CN104066521B - 电容式微机械换能器及制造所述电容式微机械换能器的方法 - Google Patents

电容式微机械换能器及制造所述电容式微机械换能器的方法 Download PDF

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Publication number
CN104066521B
CN104066521B CN201380006576.2A CN201380006576A CN104066521B CN 104066521 B CN104066521 B CN 104066521B CN 201380006576 A CN201380006576 A CN 201380006576A CN 104066521 B CN104066521 B CN 104066521B
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CN
China
Prior art keywords
layer
dielectric
dielectric film
cmut
transducer
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CN201380006576.2A
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English (en)
Chinese (zh)
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CN104066521A (zh
Inventor
P·迪克森
R·毛奇斯措克
K·卡拉卡亚
J·H·克鲁特威克
B·马赛利斯
M·米尔德
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Koninklijke Philips NV
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Koninklijke Philips NV
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00373—Selective deposition, e.g. printing or microcontact printing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/06—Influence generators
    • H02N1/08—Influence generators with conductive charge carrier, i.e. capacitor machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
CN201380006576.2A 2012-01-27 2013-01-18 电容式微机械换能器及制造所述电容式微机械换能器的方法 Active CN104066521B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261591344P 2012-01-27 2012-01-27
US61/591,344 2012-01-27
PCT/IB2013/050481 WO2013111040A1 (en) 2012-01-27 2013-01-18 Capacitive micro-machined transducer and method of manufacturing the same

Publications (2)

Publication Number Publication Date
CN104066521A CN104066521A (zh) 2014-09-24
CN104066521B true CN104066521B (zh) 2017-07-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380006576.2A Active CN104066521B (zh) 2012-01-27 2013-01-18 电容式微机械换能器及制造所述电容式微机械换能器的方法

Country Status (8)

Country Link
US (2) US9231496B2 (enExample)
EP (1) EP2806982B1 (enExample)
JP (1) JP6209537B2 (enExample)
CN (1) CN104066521B (enExample)
BR (1) BR112014018083A8 (enExample)
MX (1) MX2014008859A (enExample)
RU (1) RU2618731C2 (enExample)
WO (1) WO2013111040A1 (enExample)

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JP6069798B2 (ja) * 2011-12-20 2017-02-01 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波トランスデューサデバイス及びこれを製造する方法
MX2014008859A (es) * 2012-01-27 2014-10-06 Koninkl Philips Nv Transductor micro-mecanizado capacitivo y metodo para la fabricacion del mismo.
US10293375B2 (en) * 2013-09-24 2019-05-21 Koninklijke Philips N.V. CMUT device manufacturing method, CMUT device and apparatus
JP6381195B2 (ja) 2013-10-22 2018-08-29 キヤノン株式会社 静電容量型トランスデューサ及びその作製方法
CN107735032B (zh) 2015-07-02 2021-09-21 皇家飞利浦有限公司 多模式电容式微加工超声换能器以及相关联的设备、系统和方法
CN107799386B (zh) * 2016-09-06 2020-04-28 中芯国际集成电路制造(北京)有限公司 半导体装置及其制造方法
CN107092880B (zh) * 2017-04-14 2023-06-20 杭州士兰微电子股份有限公司 超声波指纹传感器及其制造方法
TW202000137A (zh) * 2018-05-03 2020-01-01 美商蝴蝶網路公司 互補式金屬氧化物半導體感測器上超音波換能器的壓力口
CN113316486B (zh) 2018-11-16 2022-10-18 维蒙股份公司 电容式微机械超声换能器及其制造方法
US12427544B2 (en) * 2019-08-30 2025-09-30 Vermon Sa CMUT transducer
US11988640B2 (en) * 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
CN113873404A (zh) * 2021-09-29 2021-12-31 瑞声声学科技(深圳)有限公司 一种振膜及其制备方法、mems麦克风
TWI819775B (zh) * 2021-10-13 2023-10-21 台亞半導體股份有限公司 矽化物電容式微機電結構及其製造方法

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US20110163630A1 (en) * 2008-09-16 2011-07-07 Koninklijke Philips Electronics N.V. Capacitive micromachine ultrasound transducer

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Also Published As

Publication number Publication date
JP2015508625A (ja) 2015-03-19
US10008958B2 (en) 2018-06-26
WO2013111040A1 (en) 2013-08-01
MX2014008859A (es) 2014-10-06
US20150162852A1 (en) 2015-06-11
CN104066521A (zh) 2014-09-24
BR112014018083A8 (pt) 2017-07-11
US9231496B2 (en) 2016-01-05
JP6209537B2 (ja) 2017-10-04
RU2014134810A (ru) 2016-03-20
EP2806982A1 (en) 2014-12-03
US20140375168A1 (en) 2014-12-25
RU2618731C2 (ru) 2017-05-11
BR112014018083A2 (enExample) 2017-06-20
EP2806982B1 (en) 2020-03-11

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