EP0109402A4 - Catalyst solutions for activating non-conductive substrates and electroless plating process. - Google Patents
Catalyst solutions for activating non-conductive substrates and electroless plating process.Info
- Publication number
- EP0109402A4 EP0109402A4 EP19830901290 EP83901290A EP0109402A4 EP 0109402 A4 EP0109402 A4 EP 0109402A4 EP 19830901290 EP19830901290 EP 19830901290 EP 83901290 A EP83901290 A EP 83901290A EP 0109402 A4 EP0109402 A4 EP 0109402A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electroless plating
- plating process
- conductive substrates
- catalyst solutions
- activating non
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38194382A | 1982-05-26 | 1982-05-26 | |
US381943 | 1982-05-26 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0109402A1 EP0109402A1 (en) | 1984-05-30 |
EP0109402A4 true EP0109402A4 (en) | 1984-10-29 |
EP0109402B1 EP0109402B1 (en) | 1988-06-01 |
Family
ID=23506952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19830901290 Expired EP0109402B1 (en) | 1982-05-26 | 1983-03-02 | Catalyst solutions for activating non-conductive substrates and electroless plating process |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0109402B1 (en) |
JP (1) | JPS59500870A (en) |
CA (1) | CA1199754A (en) |
DE (1) | DE3376852D1 (en) |
WO (1) | WO1983004268A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3637130C1 (en) * | 1986-10-31 | 1987-09-17 | Deutsche Automobilgesellsch | Process for the chemical metallization of textile material |
EP0564673B1 (en) * | 1992-04-06 | 1995-10-11 | International Business Machines Corporation | Process for providing catalytically active metal layers of a metal selected from the platinum metals group |
JP4069248B2 (en) * | 2002-12-09 | 2008-04-02 | 大阪市 | Catalyst composition for electroless plating |
CN104593751B (en) * | 2014-12-27 | 2017-10-17 | 广东致卓环保科技有限公司 | Copper surface chemical nickel plating super low concentration ionic palladium activating solution and technique |
KR101681116B1 (en) * | 2016-05-26 | 2016-12-09 | (주)오알켐 | Method for electroless copper plating through-hole of printed circuit board and method for preparing a catalytic solution used in method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
FR2364958A1 (en) * | 1976-09-20 | 1978-04-14 | Kollmorgen Tech Corp | PRODUCTS FOR THE ACTIVATION OF SURFACES FOR THEIR METALLIZATION |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
US3532518A (en) * | 1967-06-28 | 1970-10-06 | Macdermid Inc | Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions |
US3562038A (en) * | 1968-05-15 | 1971-02-09 | Shipley Co | Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited |
US3607352A (en) * | 1968-11-29 | 1971-09-21 | Enthone | Electroless metal plating |
US3672938A (en) * | 1969-02-20 | 1972-06-27 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
US3650913A (en) * | 1969-09-08 | 1972-03-21 | Macdermid Inc | An electroless plating process employing a specially prepared palladium-tin activator solution |
US3767583A (en) * | 1971-08-13 | 1973-10-23 | Enthone | Activator solutions their preparation and use in electroless plating of surfaces |
US3874897A (en) * | 1971-08-13 | 1975-04-01 | Enthone | Activator solutions, their preparation and use in electroless plating of surfaces |
US3904792A (en) * | 1972-02-09 | 1975-09-09 | Shipley Co | Catalyst solution for electroless metal deposition on a substrate |
US3961109A (en) * | 1973-08-01 | 1976-06-01 | Photocircuits Division Of Kollmorgen Corporation | Sensitizers and process for electroless metal deposition |
DE2418654A1 (en) * | 1974-04-18 | 1975-11-06 | Langbein Pfanhauser Werke Ag | PROCESS FOR ELECTRONIC SURFACE METALIZATION OF PLASTIC OBJECTS AND A SUITABLE ACTIVATING BATH TO PERFORM THE PROCESS |
US4008343A (en) * | 1975-08-15 | 1977-02-15 | Bell Telephone Laboratories, Incorporated | Process for electroless plating using colloid sensitization and acid rinse |
DE2659680C2 (en) * | 1976-12-30 | 1985-01-31 | Ibm Deutschland Gmbh, 7000 Stuttgart | Procedure for activating surfaces |
US4073981A (en) * | 1977-03-11 | 1978-02-14 | Western Electric Company, Inc. | Method of selectively depositing metal on a surface |
US4182784A (en) * | 1977-12-16 | 1980-01-08 | Mcgean Chemical Company, Inc. | Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid |
IT1107840B (en) * | 1978-07-25 | 1985-12-02 | Alfachimici Spa | CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION |
US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
-
1983
- 1983-03-02 DE DE8383901290T patent/DE3376852D1/en not_active Expired
- 1983-03-02 EP EP19830901290 patent/EP0109402B1/en not_active Expired
- 1983-03-02 WO PCT/US1983/000302 patent/WO1983004268A1/en active IP Right Grant
- 1983-03-02 JP JP58501376A patent/JPS59500870A/en active Granted
- 1983-05-25 CA CA000428815A patent/CA1199754A/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
FR2364958A1 (en) * | 1976-09-20 | 1978-04-14 | Kollmorgen Tech Corp | PRODUCTS FOR THE ACTIVATION OF SURFACES FOR THEIR METALLIZATION |
Non-Patent Citations (1)
Title |
---|
See also references of WO8304268A1 * |
Also Published As
Publication number | Publication date |
---|---|
JPH0239594B2 (en) | 1990-09-06 |
EP0109402B1 (en) | 1988-06-01 |
EP0109402A1 (en) | 1984-05-30 |
CA1199754A (en) | 1986-01-28 |
WO1983004268A1 (en) | 1983-12-08 |
DE3376852D1 (en) | 1988-07-07 |
JPS59500870A (en) | 1984-05-17 |
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Legal Events
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