FR2775554B1 - Blindage d'une carte electronique a circuit imprime montee sur un substrat metallique - Google Patents
Blindage d'une carte electronique a circuit imprime montee sur un substrat metalliqueInfo
- Publication number
- FR2775554B1 FR2775554B1 FR9802478A FR9802478A FR2775554B1 FR 2775554 B1 FR2775554 B1 FR 2775554B1 FR 9802478 A FR9802478 A FR 9802478A FR 9802478 A FR9802478 A FR 9802478A FR 2775554 B1 FR2775554 B1 FR 2775554B1
- Authority
- FR
- France
- Prior art keywords
- shielding
- printed circuit
- metal substrate
- electronic board
- circuit mounted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9802478A FR2775554B1 (fr) | 1998-03-02 | 1998-03-02 | Blindage d'une carte electronique a circuit imprime montee sur un substrat metallique |
DE19980533T DE19980533B4 (de) | 1998-03-02 | 1999-03-02 | Abschirmung einer auf einem metallischen Substrat angebrachten elektronischen Karte mit gedruckter Schaltung |
PCT/FR1999/000462 WO1999045755A1 (fr) | 1998-03-02 | 1999-03-02 | Blindage d'une carte electronique a circuit imprime montee sur un substrat metallique |
JP54432299A JP4160130B2 (ja) | 1998-03-02 | 1999-03-02 | 遮蔽アセンブリ及びそれを製造する方法 |
US09/423,075 US6925708B1 (en) | 1998-03-02 | 1999-05-02 | Method of shielding a printed circuit electronics card mounted on a metal substrate |
US11/080,276 US7219420B2 (en) | 1998-03-02 | 2005-03-15 | Screening of a printed-circuit electronics card mounted on a metal substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9802478A FR2775554B1 (fr) | 1998-03-02 | 1998-03-02 | Blindage d'une carte electronique a circuit imprime montee sur un substrat metallique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2775554A1 FR2775554A1 (fr) | 1999-09-03 |
FR2775554B1 true FR2775554B1 (fr) | 2000-05-19 |
Family
ID=9523516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9802478A Expired - Lifetime FR2775554B1 (fr) | 1998-03-02 | 1998-03-02 | Blindage d'une carte electronique a circuit imprime montee sur un substrat metallique |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4160130B2 (fr) |
DE (1) | DE19980533B4 (fr) |
FR (1) | FR2775554B1 (fr) |
WO (1) | WO1999045755A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1445999B1 (fr) * | 2003-02-07 | 2007-10-03 | Sony Ericsson Mobile Communications AB | Procédé pour munir un circuit imprimé d'un boîtier de blindage et le circuit imprimé pour ce |
FR2870060B1 (fr) * | 2004-05-06 | 2008-09-05 | Valeo Electronique Sys Liaison | Vehicule a fonctions electroniques protegees contre les hyperfrequences |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6449300A (en) * | 1987-08-19 | 1989-02-23 | Mitsubishi Electric Corp | Coupling of shielding case |
US5559676A (en) * | 1995-06-07 | 1996-09-24 | Gessaman; Martin J. | Self-contained drop-in component |
DE19602637C1 (de) * | 1996-01-25 | 1997-07-24 | Siemens Ag | Steuergerät, insbesondere für ein Kraftfahrzeug |
JP2806897B2 (ja) * | 1996-07-05 | 1998-09-30 | 埼玉日本電気株式会社 | 多層プリント基板のシールド構造 |
-
1998
- 1998-03-02 FR FR9802478A patent/FR2775554B1/fr not_active Expired - Lifetime
-
1999
- 1999-03-02 WO PCT/FR1999/000462 patent/WO1999045755A1/fr active Application Filing
- 1999-03-02 JP JP54432299A patent/JP4160130B2/ja not_active Expired - Lifetime
- 1999-03-02 DE DE19980533T patent/DE19980533B4/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE19980533B4 (de) | 2008-11-20 |
JP4160130B2 (ja) | 2008-10-01 |
JP2001523399A (ja) | 2001-11-20 |
WO1999045755A1 (fr) | 1999-09-10 |
FR2775554A1 (fr) | 1999-09-03 |
DE19980533T1 (de) | 2000-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 19 |
|
PLFP | Fee payment |
Year of fee payment: 20 |