SG100689A1 - Method and system for coating and developing - Google Patents

Method and system for coating and developing

Info

Publication number
SG100689A1
SG100689A1 SG200102696A SG200102696A SG100689A1 SG 100689 A1 SG100689 A1 SG 100689A1 SG 200102696 A SG200102696 A SG 200102696A SG 200102696 A SG200102696 A SG 200102696A SG 100689 A1 SG100689 A1 SG 100689A1
Authority
SG
Singapore
Prior art keywords
developing
coating
Prior art date
Application number
SG200102696A
Other languages
English (en)
Inventor
Kitano Junichi
Matsuyama Yuji
Kitano Takahiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG100689A1 publication Critical patent/SG100689A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200102696A 2000-05-11 2001-05-09 Method and system for coating and developing SG100689A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000138213A JP3590328B2 (ja) 2000-05-11 2000-05-11 塗布現像処理方法及び塗布現像処理システム

Publications (1)

Publication Number Publication Date
SG100689A1 true SG100689A1 (en) 2003-12-26

Family

ID=18645860

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200102696A SG100689A1 (en) 2000-05-11 2001-05-09 Method and system for coating and developing

Country Status (6)

Country Link
US (2) US6875281B2 (zh)
JP (1) JP3590328B2 (zh)
KR (1) KR100739969B1 (zh)
CN (1) CN1199238C (zh)
SG (1) SG100689A1 (zh)
TW (1) TW495815B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004281854A (ja) * 2003-03-18 2004-10-07 Canon Inc 露光装置
JP2005353763A (ja) * 2004-06-09 2005-12-22 Matsushita Electric Ind Co Ltd 露光装置及びパターン形成方法
JP4566035B2 (ja) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4301219B2 (ja) * 2005-08-01 2009-07-22 セイコーエプソン株式会社 減圧乾燥方法、機能膜の製造方法および電気光学装置の製造方法、電気光学装置、液晶表示装置、有機ｅｌ表示装置、並びに電子機器
JP4907923B2 (ja) * 2005-08-25 2012-04-04 公立大学法人首都大学東京 微小物品搬送装置
US8815014B2 (en) * 2005-11-18 2014-08-26 Tokyo Electron Limited Method and system for performing different deposition processes within a single chamber
JP4762743B2 (ja) * 2006-02-09 2011-08-31 東京エレクトロン株式会社 熱処理装置
JP2008192642A (ja) * 2007-01-31 2008-08-21 Tokyo Electron Ltd 基板処理装置
JP5308054B2 (ja) * 2008-04-16 2013-10-09 株式会社Ｓｏｋｕｄｏ 基板処理装置
CN102135734B (zh) * 2010-01-27 2013-09-04 中芯国际集成电路制造(上海)有限公司 光阻去除方法
KR20150011239A (ko) * 2013-07-22 2015-01-30 삼성디스플레이 주식회사 감압 건조 장치 및 이를 이용한 표시 장치의 제조방법
US10358721B2 (en) * 2015-10-22 2019-07-23 Asm Ip Holding B.V. Semiconductor manufacturing system including deposition apparatus
JP6439774B2 (ja) * 2016-11-21 2018-12-19 トヨタ自動車株式会社 半導体装置の製造方法
US11264571B2 (en) * 2018-11-09 2022-03-01 Samsung Display Co., Ltd. Bake system and method of fabricating display device using the same
KR20200115884A (ko) * 2019-03-28 2020-10-08 삼성디스플레이 주식회사 감압 건조 장치
KR20220026713A (ko) * 2020-08-26 2022-03-07 주식회사 원익아이피에스 기판처리방법과, 그에 따른 기판처리장치 및 반도체 소자 제조방법
KR20230092188A (ko) * 2021-12-17 2023-06-26 삼성전자주식회사 기판 처리 장치 및 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002010A (en) * 1989-10-18 1991-03-26 Varian Associates, Inc. Vacuum vessel
US5551165A (en) * 1995-04-13 1996-09-03 Texas Instruments Incorporated Enhanced cleansing process for wafer handling implements
US5839455A (en) * 1995-04-13 1998-11-24 Texas Instruments Incorporated Enhanced high pressure cleansing system for wafer handling implements

