KR960032506A - 도전성 페이스트 - Google Patents

도전성 페이스트 Download PDF

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KR960032506A
KR960032506A KR1019960003353A KR19960003353A KR960032506A KR 960032506 A KR960032506 A KR 960032506A KR 1019960003353 A KR1019960003353 A KR 1019960003353A KR 19960003353 A KR19960003353 A KR 19960003353A KR 960032506 A KR960032506 A KR 960032506A
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South Korea
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noble metal
metal powder
powder
weight
mixture
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KR1019960003353A
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KR0183329B1 (ko
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게이조우 히라이
히로시 와다
아끼히로 사사끼
히사시 가가
쥬니찌 기꾸찌
소조 야마나
히데지 구와지마
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단노 다께시
히다찌가세이고오교 가부시끼가이샤
가와따 히로시
자이단호징 테크노포리스 하꼬다떼기쥬쓰신꼬교까이
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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Abstract

비귀금속 분말 총 표면적의 평균 50% 이상에, 각각의 비귀금속 분말이 비금속 분말의 중량을 기준으로 평균 2~30중량%양의 귀금속으로 덮혀 있는 편평한 비귀금속 분말을 함유하고, 각각의 비귀금속 분말과 귀금속 덮개층 사이에 비귀금속과 귀금속의 혼합물 층을 삽입한 도전성 복합 금속 분말은, 결합체와 혼합한뒤 도전성 페이스트를 제공하는데 적합하며, 상기 페이스트는 우수한 도전성을 가지며, 이동을 방지한다.

Description

도전성 페이스트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 도전성 페이스트가 프린트되어 관통공이 채워져 있는 구리로 피복된 페이퍼 베이스 페놀 수지 라미네이트(paper base phenolic resin copper-clad laminate)의 평면도.
제2도는 도전성 페이스트가 구리로 피복된 페이퍼 베이스 페놀 수지 라미네이트 상에 프린트 되어 있는 전자파 차폐 재료의 평면도.

Claims (16)

  1. 비귀금속 분말 표면적인 50% 이상이 비귀금속 분말의 중량을 기준으로 평균 2~30중량%의 귀금속으로 덮혀 있는 편평한 비귀금속 분말을 함유하고, 비귀금속 분말과 귀금속 덮혀진 층 사이에 비귀금속과 귀금속의 혼합물 층을 삽입하는 것을 특징으로 하는 도전성 복합 금속 분말.
  2. 제1항에 있어서, 상기 비귀금속과 귀금속의 혼합물 층의 두께가 귀금속으로 덮혀진 층 두께의 1/2~1/50인 것을 특징으로 하는 도전성 복합 금속 분말.
  3. 제1항에 있어서, 상기 비귀금속과 귀금속의 혼합물 층이 80~20원자%의 귀금속 및 20~80원자%의 비귀금속을 함유하는 것을 특징으로 하는 도전성 복합 금속 분말.
  4. 제1항에 있어서, 상기 귀금속으로 덮혀진 층의 두께가 0.01~0.2㎛인 것을 특징으로 하는 도전성 복합 금속 분말.
  5. 제1항에 있어서, 상기 비귀금속 분말의 주측/두께 비가 2~30인 것을 특징으로 하는 도전성 복합 금속 분말.
  6. 비귀금속 분말의 각 표면을 비귀금속 분말의 중량을 기준으로 2~30중량%의 귀금속으로 덮는 단계와, 덮혀진 분말에 기계적 에너지를 부가하여 덮혀진 분말을 편평한 형태로 변형시키고, 비귀금속 분말과 귀금속으로 덮혀진 층 사이에 비귀금속과 귀금속의 혼합물 층을 형성시키는 단계로 구성되는 것을 특징으로 하는 도전성 복합 금속 분말 제조 방법.
  7. 비귀금속 분말의 각 표면을 비귀금속 분말의 중량을 기준으로 2~30중량%의 귀금속으로 덮고, 비귀금속 분말과 귀금속으로 덮혀진 층 사이에 비귀금속과 귀금속의 혼합물을 층을 형성시키느 동안, 비귀금속 분말과 귀금속 분말의 혼합물에 기계적 에너지를 부가하여 혼합물을 편평한 형태로 변형시키는 것을 특징으로 하는 도전성 복합 금속 분말의 제조 방법.
  8. 비귀금속 분말의 50% 이상의 표면적이 비귀금속 분말의 중량을 기준으로 2~30중량%의 금속으로 덮혀있는 편평한 비귀금속을 함유하고, 비귀금속 분말과 귀금속으로 덮혀진 층 사이에 비귀금속과 귀금속의 혼합물층을 삽입한 도전성 복합 금속 분말과, 결합제를 함유하는 것을 특징으로 하는 도전성 페이스트.
  9. 제8항에 있어서, 상기 비귀금속과 귀금속의 혼합물 층의 두께가 귀금속으로 덮혀진 층 두께의 1/2~1/50인 것을 특징으로 하는 도전성 페이스트.
  10. 제8항에 있어서, 상기 비귀금속과 귀금속의 혼합물 층이 80~20원자%의 귀금속 및 20~80원자%의 비귀금속을 함유하는 것을 특징으로 하는 도전성 페이스트.
  11. 제8항에 있어서, 상기 귀금속으로 덮혀진 층의 두께가 0.01~0.02㎛인 것을 특징으로 하는 도전성 페이스트.
  12. 제8항에 있어서, 비귀금속 분말의 주축/두께 비율이 2~30인 것을 특징으로 하는 도전성 페이스트.
  13. 비귀금속 분말의 각 표면에 비귀금속 분말의 중량을 기준으로 평균 2~30중량%의 귀금속으로 덮는 단계와, 비귀금속 분말과 귀금속 분말의 혼합물에 기계적 에너지를 부가하여 혼합물을 편평한 형태로 변형시키고, 비귀금속 분말과 귀금속으로 덮혀진 층 사이에 비귀금속과 귀금속 혼합물 층을 형성시키는 단게와, 처리된 분말에 결합제를 첨가한 뒤, 혼합하여 균일한 페이스트를 형성시키는 단계로 구성되는 것을 특징으로 하는 도전성 페이스트 제조방법.
  14. 비귀금속 분말의 중량을 기준으로 평균 2~30중량%의 귀금속으로 비귀금속 분말의 각 표면을 덮고, 비귀금속 분말과 귀금속으로 덮혀진 층 사이에 비귀금속과 귀금속 혼합물 층을 형성시키는 동안, 비귀금속 분말과 귀금속 분말의 혼합물에 기계적 에너지를 부가하여 혼합물을 편평한 형태로 변형시키고, 처리된 분말에 결합체를 첨가한 뒤, 혼합하여 균일한 페이스트를 형성시키는 것을 특징으로 하는 도전성 페이스트 제조 방법.
  15. 절연 기판, 제8항의 도전성 페이스트를 사용하여 절연 기판상에 형성된 회로 도체 및 회로 도체상에 설치된 전자부품으로 구성되는 것을 특징으로 하는 전기 회로 장치.
  16. 프린팅 또는 포팅(potting)에 의하여 제8항의 도전성 페이스트를 절연 기판상에 피복하여 회로 도체를 형성시키는 단계와, 회로 도체상에 전자부품을 설치하는 단계로 구성되는 것을 특징으로 하는 전기 회로 장치 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960003353A 1992-02-13 1996-02-12 도전성 페이스트 KR0183329B1 (ko)

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