapour deposition apparatus
CH690845A5 (de) * 1994-05-19 2001-02-15 Tokyo Seimitsu Co Ltd Verfahren zum Positionieren eines Werkstücks und Vorrichtung hierfür.
MY120514A (en) * 1996-03-26 2005-11-30 Shinetsu Handotai Kk Wire saw and method of slicing a cylindrical workpiece
JP3810170B2 (ja) * 1997-01-29 2006-08-16 信越半導体株式会社 ワイヤーソーによるワークの切断方法およびワイヤーソー
JP3213563B2 (ja) * 1997-03-11 2001-10-02 株式会社スーパーシリコン研究所 ノッチレスウェーハの製造方法
JPH10249699A (ja) * 1997-03-18 1998-09-22 Sharp Corp マルチワイヤーソー
JPH11262917A (ja) * 1998-03-18 1999-09-28 Shin Etsu Handotai Co Ltd 半導体単結晶インゴットのスライス方法
JP3389141B2 (ja) * 1999-04-26 2003-03-24 株式会社スーパーシリコン研究所 スライシング用スラリーの評価方法及びスラリー
JP2001334452A (ja) * 2000-05-30 2001-12-04 Memc Japan Ltd 円柱状ワークの切断方法
AU2000251024A1 (en) * 2000-05-31 2001-12-11 Memc Electronic Materials S.P.A. Wire saw and process for slicing multiple semiconductor ingots
DE10296690B4 (de) 2001-07-31 2008-05-08 Neomax Co., Ltd. Verfahren zur Herstellung eines Sintermagneten
KR100667690B1 (ko) * 2004-11-23 2007-01-12 주식회사 실트론 웨이퍼 슬라이싱 방법 및 장치
JP2007301688A (ja) 2006-05-12 2007-11-22 Naoetsu Electronics Co Ltd ワーク切断方法
DE102006060358A1 (de) 2006-12-20 2008-06-26 Siltronic Ag Vorrichtung und Verfahren zum Zersägen eines Werkstücks
US8256407B2 (en) * 2007-06-27 2012-09-04 Mitsubishi Electric Corporation Multi-wire saw and method for cutting ingot
WO2009153877A1 (ja) * 2008-06-19 2009-12-23 信濃電気製錬株式会社 インゴットスライシング用フレットバー、該フレットバーを貼着したインゴット、及び該フレットバーを用いたインゴットの切断方法
CN201235584Y (zh) * 2008-07-01 2009-05-13 内蒙古晟纳吉光伏材料有限公司 硅片线切割装置
WO2010120491A2 (en) * 2009-04-01 2010-10-21 Cabot Microelectronics Corporation Self-cleaning wiresaw apparatus and method
GB2476658A (en) 2009-12-30 2011-07-06 Rec Wafer Norway As Process for cutting a block using a planar array of wires
DE102010007459B4 (de) 2010-02-10 2012-01-19 Siltronic Ag Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial
TW201206813A (en) * 2010-08-11 2012-02-16 Furukawa Electric Co Ltd Wafer processing tape
CN102285010B (zh) 2011-08-08 2012-10-03 江西金葵能源科技有限公司 一种使用金刚石线切割的太阳能级硅晶薄片及其切割方法
WO2013041140A1 (en) * 2011-09-22 2013-03-28 APPLIED MATERIALS SWITZERLAND SàRL Method and apparatus for cutting semiconductor workpieces
DE102014208187B4 (de) * 2014-04-30 2023-07-06 Siltronic Ag Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben mit besonders gleichmäßiger Dicke von einem Werkstück

Also Published As

Publication number Publication date
JP5853081B2 (ja) 2016-02-09
TW201511909A (zh) 2015-04-01
KR20150034658A (ko) 2015-04-03
KR101670132B1 (ko) 2016-10-27
TWI556933B (zh) 2016-11-11
CN104511975A (zh) 2015-04-15
JP2015066677A (ja) 2015-04-13
US20150083104A1 (en) 2015-03-26
DE102013219468A1 (de) 2015-03-26
CN104511975B (zh) 2016-10-12
DE102013219468B4 (de) 2015-04-23
US9333673B2 (en) 2016-05-10

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