DE3376852D1 - Catalyst solutions for activating non-conductive substrates and electroless plating process - Google Patents

Catalyst solutions for activating non-conductive substrates and electroless plating process

Info

Publication number
DE3376852D1
DE3376852D1 DE8383901290T DE3376852T DE3376852D1 DE 3376852 D1 DE3376852 D1 DE 3376852D1 DE 8383901290 T DE8383901290 T DE 8383901290T DE 3376852 T DE3376852 T DE 3376852T DE 3376852 D1 DE3376852 D1 DE 3376852D1
Authority
DE
Germany
Prior art keywords
electroless plating
plating process
conductive substrates
catalyst solutions
activating non
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383901290T
Other languages
German (de)
Inventor
Harold L Rhodenizer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Application granted granted Critical
Publication of DE3376852D1 publication Critical patent/DE3376852D1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
DE8383901290T 1982-05-26 1983-03-02 Catalyst solutions for activating non-conductive substrates and electroless plating process Expired DE3376852D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38194382A 1982-05-26 1982-05-26
PCT/US1983/000302 WO1983004268A1 (en) 1982-05-26 1983-03-02 Catalyst solutions for activating non-conductive substrates and electroless plating process

Publications (1)

Publication Number Publication Date
DE3376852D1 true DE3376852D1 (en) 1988-07-07

Family

ID=23506952

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383901290T Expired DE3376852D1 (en) 1982-05-26 1983-03-02 Catalyst solutions for activating non-conductive substrates and electroless plating process

Country Status (5)

Country Link
EP (1) EP0109402B1 (en)
JP (1) JPS59500870A (en)
CA (1) CA1199754A (en)
DE (1) DE3376852D1 (en)
WO (1) WO1983004268A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3637130C1 (en) * 1986-10-31 1987-09-17 Deutsche Automobilgesellsch Process for the chemical metallization of textile material
DE69205415T2 (en) * 1992-04-06 1996-05-30 Ibm Process for the production of catalytically highly effective coatings consisting of a metal from the group of platinum metals.
JP4069248B2 (en) * 2002-12-09 2008-04-02 大阪市 Catalyst composition for electroless plating
CN104593751B (en) * 2014-12-27 2017-10-17 广东致卓环保科技有限公司 Copper surface chemical nickel plating super low concentration ionic palladium activating solution and technique
KR101681116B1 (en) * 2016-05-26 2016-12-09 (주)오알켐 Method for electroless copper plating through-hole of printed circuit board and method for preparing a catalytic solution used in method thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US3562038A (en) * 1968-05-15 1971-02-09 Shipley Co Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited
US3607352A (en) * 1968-11-29 1971-09-21 Enthone Electroless metal plating
US3672938A (en) * 1969-02-20 1972-06-27 Kollmorgen Corp Novel precious metal sensitizing solutions
US3650913A (en) * 1969-09-08 1972-03-21 Macdermid Inc An electroless plating process employing a specially prepared palladium-tin activator solution
US3682671A (en) * 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3767583A (en) * 1971-08-13 1973-10-23 Enthone Activator solutions their preparation and use in electroless plating of surfaces
US3874897A (en) * 1971-08-13 1975-04-01 Enthone Activator solutions, their preparation and use in electroless plating of surfaces
US3904792A (en) * 1972-02-09 1975-09-09 Shipley Co Catalyst solution for electroless metal deposition on a substrate
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
DE2418654A1 (en) * 1974-04-18 1975-11-06 Langbein Pfanhauser Werke Ag PROCESS FOR ELECTRONIC SURFACE METALIZATION OF PLASTIC OBJECTS AND A SUITABLE ACTIVATING BATH TO PERFORM THE PROCESS
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse
ZA774561B (en) * 1976-09-20 1978-06-28 Kollmorgen Tech Corp Preparation of solid precious metal sensitizing compositions
DE2659680C2 (en) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Procedure for activating surfaces
US4073981A (en) * 1977-03-11 1978-02-14 Western Electric Company, Inc. Method of selectively depositing metal on a surface
US4182784A (en) * 1977-12-16 1980-01-08 Mcgean Chemical Company, Inc. Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid
IT1107840B (en) * 1978-07-25 1985-12-02 Alfachimici Spa CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine

Also Published As

Publication number Publication date
EP0109402A1 (en) 1984-05-30
JPS59500870A (en) 1984-05-17
EP0109402B1 (en) 1988-06-01
JPH0239594B2 (en) 1990-09-06
WO1983004268A1 (en) 1983-12-08
CA1199754A (en) 1986-01-28
EP0109402A4 (en) 1984-10-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition