SE518428C2 - Anpassat ledande skikt - Google Patents
Anpassat ledande skiktInfo
- Publication number
- SE518428C2 SE518428C2 SE9801502A SE9801502A SE518428C2 SE 518428 C2 SE518428 C2 SE 518428C2 SE 9801502 A SE9801502 A SE 9801502A SE 9801502 A SE9801502 A SE 9801502A SE 518428 C2 SE518428 C2 SE 518428C2
- Authority
- SE
- Sweden
- Prior art keywords
- electrically conductive
- housing
- conductive paths
- conductive unit
- conductive layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Photoreceptors In Electrophotography (AREA)
- Discharging, Photosensitive Material Shape In Electrophotography (AREA)
- Conductive Materials (AREA)
- Magnetic Heads (AREA)
- Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Wrappers (AREA)
- Surgical Instruments (AREA)
- Ropes Or Cables (AREA)
- Details Of Measuring And Other Instruments (AREA)
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9801502A SE518428C2 (sv) | 1998-04-27 | 1998-04-27 | Anpassat ledande skikt |
MYPI99001432A MY123448A (en) | 1998-04-27 | 1999-04-14 | Adapted electrically conductive layer. |
US09/299,435 US6294730B1 (en) | 1998-04-27 | 1999-04-26 | Adapted electrically conductive layer |
AT99947066T ATE292366T1 (de) | 1998-04-27 | 1999-04-27 | Elektrisch angepasste schicht |
KR1020007011950A KR100571017B1 (ko) | 1998-04-27 | 1999-04-27 | 적응 전기 도전 층 |
DE69924481T DE69924481T2 (de) | 1998-04-27 | 1999-04-27 | Elektrisch angepasste schicht |
EP99947066A EP1075782B1 (en) | 1998-04-27 | 1999-04-27 | Adapted electrically conductive layer |
EEP200000618A EE03945B1 (et) | 1998-04-27 | 1999-04-27 | Elektriliselt juhtiv kiht elektriliste seadmete varjestamiseks |
CN99805567A CN1298627A (zh) | 1998-04-27 | 1999-04-27 | 自适应导电层 |
PCT/SE1999/000685 WO1999056517A1 (en) | 1998-04-27 | 1999-04-27 | Adapted electrically conductive layer |
JP2000546565A JP2002513218A (ja) | 1998-04-27 | 1999-04-27 | 適合した導電層 |
AU43017/99A AU757193B2 (en) | 1998-04-27 | 1999-04-27 | Adapted electrically conductive layer |
BR9909927-6A BR9909927A (pt) | 1998-04-27 | 1999-04-27 | Dispositivo para criar uma blindagem contra radiação eletromagnética e/ou para drenagem de correntes elétricas |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9801502A SE518428C2 (sv) | 1998-04-27 | 1998-04-27 | Anpassat ledande skikt |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9801502D0 SE9801502D0 (sv) | 1998-04-27 |
SE9801502L SE9801502L (sv) | 1999-10-28 |
SE518428C2 true SE518428C2 (sv) | 2002-10-08 |
Family
ID=20411130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9801502A SE518428C2 (sv) | 1998-04-27 | 1998-04-27 | Anpassat ledande skikt |
Country Status (13)
Country | Link |
---|---|
US (1) | US6294730B1 (et) |
EP (1) | EP1075782B1 (et) |
JP (1) | JP2002513218A (et) |
KR (1) | KR100571017B1 (et) |
CN (1) | CN1298627A (et) |
AT (1) | ATE292366T1 (et) |
AU (1) | AU757193B2 (et) |
BR (1) | BR9909927A (et) |
DE (1) | DE69924481T2 (et) |
EE (1) | EE03945B1 (et) |
MY (1) | MY123448A (et) |
SE (1) | SE518428C2 (et) |
WO (1) | WO1999056517A1 (et) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003215976A1 (en) * | 2002-02-14 | 2003-09-04 | Lars Eriksson | Method of tampoprinting an electrical leading circuit |
KR100685440B1 (ko) * | 2004-12-01 | 2007-02-23 | 다산건설(주) | 거푸집용 지지구 |
