RU2717381C2 - Светоизлучающее устройство, интегрированное светоизлучающее устройство и светоизлучающий модуль - Google Patents

Светоизлучающее устройство, интегрированное светоизлучающее устройство и светоизлучающий модуль Download PDF

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RU2717381C2
RU2717381C2 RU2018112372A RU2018112372A RU2717381C2 RU 2717381 C2 RU2717381 C2 RU 2717381C2 RU 2018112372 A RU2018112372 A RU 2018112372A RU 2018112372 A RU2018112372 A RU 2018112372A RU 2717381 C2 RU2717381 C2 RU 2717381C2
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light
light emitting
emitting device
radiation
emitting element
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RU2018112372A
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English (en)
Russian (ru)
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RU2018112372A3 (enrdf_load_stackoverflow
RU2018112372A (ru
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Мотоказу ЯМАДА
Юити ЯМАДА
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Нития Корпорейшн
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Priority claimed from PCT/JP2016/004528 external-priority patent/WO2017061127A1/en
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Publication of RU2018112372A3 publication Critical patent/RU2018112372A3/ru
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Planar Illumination Modules (AREA)
RU2018112372A 2015-10-08 2016-10-07 Светоизлучающее устройство, интегрированное светоизлучающее устройство и светоизлучающий модуль RU2717381C2 (ru)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015-200445 2015-10-08
JP2015200445 2015-10-08
JP2016197968A JP6506899B2 (ja) 2015-10-08 2016-10-06 発光装置、集積型発光装置および発光モジュール
JP2016-197968 2016-10-06
PCT/JP2016/004528 WO2017061127A1 (en) 2015-10-08 2016-10-07 Light-emitting device, integrated light-emitting device, and light-emitting module

Publications (3)

Publication Number Publication Date
RU2018112372A RU2018112372A (ru) 2019-10-07
RU2018112372A3 RU2018112372A3 (enrdf_load_stackoverflow) 2019-12-05
RU2717381C2 true RU2717381C2 (ru) 2020-03-23

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JP (3) JP6506899B2 (enrdf_load_stackoverflow)
KR (1) KR102632427B1 (enrdf_load_stackoverflow)
CN (2) CN106571421B (enrdf_load_stackoverflow)
AU (1) AU2016238924B2 (enrdf_load_stackoverflow)
BR (1) BR112018006931B1 (enrdf_load_stackoverflow)
CA (1) CA2999401A1 (enrdf_load_stackoverflow)
RU (1) RU2717381C2 (enrdf_load_stackoverflow)
TW (2) TWI799754B (enrdf_load_stackoverflow)

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CN116884966A (zh) * 2017-07-21 2023-10-13 日亚化学工业株式会社 背光装置以及光源
CN109390327B (zh) * 2017-08-02 2020-10-30 吴裕朝 发光装置、应用其的背光模组、光源模组及其制备方法
JP7522529B2 (ja) * 2017-08-31 2024-07-25 日亜化学工業株式会社 発光装置
KR102631105B1 (ko) 2017-08-31 2024-01-30 니치아 카가쿠 고교 가부시키가이샤 발광 장치
JP7082272B2 (ja) * 2017-09-27 2022-06-08 日亜化学工業株式会社 発光装置
JP7174216B2 (ja) * 2017-10-23 2022-11-17 日亜化学工業株式会社 発光モジュールおよび集積型発光モジュール
CN114464718B (zh) * 2017-10-26 2025-07-11 晶元光电股份有限公司 发光装置
JP6870592B2 (ja) 2017-11-24 2021-05-12 豊田合成株式会社 発光装置
JP7177331B2 (ja) 2018-06-29 2022-11-24 日亜化学工業株式会社 発光装置
CN111649261B (zh) * 2019-03-04 2023-01-10 群创光电股份有限公司 电子装置
JP7180552B2 (ja) * 2019-06-21 2022-11-30 豊田合成株式会社 発光装置の製造管理方法
JP7226131B2 (ja) 2019-06-25 2023-02-21 豊田合成株式会社 発光装置及びその製造方法
JP2021009806A (ja) * 2019-07-01 2021-01-28 大日本印刷株式会社 バックライトモジュール、および表示装置
CN112485803A (zh) * 2019-08-21 2021-03-12 Oppo广东移动通信有限公司 激光发射装置及制作方法、飞行时间测量装置
JP7508278B2 (ja) * 2020-06-04 2024-07-01 キヤノン株式会社 露光装置、露光方法、及び物品の製造方法
WO2022085668A1 (ja) * 2020-10-20 2022-04-28 大日本印刷株式会社 面発光装置、表示装置、面発光装置用封止部材シートおよび面発光装置の製造方法
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RU2001119633A (ru) * 2001-07-17 2003-07-10 Ооо Нпц Оэп "Оптэл" Светодиод
JP2006049857A (ja) * 2004-06-29 2006-02-16 Fuji Photo Film Co Ltd 光源、および光源の作製方法、並びにカラー感熱プリンタ
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BR112018006931A2 (pt) 2018-10-16
RU2018112372A3 (enrdf_load_stackoverflow) 2019-12-05
BR112018006931B1 (pt) 2022-11-29
TW202112181A (zh) 2021-03-16
CN106571421A (zh) 2017-04-19
CA2999401A1 (en) 2017-04-13
KR102632427B1 (ko) 2024-01-31
CN113437202A (zh) 2021-09-24
JP2017073549A (ja) 2017-04-13
JP7175099B2 (ja) 2022-11-18
AU2016238924A1 (en) 2017-04-27
TWI712181B (zh) 2020-12-01
AU2016238924B2 (en) 2021-06-10
TW201724554A (zh) 2017-07-01
JP6506899B2 (ja) 2019-04-24
TWI799754B (zh) 2023-04-21
KR20170044032A (ko) 2017-04-24
RU2018112372A (ru) 2019-10-07
JP2021170688A (ja) 2021-10-28
CN106571421B (zh) 2021-07-09
JP7252483B2 (ja) 2023-04-05
JP2018139303A (ja) 2018-09-06

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