SE516533C2 - Mönsterkort med metallpluggar för bortledning av värme - Google Patents

Mönsterkort med metallpluggar för bortledning av värme

Info

Publication number
SE516533C2
SE516533C2 SE9902496A SE9902496A SE516533C2 SE 516533 C2 SE516533 C2 SE 516533C2 SE 9902496 A SE9902496 A SE 9902496A SE 9902496 A SE9902496 A SE 9902496A SE 516533 C2 SE516533 C2 SE 516533C2
Authority
SE
Sweden
Prior art keywords
printed circuit
circuit board
board
holes
plugs
Prior art date
Application number
SE9902496A
Other languages
English (en)
Swedish (sv)
Other versions
SE9902496D0 (sv
SE9902496L (sv
Inventor
Lars-Anders Olofsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9902496A priority Critical patent/SE516533C2/sv
Publication of SE9902496D0 publication Critical patent/SE9902496D0/xx
Priority to TW088115998A priority patent/TW484343B/zh
Priority to DE60034948T priority patent/DE60034948T2/de
Priority to AT00946643T priority patent/ATE363195T1/de
Priority to PCT/SE2000/001349 priority patent/WO2001001738A1/en
Priority to JP2001506274A priority patent/JP2003503831A/ja
Priority to AU60368/00A priority patent/AU6036800A/en
Priority to CNB008097801A priority patent/CN1171512C/zh
Priority to EP00946643A priority patent/EP1197128B1/en
Priority to CA002378252A priority patent/CA2378252A1/en
Priority to KR1020017016109A priority patent/KR20020013920A/ko
Publication of SE9902496L publication Critical patent/SE9902496L/xx
Publication of SE516533C2 publication Critical patent/SE516533C2/sv
Priority to HK03100178.1A priority patent/HK1048047A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cookers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
SE9902496A 1999-06-30 1999-06-30 Mönsterkort med metallpluggar för bortledning av värme SE516533C2 (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE9902496A SE516533C2 (sv) 1999-06-30 1999-06-30 Mönsterkort med metallpluggar för bortledning av värme
TW088115998A TW484343B (en) 1999-06-30 1999-09-16 A printed circuit board
KR1020017016109A KR20020013920A (ko) 1999-06-30 2000-06-26 인쇄 회로 기판
AU60368/00A AU6036800A (en) 1999-06-30 2000-06-26 A printed circuit board
AT00946643T ATE363195T1 (de) 1999-06-30 2000-06-26 Wärmedurchgangslöcher in einer leiterplatte, um wärme von oberflächenmontierten elektronischen bauteilen weg durch die leiterplatte zu leiten
PCT/SE2000/001349 WO2001001738A1 (en) 1999-06-30 2000-06-26 A printed circuit board
JP2001506274A JP2003503831A (ja) 1999-06-30 2000-06-26 プリント回路基板
DE60034948T DE60034948T2 (de) 1999-06-30 2000-06-26 Wärmedurchgangslöcher in einer Leiterplatte, um Wärme von oberflächenmontierten elektronischen Bauteilen weg durch die Leiterplatte zu leiten
CNB008097801A CN1171512C (zh) 1999-06-30 2000-06-26 印刷电路板
EP00946643A EP1197128B1 (en) 1999-06-30 2000-06-26 Thermal vias arranged in a printed circuit board to conduct heat away from surface mounted components through the board
CA002378252A CA2378252A1 (en) 1999-06-30 2000-06-26 A printed circuit board
HK03100178.1A HK1048047A1 (zh) 1999-06-30 2003-01-07 印刷電路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9902496A SE516533C2 (sv) 1999-06-30 1999-06-30 Mönsterkort med metallpluggar för bortledning av värme

Publications (3)

Publication Number Publication Date
SE9902496D0 SE9902496D0 (sv) 1999-06-30
SE9902496L SE9902496L (sv) 2000-12-31
SE516533C2 true SE516533C2 (sv) 2002-01-29

Family

ID=20416315

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9902496A SE516533C2 (sv) 1999-06-30 1999-06-30 Mönsterkort med metallpluggar för bortledning av värme

Country Status (12)

Country Link
EP (1) EP1197128B1 (ko)
JP (1) JP2003503831A (ko)
KR (1) KR20020013920A (ko)
CN (1) CN1171512C (ko)
AT (1) ATE363195T1 (ko)
AU (1) AU6036800A (ko)
CA (1) CA2378252A1 (ko)
DE (1) DE60034948T2 (ko)
HK (1) HK1048047A1 (ko)
SE (1) SE516533C2 (ko)
TW (1) TW484343B (ko)
WO (1) WO2001001738A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE519344C2 (sv) 2001-04-27 2003-02-18 Ericsson Telefon Ab L M Medel och förfarande för att modifiera kretskort
EP1276357A3 (de) * 2001-07-13 2004-08-25 Behr-Hella Thermocontrol GmbH Leiterplatte für elektrische Schaltungen
DE20301773U1 (de) * 2003-02-05 2003-04-17 Kostal Leopold Gmbh & Co Kg Elektrische Einrichtung
EP1480269A1 (en) 2003-05-13 2004-11-24 Agilent Technologies Inc Printed Circuit Board with improved cooling of electrical component
US7286325B2 (en) * 2004-02-26 2007-10-23 Sae Magnetics (H.K.) Ltd Method and apparatus for connecting metal structures on opposing sides of a circuit
DE202004006870U1 (de) * 2004-04-29 2005-06-09 Fuba Printed Circuits Gmbh Leiterplatte
FR2885480A1 (fr) * 2005-05-04 2006-11-10 Bree Beauce Realisations Et Et Circuit imprime double-face a dissipation thermique
CN101784160B (zh) * 2010-01-22 2011-11-09 东莞生益电子有限公司 压入式高导热pcb板的制作方法
CN101841975B (zh) * 2010-05-12 2012-07-04 珠海市荣盈电子科技有限公司 热压法制作高导热性电路板的方法及高导热性电路板
DE102011102484B4 (de) * 2011-05-24 2020-03-05 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung
CN109600907A (zh) * 2017-09-30 2019-04-09 惠州威健电路板实业有限公司 防爆喷锡板及其制作方法
CN110996521A (zh) * 2019-12-20 2020-04-10 江苏弘信华印电路科技有限公司 一种摄像头部镂空的钢片压合方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1953992A1 (de) * 1969-10-27 1971-05-13 Transformatoren Union Ag Wicklungspressvorrichtung
DE3619226A1 (de) * 1985-12-10 1987-06-11 Robotron Veb K Verdrahtungstraeger
DE4220966C2 (de) * 1992-06-25 1995-12-21 Siemens Ag Verfahren zum Herstellen einer Trägerplatte für elektrische Bauteile
US5617294A (en) * 1995-09-29 1997-04-01 Intel Corporation Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board

Also Published As

Publication number Publication date
WO2001001738A1 (en) 2001-01-04
KR20020013920A (ko) 2002-02-21
SE9902496D0 (sv) 1999-06-30
CN1171512C (zh) 2004-10-13
JP2003503831A (ja) 2003-01-28
CN1359606A (zh) 2002-07-17
HK1048047A1 (zh) 2003-03-14
EP1197128B1 (en) 2007-05-23
EP1197128A1 (en) 2002-04-17
DE60034948T2 (de) 2008-02-07
AU6036800A (en) 2001-01-31
TW484343B (en) 2002-04-21
SE9902496L (sv) 2000-12-31
ATE363195T1 (de) 2007-06-15
CA2378252A1 (en) 2001-01-04
DE60034948D1 (de) 2007-07-05

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