ES2154593A1 - Diseño de patterns de componentes electronicos sobre una capa de cobre de 400 micras en los circuitos impresos. - Google Patents

Diseño de patterns de componentes electronicos sobre una capa de cobre de 400 micras en los circuitos impresos.

Info

Publication number
ES2154593A1
ES2154593A1 ES009901256A ES9901256A ES2154593A1 ES 2154593 A1 ES2154593 A1 ES 2154593A1 ES 009901256 A ES009901256 A ES 009901256A ES 9901256 A ES9901256 A ES 9901256A ES 2154593 A1 ES2154593 A1 ES 2154593A1
Authority
ES
Spain
Prior art keywords
width
electronic components
copper layer
printed circuits
pattern design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES009901256A
Other languages
English (en)
Other versions
ES2154593B1 (es
Inventor
Ferrer Joan Maria Boixadera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to ES009901256A priority Critical patent/ES2154593B1/es
Priority to PCT/ES2000/000151 priority patent/WO2000076280A1/es
Priority to EP00920757A priority patent/EP1137330A1/en
Priority to JP2001501616A priority patent/JP2003501821A/ja
Publication of ES2154593A1 publication Critical patent/ES2154593A1/es
Application granted granted Critical
Publication of ES2154593B1 publication Critical patent/ES2154593B1/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

"Disposición de componentes electrónicos sobre una capa de cobre de 400 micras en circuitos impresos". Para asegurar la fabricabilidad de circuitos electrónicos con sus pistas conductoras de más de 105 micras de espesor de cobre, se ha diseñado una serie de nuevas figuras para cada uno de los componentes a los cuales se ha añadido una superficie de cobre dedicada a soportar las gotas de adhesivo y de esta forma salvar la diferencia de altura que representa el cobre cuando es superior a 105 micras, es decir, si la anchura de las zonas del componente electrónicos destinadas a solidarizarse con la capa conductora del circuito impreso eran de anchura a{sub,1}, lo que es el objeto de la presente solicitud han sido diseñadas de una anchura a{sub,2}, ya que de esta forma es posible el depositar en esta franja de anchura a{sub,2} el correspondiente material adhesivo.
ES009901256A 1999-06-08 1999-06-08 Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos. Expired - Fee Related ES2154593B1 (es)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ES009901256A ES2154593B1 (es) 1999-06-08 1999-06-08 Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.
PCT/ES2000/000151 WO2000076280A1 (es) 1999-06-08 2000-04-26 Diseño de patterns de componentes electronicos sobre una capa de cobre de 400 micras en los circuitos impresos
EP00920757A EP1137330A1 (en) 1999-06-08 2000-04-26 Pattern design for electronic components on a 400 micron copper layer in printed circuits
JP2001501616A JP2003501821A (ja) 1999-06-08 2000-04-26 プリント回路の４００ミクロン層上の電子部品パターンの設計

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES009901256A ES2154593B1 (es) 1999-06-08 1999-06-08 Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.

Publications (2)

Publication Number Publication Date
ES2154593A1 true ES2154593A1 (es) 2001-04-01
ES2154593B1 ES2154593B1 (es) 2001-10-16

Family

ID=8308746

Family Applications (1)

Application Number Title Priority Date Filing Date
ES009901256A Expired - Fee Related ES2154593B1 (es) 1999-06-08 1999-06-08 Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.

Country Status (4)

Country Link
EP (1) EP1137330A1 (es)
JP (1) JP2003501821A (es)
ES (1) ES2154593B1 (es)
WO (1) WO2000076280A1 (es)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992009400A1 (en) * 1990-12-03 1992-06-11 Motorola, Inc. Tacking agent
WO1995019691A1 (en) * 1994-01-14 1995-07-20 Xicon Ab A circuit board with specifically designed connection terminals
EP0802706A1 (en) * 1996-04-18 1997-10-22 Lucent Technologies Inc. Uni-pad for suface mount component package
WO1998028787A1 (en) * 1996-12-20 1998-07-02 Telefonaktiebolaget Lm Ericsson (Publ) Method and device for connecting electrical components to circuit boards

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3328342C3 (de) * 1983-07-01 1999-03-18 Bosch Gmbh Robert Verfahren zum Einlöten von Chipbauelementen auf Leiterplatten
JPS62134194A (ja) * 1985-12-04 1987-06-17 Mitsubishi Electric Corp クリ−ムはんだ
US5296649A (en) * 1991-03-26 1994-03-22 The Furukawa Electric Co., Ltd. Solder-coated printed circuit board and method of manufacturing the same
DE4126913A1 (de) * 1991-08-14 1993-02-18 Siemens Ag Verfahren zum beloten und montieren von leiterplatten mit bauelementen
JPH05175280A (ja) * 1991-12-20 1993-07-13 Rohm Co Ltd 半導体装置の実装構造および実装方法
JPH1041694A (ja) * 1996-07-25 1998-02-13 Sharp Corp 半導体素子の基板実装構造及びその実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992009400A1 (en) * 1990-12-03 1992-06-11 Motorola, Inc. Tacking agent
WO1995019691A1 (en) * 1994-01-14 1995-07-20 Xicon Ab A circuit board with specifically designed connection terminals
EP0802706A1 (en) * 1996-04-18 1997-10-22 Lucent Technologies Inc. Uni-pad for suface mount component package
WO1998028787A1 (en) * 1996-12-20 1998-07-02 Telefonaktiebolaget Lm Ericsson (Publ) Method and device for connecting electrical components to circuit boards

Also Published As

Publication number Publication date
JP2003501821A (ja) 2003-01-14
WO2000076280A1 (es) 2000-12-14
ES2154593B1 (es) 2001-10-16
EP1137330A1 (en) 2001-09-26

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