SE518428C2 - Anpassat ledande skikt - Google Patents

Anpassat ledande skikt

Info

Publication number
SE518428C2
SE518428C2 SE9801502A SE9801502A SE518428C2 SE 518428 C2 SE518428 C2 SE 518428C2 SE 9801502 A SE9801502 A SE 9801502A SE 9801502 A SE9801502 A SE 9801502A SE 518428 C2 SE518428 C2 SE 518428C2
Authority
SE
Sweden
Prior art keywords
electrically conductive
housing
conductive paths
conductive unit
conductive layer
Prior art date
Application number
SE9801502A
Other languages
English (en)
Swedish (sv)
Other versions
SE9801502L (sv
SE9801502D0 (sv
Inventor
Per Aa V Holmberg
Lars Eriksson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9801502A priority Critical patent/SE518428C2/sv
Publication of SE9801502D0 publication Critical patent/SE9801502D0/xx
Priority to MYPI99001432A priority patent/MY123448A/en
Priority to US09/299,435 priority patent/US6294730B1/en
Priority to DE69924481T priority patent/DE69924481T2/de
Priority to PCT/SE1999/000685 priority patent/WO1999056517A1/en
Priority to AT99947066T priority patent/ATE292366T1/de
Priority to BR9909927-6A priority patent/BR9909927A/pt
Priority to EP99947066A priority patent/EP1075782B1/en
Priority to KR1020007011950A priority patent/KR100571017B1/ko
Priority to JP2000546565A priority patent/JP2002513218A/ja
Priority to EEP200000618A priority patent/EE03945B1/xx
Priority to AU43017/99A priority patent/AU757193B2/en
Priority to CN99805567A priority patent/CN1298627A/zh
Publication of SE9801502L publication Critical patent/SE9801502L/xx
Publication of SE518428C2 publication Critical patent/SE518428C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Discharging, Photosensitive Material Shape In Electrophotography (AREA)
  • Wrappers (AREA)
  • Magnetic Heads (AREA)
  • Ropes Or Cables (AREA)
  • Surgical Instruments (AREA)
  • Laminated Bodies (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Insulated Conductors (AREA)
SE9801502A 1998-04-27 1998-04-27 Anpassat ledande skikt SE518428C2 (sv)

Priority Applications (13)

Application Number Priority Date Filing Date Title
SE9801502A SE518428C2 (sv) 1998-04-27 1998-04-27 Anpassat ledande skikt
MYPI99001432A MY123448A (en) 1998-04-27 1999-04-14 Adapted electrically conductive layer.
US09/299,435 US6294730B1 (en) 1998-04-27 1999-04-26 Adapted electrically conductive layer
CN99805567A CN1298627A (zh) 1998-04-27 1999-04-27 自适应导电层
BR9909927-6A BR9909927A (pt) 1998-04-27 1999-04-27 Dispositivo para criar uma blindagem contra radiação eletromagnética e/ou para drenagem de correntes elétricas
PCT/SE1999/000685 WO1999056517A1 (en) 1998-04-27 1999-04-27 Adapted electrically conductive layer
AT99947066T ATE292366T1 (de) 1998-04-27 1999-04-27 Elektrisch angepasste schicht
DE69924481T DE69924481T2 (de) 1998-04-27 1999-04-27 Elektrisch angepasste schicht
EP99947066A EP1075782B1 (en) 1998-04-27 1999-04-27 Adapted electrically conductive layer
KR1020007011950A KR100571017B1 (ko) 1998-04-27 1999-04-27 적응 전기 도전 층
JP2000546565A JP2002513218A (ja) 1998-04-27 1999-04-27 適合した導電層
EEP200000618A EE03945B1 (et) 1998-04-27 1999-04-27 Elektriliselt juhtiv kiht elektriliste seadmete varjestamiseks
AU43017/99A AU757193B2 (en) 1998-04-27 1999-04-27 Adapted electrically conductive layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9801502A SE518428C2 (sv) 1998-04-27 1998-04-27 Anpassat ledande skikt

Publications (3)

Publication Number Publication Date
SE9801502D0 SE9801502D0 (sv) 1998-04-27
SE9801502L SE9801502L (sv) 1999-10-28
SE518428C2 true SE518428C2 (sv) 2002-10-08

Family

ID=20411130

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9801502A SE518428C2 (sv) 1998-04-27 1998-04-27 Anpassat ledande skikt

Country Status (13)

Country Link
US (1) US6294730B1 (ko)
EP (1) EP1075782B1 (ko)
JP (1) JP2002513218A (ko)
KR (1) KR100571017B1 (ko)
CN (1) CN1298627A (ko)
AT (1) ATE292366T1 (ko)
AU (1) AU757193B2 (ko)
BR (1) BR9909927A (ko)
DE (1) DE69924481T2 (ko)
EE (1) EE03945B1 (ko)
MY (1) MY123448A (ko)
SE (1) SE518428C2 (ko)
WO (1) WO1999056517A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003068521A1 (en) * 2002-02-14 2003-08-21 Lars Eriksson Method of tampoprinting an electrical leading circuit
KR100685440B1 (ko) * 2004-12-01 2007-02-23 다산건설(주) 거푸집용 지지구
US7928326B2 (en) * 2009-02-27 2011-04-19 Hewlett-Packard Development Company, L.P. Thermoformed EMI shield

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0214232Y2 (ko) * 1985-07-31 1990-04-18
JPS62216396A (ja) * 1986-03-18 1987-09-22 富士通株式会社 電子機器用の導体パタ−ン付き樹脂製筐体の製造方法
JPH0177003U (ko) * 1987-11-10 1989-05-24
US5206796A (en) * 1991-03-11 1993-04-27 John Fluke Mfg. Co. Inc. Electronic instrument with emi/esd shielding system
US5360941A (en) * 1991-10-28 1994-11-01 Cubic Automatic Revenue Collection Group Magnetically permeable electrostatic shield
JPH05299931A (ja) * 1992-04-03 1993-11-12 Nec Corp 電波吸収体
US5334800A (en) 1993-07-21 1994-08-02 Parlex Corporation Flexible shielded circuit board
US5596170A (en) * 1993-11-09 1997-01-21 International Business Machines Corporation Flexible dome electrical contact
JP2776753B2 (ja) 1994-11-24 1998-07-16 埼玉日本電気株式会社 プラスチックシールド筐体
US5767789A (en) * 1995-08-31 1998-06-16 International Business Machines Corporation Communication channels through electrically conducting enclosures via frequency selective windows
JPH09162589A (ja) * 1995-12-07 1997-06-20 Takenaka Komuten Co Ltd 電磁波吸収体及び電磁波吸収方法
WO1997024459A1 (en) * 1995-12-29 1997-07-10 Phanos Technologoes, Inc. Method for reducing unwanted cellular adhesions
DE69733342D1 (de) 1996-03-13 2005-06-30 Ericsson Telefon Ab L M Herstellungsverfahren einer metallischen beschichtung auf der bauteiloberflache zur abschirmung gegen elektromagnetische strahlung
JP3278348B2 (ja) * 1996-05-01 2002-04-30 三菱電機株式会社 マイクロ波半導体装置
JPH1027983A (ja) * 1996-07-11 1998-01-27 Toa Seimitsu:Kk 電磁波シールド機能を有する樹脂製筐体及びその製造方法

Also Published As

Publication number Publication date
EE200000618A (et) 2002-04-15
EE03945B1 (et) 2002-12-16
DE69924481T2 (de) 2005-09-22
EP1075782A1 (en) 2001-02-14
CN1298627A (zh) 2001-06-06
AU757193B2 (en) 2003-02-06
DE69924481D1 (de) 2005-05-04
KR20010043070A (ko) 2001-05-25
SE9801502L (sv) 1999-10-28
ATE292366T1 (de) 2005-04-15
SE9801502D0 (sv) 1998-04-27
MY123448A (en) 2006-05-31
BR9909927A (pt) 2000-12-26
KR100571017B1 (ko) 2006-04-13
AU4301799A (en) 1999-11-16
WO1999056517A1 (en) 1999-11-04
EP1075782B1 (en) 2005-03-30
JP2002513218A (ja) 2002-05-08
US6294730B1 (en) 2001-09-25

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Legal Events

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