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Publication number Priority date Publication date Assignee Title
US2856669A (en) * 1954-09-17 1958-10-21 Kalan Michael Periodic oxidation and reduction kiln
US4425075A (en) * 1981-04-20 1984-01-10 The Perkin-Elmer Corporation Wafer aligners
US5120634A (en) * 1982-08-25 1992-06-09 Fujitsu Limited Method for forming patterned resist layer on semiconductor body
JPH0653149A (ja) * 1992-07-31 1994-02-25 Tokyo Electron Ltd 半導体製造装置用シール材
US5340512A (en) * 1993-01-29 1994-08-23 Thomas & Betts Corporation Polymer concrete electrical insulator and method and apparatus for making
US5900103A (en) * 1994-04-20 1999-05-04 Tokyo Electron Limited Plasma treatment method and apparatus
JPH0926176A (ja) * 1995-07-07 1997-01-28 Canon Inc 処理システムとこれを用いたデバイス生産方法
JP3069945B2 (ja) * 1995-07-28 2000-07-24 東京エレクトロン株式会社 処理装置
JPH0950951A (ja) * 1995-08-04 1997-02-18 Nikon Corp リソグラフィ方法およびリソグラフィ装置
JP3218425B2 (ja) * 1996-03-25 2001-10-15 東京エレクトロン株式会社 処理方法及び処理装置
JP3298785B2 (ja) * 1996-03-25 2002-07-08 三菱電機株式会社 半導体製造装置および発塵評価方法
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
EP0827186A3 (en) 1996-08-29 1999-12-15 Tokyo Electron Limited Substrate treatment system
TW464944B (en) * 1997-01-16 2001-11-21 Tokyo Electron Ltd Baking apparatus and baking method
US5972235A (en) * 1997-02-28 1999-10-26 Candescent Technologies Corporation Plasma etching using polycarbonate mask and low pressure-high density plasma
JP3849822B2 (ja) * 1997-04-07 2006-11-22 株式会社ニコン リソク゛ラフィシステム
US6207231B1 (en) * 1997-05-07 2001-03-27 Tokyo Electron Limited Coating film forming method and coating apparatus
US6113698A (en) * 1997-07-10 2000-09-05 Applied Materials, Inc. Degassing method and apparatus
US5999886A (en) 1997-09-05 1999-12-07 Advanced Micro Devices, Inc. Measurement system for detecting chemical species within a semiconductor processing device chamber
JPH11204396A (ja) 1998-01-08 1999-07-30 Canon Inc 半導体製造システムおよびデバイス製造方法
US6106167A (en) * 1998-09-01 2000-08-22 Industrial Technology Research Institute Apparatus for photolithography process with gas-phase pretreatment
JP4054159B2 (ja) * 2000-03-08 2008-02-27 東京エレクトロン株式会社 基板処理方法及びその装置
SG105487A1 (en) * 2000-03-30 2004-08-27 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002010A (en) * 1989-10-18 1991-03-26 Varian Associates, Inc. Vacuum vessel
US5551165A (en) * 1995-04-13 1996-09-03 Texas Instruments Incorporated Enhanced cleansing process for wafer handling implements
US5839455A (en) * 1995-04-13 1998-11-24 Texas Instruments Incorporated Enhanced high pressure cleansing system for wafer handling implements

Also Published As

Publication number Publication date
JP3590328B2 (ja) 2004-11-17
JP2001319867A (ja) 2001-11-16
CN1199238C (zh) 2005-04-27
US20050048421A1 (en) 2005-03-03
CN1323057A (zh) 2001-11-21
TW495815B (en) 2002-07-21
US20020127340A1 (en) 2002-09-12
US6875281B2 (en) 2005-04-05
KR100739969B1 (ko) 2007-07-16
KR20010104661A (ko) 2001-11-26

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