US7928326B2 (en) * | 2009-02-27 | 2011-04-19 | Hewlett-Packard Development Company, L.P. | Thermoformed EMI shield |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0214232Y2 (et) * | 1985-07-31 | 1990-04-18 | ||
JPS62216396A (ja) * | 1986-03-18 | 1987-09-22 | 富士通株式会社 | 電子機器用の導体パタ−ン付き樹脂製筐体の製造方法 |
JPH0177003U (et) * | 1987-11-10 | 1989-05-24 | ||
US5206796A (en) * | 1991-03-11 | 1993-04-27 | John Fluke Mfg. Co. Inc. | Electronic instrument with emi/esd shielding system |
US5360941A (en) * | 1991-10-28 | 1994-11-01 | Cubic Automatic Revenue Collection Group | Magnetically permeable electrostatic shield |
JPH05299931A (ja) * | 1992-04-03 | 1993-11-12 | Nec Corp | 電波吸収体 |
US5334800A (en) | 1993-07-21 | 1994-08-02 | Parlex Corporation | Flexible shielded circuit board |
US5596170A (en) * | 1993-11-09 | 1997-01-21 | International Business Machines Corporation | Flexible dome electrical contact |
JP2776753B2 (ja) | 1994-11-24 | 1998-07-16 | 埼玉日本電気株式会社 | プラスチックシールド筐体 |
US5767789A (en) * | 1995-08-31 | 1998-06-16 | International Business Machines Corporation | Communication channels through electrically conducting enclosures via frequency selective windows |
JPH09162589A (ja) * | 1995-12-07 | 1997-06-20 | Takenaka Komuten Co Ltd | 電磁波吸収体及び電磁波吸収方法 |
WO1997024459A1 (en) * | 1995-12-29 | 1997-07-10 | Phanos Technologoes, Inc. | Method for reducing unwanted cellular adhesions |
HUP9901571A3 (en) | 1996-03-13 | 1999-11-29 | Ericsson Telefon Ab L M | Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
JP3278348B2 (ja) * | 1996-05-01 | 2002-04-30 | 三菱電機株式会社 | マイクロ波半導体装置 |
JPH1027983A (ja) * | 1996-07-11 | 1998-01-27 | Toa Seimitsu:Kk | 電磁波シールド機能を有する樹脂製筐体及びその製造方法 |
-
1998
- 1998-04-27 SE SE9801502A patent/SE518428C2/sv not_active IP Right Cessation
-
1999
- 1999-04-14 MY MYPI99001432A patent/MY123448A/en unknown
- 1999-04-26 US US09/299,435 patent/US6294730B1/en not_active Expired - Lifetime
- 1999-04-27 EP EP99947066A patent/EP1075782B1/en not_active Expired - Lifetime
- 1999-04-27 WO PCT/SE1999/000685 patent/WO1999056517A1/en active IP Right Grant
- 1999-04-27 JP JP2000546565A patent/JP2002513218A/ja active Pending
- 1999-04-27 DE DE69924481T patent/DE69924481T2/de not_active Expired - Fee Related
- 1999-04-27 AT AT99947066T patent/ATE292366T1/de not_active IP Right Cessation
- 1999-04-27 EE EEP200000618A patent/EE03945B1/et not_active IP Right Cessation
- 1999-04-27 CN CN99805567A patent/CN1298627A/zh active Pending
- 1999-04-27 KR KR1020007011950A patent/KR100571017B1/ko not_active IP Right Cessation
- 1999-04-27 AU AU43017/99A patent/AU757193B2/en not_active Ceased
- 1999-04-27 BR BR9909927-6A patent/BR9909927A/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20010043070A (ko) | 2001-05-25 |
BR9909927A (pt) | 2000-12-26 |
EE03945B1 (et) | 2002-12-16 |
EP1075782A1 (en) | 2001-02-14 |
CN1298627A (zh) | 2001-06-06 |
AU757193B2 (en) | 2003-02-06 |
DE69924481T2 (de) | 2005-09-22 |
SE9801502L (sv) | 1999-10-28 |
MY123448A (en) | 2006-05-31 |
SE9801502D0 (sv) | 1998-04-27 |
EP1075782B1 (en) | 2005-03-30 |
AU4301799A (en) | 1999-11-16 |
JP2002513218A (ja) | 2002-05-08 |
US6294730B1 (en) | 2001-09-25 |
WO1999056517A1 (en) | 1999-11-04 |
ATE292366T1 (de) | 2005-04-15 |
KR100571017B1 (ko) | 2006-04-13 |
DE69924481D1 (de) | 2005-05-04 |
EE200000618A (et) | 2002-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |