RU2618731C2 - Емкостной преобразователь, полученный микрообработкой, и способ его изготовления - Google Patents

Емкостной преобразователь, полученный микрообработкой, и способ его изготовления Download PDF

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Publication number
RU2618731C2
RU2618731C2 RU2014134810A RU2014134810A RU2618731C2 RU 2618731 C2 RU2618731 C2 RU 2618731C2 RU 2014134810 A RU2014134810 A RU 2014134810A RU 2014134810 A RU2014134810 A RU 2014134810A RU 2618731 C2 RU2618731 C2 RU 2618731C2
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Russia
Prior art keywords
layer
dielectric
dielectric film
cmut
deposited
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RU2014134810A
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English (en)
Russian (ru)
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RU2014134810A (ru
Inventor
Петер ДИРКСЕН
Рюдигер МАУКЗОК
Корай КАРАКАЯ
Йохан Хендрик КЛОТВИЙК
Боут МАРСЕЛИС
Марсель МЮЛДЕР
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Конинклейке Филипс Н.В.
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Publication of RU2014134810A publication Critical patent/RU2014134810A/ru
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00373—Selective deposition, e.g. printing or microcontact printing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/06—Influence generators
    • H02N1/08—Influence generators with conductive charge carrier, i.e. capacitor machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
RU2014134810A 2012-01-27 2013-01-18 Емкостной преобразователь, полученный микрообработкой, и способ его изготовления RU2618731C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261591344P 2012-01-27 2012-01-27
US61/591,344 2012-01-27
PCT/IB2013/050481 WO2013111040A1 (en) 2012-01-27 2013-01-18 Capacitive micro-machined transducer and method of manufacturing the same

Publications (2)

Publication Number Publication Date
RU2014134810A RU2014134810A (ru) 2016-03-20
RU2618731C2 true RU2618731C2 (ru) 2017-05-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
RU2014134810A RU2618731C2 (ru) 2012-01-27 2013-01-18 Емкостной преобразователь, полученный микрообработкой, и способ его изготовления

Country Status (8)

Country Link
US (2) US9231496B2 (enExample)
EP (1) EP2806982B1 (enExample)
JP (1) JP6209537B2 (enExample)
CN (1) CN104066521B (enExample)
BR (1) BR112014018083A8 (enExample)
MX (1) MX2014008859A (enExample)
RU (1) RU2618731C2 (enExample)
WO (1) WO2013111040A1 (enExample)

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CN105592940B (zh) * 2013-09-24 2018-09-25 皇家飞利浦有限公司 Cmut装置制造方法、cmut装置和设备
JP6381195B2 (ja) 2013-10-22 2018-08-29 キヤノン株式会社 静電容量型トランスデューサ及びその作製方法
US11766237B2 (en) 2015-07-02 2023-09-26 Philips Image Guided Therapy Corporation Multi-mode capacitive micromachined ultrasound transducer and associated devices, systems, and methods for multiple different intravascular sensing capabilities
CN107799386B (zh) 2016-09-06 2020-04-28 中芯国际集成电路制造(北京)有限公司 半导体装置及其制造方法
CN107092880B (zh) * 2017-04-14 2023-06-20 杭州士兰微电子股份有限公司 超声波指纹传感器及其制造方法
TW202000137A (zh) * 2018-05-03 2020-01-01 美商蝴蝶網路公司 互補式金屬氧化物半導體感測器上超音波換能器的壓力口
JP7688911B2 (ja) 2018-11-16 2025-06-05 ヴァーモン エス.エー. 容量性微細加工超音波トランスデューサ及びその製造方法
CN114302774B (zh) * 2019-08-30 2023-05-23 维蒙股份公司 Cmut换能器
US11988640B2 (en) * 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
CN113873404A (zh) * 2021-09-29 2021-12-31 瑞声声学科技(深圳)有限公司 一种振膜及其制备方法、mems麦克风
TWI819775B (zh) * 2021-10-13 2023-10-21 台亞半導體股份有限公司 矽化物電容式微機電結構及其製造方法
CN118341664A (zh) * 2024-05-17 2024-07-16 京东方科技集团股份有限公司 一种集成器件和制备方法
CN118771300A (zh) * 2024-06-28 2024-10-15 重庆大学 一种具有高k绝缘层增强结构的cmut及其工艺

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US20100202254A1 (en) * 2007-07-31 2010-08-12 Koninklijke Philips Electronics N.V. Cmuts with a high-k dielectric
US20110095645A1 (en) * 2007-09-25 2011-04-28 Canon Kabushiki Kaisha Electromechanical transducer and manufacturing method therefor
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Also Published As

Publication number Publication date
EP2806982A1 (en) 2014-12-03
US10008958B2 (en) 2018-06-26
JP6209537B2 (ja) 2017-10-04
WO2013111040A1 (en) 2013-08-01
US20140375168A1 (en) 2014-12-25
JP2015508625A (ja) 2015-03-19
EP2806982B1 (en) 2020-03-11
US20150162852A1 (en) 2015-06-11
BR112014018083A8 (pt) 2017-07-11
CN104066521A (zh) 2014-09-24
CN104066521B (zh) 2017-07-11
RU2014134810A (ru) 2016-03-20
US9231496B2 (en) 2016-01-05
MX2014008859A (es) 2014-10-06
BR112014018083A2 (enExample) 2017-06-20

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MM4A The patent is invalid due to non-payment of fees

Effective date: 20190119