DE3474165D1 - Process for activating substrates for electroless plating - Google Patents

Process for activating substrates for electroless plating

Info

Publication number
DE3474165D1
DE3474165D1 DE8484112030T DE3474165T DE3474165D1 DE 3474165 D1 DE3474165 D1 DE 3474165D1 DE 8484112030 T DE8484112030 T DE 8484112030T DE 3474165 T DE3474165 T DE 3474165T DE 3474165 D1 DE3474165 D1 DE 3474165D1
Authority
DE
Germany
Prior art keywords
electroless plating
activating substrates
activating
substrates
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484112030T
Other languages
German (de)
Inventor
Henning Dr Giesecke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Priority to DE8484112030T priority Critical patent/DE3474165D1/en
Application granted granted Critical
Publication of DE3474165D1 publication Critical patent/DE3474165D1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
DE8484112030T 1983-10-18 1984-10-08 Process for activating substrates for electroless plating Expired DE3474165D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8484112030T DE3474165D1 (en) 1983-10-18 1984-10-08 Process for activating substrates for electroless plating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19833337856 DE3337856A1 (en) 1983-10-18 1983-10-18 METHOD FOR ACTIVATING SUBSTRATES FOR CURRENT METALIZATION
DE8484112030T DE3474165D1 (en) 1983-10-18 1984-10-08 Process for activating substrates for electroless plating

Publications (1)

Publication Number Publication Date
DE3474165D1 true DE3474165D1 (en) 1988-10-27

Family

ID=6212130

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19833337856 Withdrawn DE3337856A1 (en) 1983-10-18 1983-10-18 METHOD FOR ACTIVATING SUBSTRATES FOR CURRENT METALIZATION
DE8484112030T Expired DE3474165D1 (en) 1983-10-18 1984-10-08 Process for activating substrates for electroless plating

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19833337856 Withdrawn DE3337856A1 (en) 1983-10-18 1983-10-18 METHOD FOR ACTIVATING SUBSTRATES FOR CURRENT METALIZATION

Country Status (5)

Country Link
US (1) US4568570A (en)
EP (1) EP0142691B1 (en)
JP (1) JPS6096766A (en)
CA (1) CA1232498A (en)
DE (2) DE3337856A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3419755A1 (en) * 1984-05-26 1985-11-28 Bayer Ag, 5090 Leverkusen Chemical silvering bath
EP0175253B1 (en) * 1984-09-19 1989-07-12 Bayer Ag Method of partially activating a substrate surfaces
JPH079069B2 (en) * 1986-03-12 1995-02-01 ブラザー工業株式会社 Method for forming copper coating with excellent mechanical properties
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
DE3840199C2 (en) * 1988-11-29 1994-12-01 Heraeus Noblelight Gmbh Process for structuring metal layers that are catalytically active in electroless metallization by means of UV radiation
NO304746B1 (en) * 1989-05-04 1999-02-08 Ad Tech Holdings Ltd Object that resists microbiological growth consisting of a non-conductive substrate coated with a funnel coated with a method of depositing
JP2524436B2 (en) * 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション Surface treatment method
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
US5733599A (en) * 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
GB9722028D0 (en) * 1997-10-17 1997-12-17 Shipley Company Ll C Plating of polymers
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
GB0118870D0 (en) * 2001-08-02 2001-09-26 Shipley Co Llc A combined adhesion promotion and direct metallization process
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
TWI526573B (en) * 2011-08-17 2016-03-21 羅門哈斯電子材料有限公司 Stable catalysts for electroless metallization

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3880580A (en) * 1971-01-11 1975-04-29 Polymer Research Corp Of Ameri Method of activating polymeric materials
DE2116389C3 (en) * 1971-03-30 1980-04-03 Schering Ag, 1000 Berlin Und 4619 Bergkamen Solution for activating surfaces for metallization
US3959547A (en) * 1971-07-29 1976-05-25 Photocircuits Division Of Kollmorgen Corporation Process for the formation of real images and products produced thereby
JPS4983765A (en) * 1972-12-16 1974-08-12
FR2239539B1 (en) * 1973-08-01 1976-04-30 Rhone Poulenc Textile

Also Published As

Publication number Publication date
JPS6096766A (en) 1985-05-30
DE3337856A1 (en) 1985-04-25
EP0142691B1 (en) 1988-09-21
CA1232498A (en) 1988-02-09
EP0142691A3 (en) 1986-10-29
US4568570A (en) 1986-02-04
EP0142691A2 (en) 1985-05-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee