JPS57501786A - - Google Patents

Info

Publication number
JPS57501786A
JPS57501786A JP56503144A JP50314481A JPS57501786A JP S57501786 A JPS57501786 A JP S57501786A JP 56503144 A JP56503144 A JP 56503144A JP 50314481 A JP50314481 A JP 50314481A JP S57501786 A JPS57501786 A JP S57501786A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56503144A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS57501786A publication Critical patent/JPS57501786A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31533—Of polythioether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31703—Next to cellulosic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31707—Next to natural rubber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
JP56503144A 1980-09-15 1981-09-11 Pending JPS57501786A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18755280A 1980-09-15 1980-09-15

Publications (1)

Publication Number Publication Date
JPS57501786A true JPS57501786A (ja) 1982-10-07

Family

ID=22689433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56503144A Pending JPS57501786A (ja) 1980-09-15 1981-09-11

Country Status (9)

Country Link
US (1) US4482596A (ja)
EP (1) EP0060294B1 (ja)
JP (1) JPS57501786A (ja)
DE (1) DE3152361A1 (ja)
GB (1) GB2093485B (ja)
IT (1) IT1139622B (ja)
NL (1) NL8120359A (ja)
SE (1) SE8203005L (ja)
WO (1) WO1982001015A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565660A (ja) * 1991-09-06 1993-03-19 Sumitomo Metal Mining Co Ltd 無電解銅ニツケル合金めつき方法およびこれに用いるめつき液
US5523174A (en) * 1993-05-07 1996-06-04 Ibiden Co., Ltd. Printed circuit boards
US5827604A (en) * 1994-12-01 1998-10-27 Ibiden Co., Ltd. Multilayer printed circuit board and method of producing the same
JP2016058545A (ja) * 2014-09-09 2016-04-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
US10292265B2 (en) 2014-09-09 2019-05-14 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
WO2020130100A1 (ja) * 2018-12-20 2020-06-25 日立化成株式会社 配線基板及びその製造方法

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
US4671968A (en) * 1985-04-01 1987-06-09 Macdermid, Incorporated Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
US5202151A (en) * 1985-10-14 1993-04-13 Hitachi, Ltd. Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
US5141778A (en) * 1989-10-12 1992-08-25 Enthone, Incorporated Method of preparing aluminum memory disks having a smooth metal plated finish
US5235139A (en) * 1990-09-12 1993-08-10 Macdermid, Incorprated Method for fabricating printed circuits
JP3052515B2 (ja) * 1991-11-28 2000-06-12 上村工業株式会社 無電解銅めっき浴及びめっき方法
JP3116637B2 (ja) * 1993-03-12 2000-12-11 株式会社村田製作所 無電解めっき液
KR960005765A (ko) * 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
WO1996020294A1 (fr) 1994-12-27 1996-07-04 Ibiden Co., Ltd. Solution de pre-traitement pour depot autocatalytique, bain et procede de depot autocatalytique
EP0769572A1 (en) * 1995-06-06 1997-04-23 ENTHONE-OMI, Inc. Electroless nickel cobalt phosphorous composition and plating process
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
MY144573A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
WO2000019517A1 (fr) * 1998-09-30 2000-04-06 Ibiden Co., Ltd. Microplaquette semi-conductrice et procede de fabrication
JP2001020077A (ja) * 1999-07-07 2001-01-23 Sony Corp 無電解めっき方法及び無電解めっき液
JP2003013247A (ja) * 2001-04-24 2003-01-15 Murata Mfg Co Ltd 無電解銅めっき浴及び高周波用電子部品
US7306662B2 (en) * 2006-05-11 2007-12-11 Lam Research Corporation Plating solution for electroless deposition of copper
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
DE10328857B3 (de) * 2003-06-26 2005-03-17 OCé PRINTING SYSTEMS GMBH Hülse zum Transport eines Tonergemischs und Verfahren zum Herstellen einer solchen Hülse
JP2005022956A (ja) * 2003-07-02 2005-01-27 Rohm & Haas Electronic Materials Llc セラミックの金属化
ES2354045T3 (es) * 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc Procedimientos con fundente mejorados.
EP1793013B1 (en) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Metallization of dielectrics
US7752996B2 (en) * 2006-05-11 2010-07-13 Lam Research Corporation Apparatus for applying a plating solution for electroless deposition
IL204422A0 (en) * 2010-03-11 2010-12-30 J G Systems Inc METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn
DE102010012204B4 (de) 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
JP6099256B2 (ja) 2012-01-20 2017-03-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ スズおよびスズ合金のための改良されたフラックス方法
US9586381B1 (en) 2013-10-25 2017-03-07 Steriplate, LLC Metal plated object with biocidal properties
EP3602636B1 (en) * 2017-03-23 2020-11-25 IMEC vzw Method for forming metal electrodes concurrently on silicon regions of opposite polarity
EP3617350A1 (en) 2018-08-31 2020-03-04 Tubacex Upstream Technologies, S.A. Method for coating a metal part destined to be subjected to high contact pressures and metal part obtained therefrom

