SE8203005L - Elektrofri legeringspletering - Google Patents
Elektrofri legeringspleteringInfo
- Publication number
- SE8203005L SE8203005L SE8203005A SE8203005A SE8203005L SE 8203005 L SE8203005 L SE 8203005L SE 8203005 A SE8203005 A SE 8203005A SE 8203005 A SE8203005 A SE 8203005A SE 8203005 L SE8203005 L SE 8203005L
- Authority
- SE
- Sweden
- Prior art keywords
- alloy plating
- free alloy
- electric free
- electric
- phosphorous
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31533—Of polythioether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31703—Next to cellulosic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31707—Next to natural rubber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18755280A | 1980-09-15 | 1980-09-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE8203005L true SE8203005L (sv) | 1982-05-13 |
Family
ID=22689433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8203005A SE8203005L (sv) | 1980-09-15 | 1982-05-13 | Elektrofri legeringspletering |
Country Status (9)
Country | Link |
---|---|
US (1) | US4482596A (it) |
EP (1) | EP0060294B1 (it) |
JP (1) | JPS57501786A (it) |
DE (1) | DE3152361A1 (it) |
GB (1) | GB2093485B (it) |
IT (1) | IT1139622B (it) |
NL (1) | NL8120359A (it) |
SE (1) | SE8203005L (it) |
WO (1) | WO1982001015A1 (it) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4450191A (en) * | 1982-09-02 | 1984-05-22 | Omi International Corporation | Ammonium ions used as electroless copper plating rate controller |
US4671968A (en) * | 1985-04-01 | 1987-06-09 | Macdermid, Incorporated | Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces |
US5202151A (en) * | 1985-10-14 | 1993-04-13 | Hitachi, Ltd. | Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same |
US5141778A (en) * | 1989-10-12 | 1992-08-25 | Enthone, Incorporated | Method of preparing aluminum memory disks having a smooth metal plated finish |
US5235139A (en) * | 1990-09-12 | 1993-08-10 | Macdermid, Incorprated | Method for fabricating printed circuits |
JPH0762254B2 (ja) * | 1991-09-06 | 1995-07-05 | 住友金属鉱山株式会社 | 無電解銅ニッケル合金めっき方法およびこれに用いるめっき液 |
JP3052515B2 (ja) * | 1991-11-28 | 2000-06-12 | 上村工業株式会社 | 無電解銅めっき浴及びめっき方法 |
JP3116637B2 (ja) * | 1993-03-12 | 2000-12-11 | 株式会社村田製作所 | 無電解めっき液 |
JP3219897B2 (ja) * | 1993-05-07 | 2001-10-15 | イビデン株式会社 | プリント配線板 |
KR960005765A (ko) * | 1994-07-14 | 1996-02-23 | 모리시다 요이치 | 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법 |
WO1996017503A1 (fr) * | 1994-12-01 | 1996-06-06 | Ibiden Co., Ltd. | Carte a circuit imprime multicouche et son procede de production |
JP3392873B2 (ja) | 1994-12-27 | 2003-03-31 | イビデン株式会社 | 無電解めっき用前処理液、無電解めっき浴および無電解めっき方法 |
EP0769572A1 (en) * | 1995-06-06 | 1997-04-23 | ENTHONE-OMI, Inc. | Electroless nickel cobalt phosphorous composition and plating process |
US5626736A (en) | 1996-01-19 | 1997-05-06 | Shipley Company, L.L.C. | Electroplating process |
MY128333A (en) * | 1998-09-14 | 2007-01-31 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
EP1154471B1 (en) * | 1998-09-30 | 2008-07-16 | Ibiden Co., Ltd. | Semiconductor chip with bump contacts |
JP2001020077A (ja) * | 1999-07-07 | 2001-01-23 | Sony Corp | 無電解めっき方法及び無電解めっき液 |
JP2003013247A (ja) * | 2001-04-24 | 2003-01-15 | Murata Mfg Co Ltd | 無電解銅めっき浴及び高周波用電子部品 |
US7306662B2 (en) * | 2006-05-11 | 2007-12-11 | Lam Research Corporation | Plating solution for electroless deposition of copper |
US7297190B1 (en) * | 2006-06-28 | 2007-11-20 | Lam Research Corporation | Plating solutions for electroless deposition of copper |
DE10328857B3 (de) * | 2003-06-26 | 2005-03-17 | OCé PRINTING SYSTEMS GMBH | Hülse zum Transport eines Tonergemischs und Verfahren zum Herstellen einer solchen Hülse |
JP2005022956A (ja) * | 2003-07-02 | 2005-01-27 | Rohm & Haas Electronic Materials Llc | セラミックの金属化 |
EP1696052B1 (en) * | 2005-02-28 | 2010-10-06 | Rohm and Haas Electronic Materials, L.L.C. | Improved fluxing methods |
EP1793013B1 (en) * | 2005-12-05 | 2017-07-19 | Rohm and Haas Electronic Materials LLC | Metallization of dielectrics |
US7752996B2 (en) * | 2006-05-11 | 2010-07-13 | Lam Research Corporation | Apparatus for applying a plating solution for electroless deposition |
IL204422A0 (en) * | 2010-03-11 | 2010-12-30 | J G Systems Inc | METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn |
DE102010012204B4 (de) | 2010-03-19 | 2019-01-24 | MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) | Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten |
JP6099256B2 (ja) | 2012-01-20 | 2017-03-22 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | スズおよびスズ合金のための改良されたフラックス方法 |
US9586381B1 (en) | 2013-10-25 | 2017-03-07 | Steriplate, LLC | Metal plated object with biocidal properties |
JP6466110B2 (ja) * | 2014-09-09 | 2019-02-06 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
CN106688314B (zh) | 2014-09-09 | 2019-08-27 | 住友电气工业株式会社 | 印刷线路板用基材、印刷线路板以及印刷线路板用基材的制造方法 |
US11018272B2 (en) * | 2017-03-23 | 2021-05-25 | Imec Vzw | Methods for forming metal electrodes concurrently on silicon regions of opposite polarity |
EP3617350A1 (en) | 2018-08-31 | 2020-03-04 | Tubacex Upstream Technologies, S.A. | Method for coating a metal part destined to be subjected to high contact pressures and metal part obtained therefrom |
WO2020130101A1 (ja) * | 2018-12-20 | 2020-06-25 | 日立化成株式会社 | 配線基板及びその製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2142672A (en) * | 1936-11-09 | 1939-01-03 | Mallory & Co Inc P R | Copper base alloy |
US2911298A (en) * | 1958-02-11 | 1959-11-03 | Air Preheater | Copper base brazing alloy |
US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
DE1621226A1 (de) * | 1967-04-07 | 1971-04-29 | Dynamit Nobel Ag | Verfahren zur Metallisierung von geformten Gebilden thermoplastischer Kunststoffe |
US3737339A (en) * | 1970-12-18 | 1973-06-05 | Richardson Co | Fabrication of printed circuit boards |
US3726707A (en) * | 1971-10-04 | 1973-04-10 | Gen Motors Corp | Porcelain enameling of steel |
US3832168A (en) * | 1971-12-13 | 1974-08-27 | Shipley Co | Metal finishing alloy of nickel-copperphosphorus |
US3935013A (en) * | 1973-11-12 | 1976-01-27 | Eastman Kodak Company | Electroless deposition of a copper-nickel alloy on an imagewise pattern of physically developable metal nuclei |
DD109669A1 (it) * | 1974-03-15 | 1974-11-12 | ||
JPS5151908A (it) * | 1974-11-01 | 1976-05-07 | Fuji Photo Film Co Ltd | |
US4209331A (en) * | 1978-05-25 | 1980-06-24 | Macdermid Incorporated | Electroless copper composition solution using a hypophosphite reducing agent |
US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
-
1981
- 1981-09-11 JP JP56503144A patent/JPS57501786A/ja active Pending
- 1981-09-11 GB GB8212497A patent/GB2093485B/en not_active Expired
- 1981-09-11 NL NL8120359A patent/NL8120359A/nl unknown
- 1981-09-11 DE DE813152361T patent/DE3152361A1/de not_active Withdrawn
- 1981-09-11 WO PCT/US1981/001222 patent/WO1982001015A1/en active IP Right Grant
- 1981-09-11 EP EP81902671A patent/EP0060294B1/en not_active Expired
- 1981-09-14 IT IT23952/81A patent/IT1139622B/it active
-
1982
- 1982-05-13 SE SE8203005A patent/SE8203005L/xx not_active Application Discontinuation
- 1982-08-25 US US06/411,346 patent/US4482596A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4482596A (en) | 1984-11-13 |
EP0060294A4 (en) | 1982-12-09 |
NL8120359A (it) | 1982-08-02 |
DE3152361A1 (de) | 1983-01-13 |
GB2093485B (en) | 1985-06-12 |
IT8123952A0 (it) | 1981-09-14 |
IT1139622B (it) | 1986-09-24 |
WO1982001015A1 (en) | 1982-04-01 |
EP0060294A1 (en) | 1982-09-22 |
JPS57501786A (it) | 1982-10-07 |
GB2093485A (en) | 1982-09-02 |
EP0060294B1 (en) | 1985-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 8203005-7 |