SE522105C2 - Integrerad mikrovåghybridkrets - Google Patents
Integrerad mikrovåghybridkretsInfo
- Publication number
- SE522105C2 SE522105C2 SE9801988A SE9801988A SE522105C2 SE 522105 C2 SE522105 C2 SE 522105C2 SE 9801988 A SE9801988 A SE 9801988A SE 9801988 A SE9801988 A SE 9801988A SE 522105 C2 SE522105 C2 SE 522105C2
- Authority
- SE
- Sweden
- Prior art keywords
- recess
- hybrid circuit
- topological
- metallization
- microwave hybrid
- Prior art date
Links
- 238000001465 metallisation Methods 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 102100035353 Cyclin-dependent kinase 2-associated protein 1 Human genes 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/RU1996/000294 WO1998015981A1 (fr) | 1996-10-10 | 1996-10-10 | Circuit integre hybride et a frequence micro-ondes |
Publications (3)
Publication Number | Publication Date |
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SE9801988D0 SE9801988D0 (sv) | 1998-06-04 |
SE9801988L SE9801988L (sv) | 1998-06-04 |
SE522105C2 true SE522105C2 (sv) | 2004-01-13 |
Family
ID=20130049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9801988A SE522105C2 (sv) | 1996-10-10 | 1998-06-04 | Integrerad mikrovåghybridkrets |
Country Status (5)
Country | Link |
---|---|
US (1) | US6204555B1 (ja) |
JP (1) | JP2000516044A (ja) |
KR (1) | KR19990072029A (ja) |
SE (1) | SE522105C2 (ja) |
WO (1) | WO1998015981A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6259148B1 (en) * | 1998-08-13 | 2001-07-10 | International Business Machines Corporation | Modular high frequency integrated circuit structure |
CN1200822C (zh) * | 2000-02-22 | 2005-05-11 | 东丽工程株式会社 | 非接触式识别信息卡类及其制造方法 |
EP1280101B1 (en) * | 2000-04-04 | 2005-05-18 | Toray Engineering Co., Ltd. | Method of manufacturing cof package |
DE10122221A1 (de) * | 2001-05-08 | 2002-11-21 | Danfoss Silicon Power Gmbh | Leistungselektronikmodul mit einer Bodenplatte und darauf gelötetem Substrat |
US6707150B1 (en) * | 2002-10-24 | 2004-03-16 | Galaxy Pcb Co., Ltd. | Package support member with high heat-removing ability |
JP3844467B2 (ja) | 2003-01-08 | 2006-11-15 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
JP2004361308A (ja) * | 2003-06-06 | 2004-12-24 | Fuji Electric Device Technology Co Ltd | 物理量検出装置および物理量検出手段格納ケース |
DE102004016940B4 (de) * | 2004-04-06 | 2019-08-08 | Continental Automotive Gmbh | Schaltungsträger für einen Halbleiterchip und ein Bauelement mit einem Halbleiterchip |
US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US9704809B2 (en) * | 2013-03-05 | 2017-07-11 | Maxim Integrated Products, Inc. | Fan-out and heterogeneous packaging of electronic components |
CN105140189B (zh) * | 2015-07-08 | 2019-04-26 | 华进半导体封装先导技术研发中心有限公司 | 板级扇出型芯片封装器件及其制备方法 |
CN113359248B (zh) * | 2021-06-02 | 2022-11-15 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52127177A (en) * | 1976-04-19 | 1977-10-25 | Toshiba Corp | Semiconductor device |
JPS59182545A (ja) * | 1983-03-31 | 1984-10-17 | Nec Home Electronics Ltd | 混成集積回路 |
JPS63271944A (ja) * | 1987-04-28 | 1988-11-09 | Sumitomo Electric Ind Ltd | 半導体装置 |
JP3190057B2 (ja) * | 1990-07-02 | 2001-07-16 | 株式会社東芝 | 複合集積回路装置 |
RU2025822C1 (ru) * | 1991-03-19 | 1994-12-30 | Государственное научно-производственное предприятие "Исток" | Гибридная интегральная схема |
RU2004036C1 (ru) * | 1991-04-25 | 1993-11-30 | Виктор Анатольевич Иовдальский | Гибридна интегральна СВЧ- и КВЧ-схема |
DE4222474A1 (de) * | 1992-07-09 | 1994-01-13 | Bosch Gmbh Robert | Montageeinheit für Mehrlagenhybrid mit Leistungsbauelementen |
JPH06132417A (ja) * | 1992-10-20 | 1994-05-13 | Fujitsu Ltd | 超高周波装置 |
JPH0810739B2 (ja) * | 1993-02-08 | 1996-01-31 | 日本電気株式会社 | ハイブリッドic |
JP3292798B2 (ja) * | 1995-10-04 | 2002-06-17 | 三菱電機株式会社 | 半導体装置 |
-
1996
- 1996-10-10 WO PCT/RU1996/000294 patent/WO1998015981A1/ru not_active Application Discontinuation
- 1996-10-10 US US09/077,761 patent/US6204555B1/en not_active Expired - Lifetime
- 1996-10-10 JP JP51743398A patent/JP2000516044A/ja active Pending
- 1996-10-10 KR KR1019980704323A patent/KR19990072029A/ko not_active Application Discontinuation
-
1998
- 1998-06-04 SE SE9801988A patent/SE522105C2/sv not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19990072029A (ko) | 1999-09-27 |
JP2000516044A (ja) | 2000-11-28 |
SE9801988D0 (sv) | 1998-06-04 |
WO1998015981A1 (fr) | 1998-04-16 |
SE9801988L (sv) | 1998-06-04 |
US6204555B1 (en) | 2001-03-20 |
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