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2142672A (en) * 1936-11-09 1939-01-03 Mallory & Co Inc P R Copper base alloy
US2911298A (en) * 1958-02-11 1959-11-03 Air Preheater Copper base brazing alloy
US3935013A (en) * 1973-11-12 1976-01-27 Eastman Kodak Company Electroless deposition of a copper-nickel alloy on an imagewise pattern of physically developable metal nuclei

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
DE1621226A1 (de) * 1967-04-07 1971-04-29 Dynamit Nobel Ag Verfahren zur Metallisierung von geformten Gebilden thermoplastischer Kunststoffe
US3737339A (en) * 1970-12-18 1973-06-05 Richardson Co Fabrication of printed circuit boards
US3726707A (en) * 1971-10-04 1973-04-10 Gen Motors Corp Porcelain enameling of steel
US3832168A (en) * 1971-12-13 1974-08-27 Shipley Co Metal finishing alloy of nickel-copperphosphorus
DD109669A1 (ja) * 1974-03-15 1974-11-12
JPS5151908A (ja) * 1974-11-01 1976-05-07 Fuji Photo Film Co Ltd
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2142672A (en) * 1936-11-09 1939-01-03 Mallory & Co Inc P R Copper base alloy
US2911298A (en) * 1958-02-11 1959-11-03 Air Preheater Copper base brazing alloy
US3935013A (en) * 1973-11-12 1976-01-27 Eastman Kodak Company Electroless deposition of a copper-nickel alloy on an imagewise pattern of physically developable metal nuclei

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565660A (ja) * 1991-09-06 1993-03-19 Sumitomo Metal Mining Co Ltd 無電解銅ニツケル合金めつき方法およびこれに用いるめつき液
US5523174A (en) * 1993-05-07 1996-06-04 Ibiden Co., Ltd. Printed circuit boards
US5827604A (en) * 1994-12-01 1998-10-27 Ibiden Co., Ltd. Multilayer printed circuit board and method of producing the same
JP2016058545A (ja) * 2014-09-09 2016-04-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
US10292265B2 (en) 2014-09-09 2019-05-14 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
WO2020130100A1 (ja) * 2018-12-20 2020-06-25 日立化成株式会社 配線基板及びその製造方法
WO2020130101A1 (ja) * 2018-12-20 2020-06-25 日立化成株式会社 配線基板及びその製造方法
JPWO2020130100A1 (ja) * 2018-12-20 2021-11-04 昭和電工マテリアルズ株式会社 配線基板及びその製造方法
JPWO2020130101A1 (ja) * 2018-12-20 2021-11-04 昭和電工マテリアルズ株式会社 配線基板及びその製造方法
US11979990B2 (en) 2018-12-20 2024-05-07 Resonac Corporation Wiring board and method for manufacturing the same
TWI842797B (zh) * 2018-12-20 2024-05-21 日商力森諾科股份有限公司 配線基板及其製造方法
US12004305B2 (en) 2018-12-20 2024-06-04 Resonac Corporation Wiring board and production method for same

Also Published As

Publication number Publication date
IT8123952A0 (it) 1981-09-14
NL8120359A (ja) 1982-08-02
GB2093485A (en) 1982-09-02
IT1139622B (it) 1986-09-24
DE3152361A1 (de) 1983-01-13
EP0060294A1 (en) 1982-09-22
SE8203005L (sv) 1982-05-13
EP0060294A4 (en) 1982-12-09
WO1982001015A1 (en) 1982-04-01
EP0060294B1 (en) 1985-12-27
GB2093485B (en) 1985-06-12
US4482596A (en) 1984-11-13

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