RU2328840C2 - Способ монтажа электронного компонента на подложке - Google Patents

Способ монтажа электронного компонента на подложке Download PDF

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Publication number
RU2328840C2
RU2328840C2 RU2005134859/09A RU2005134859A RU2328840C2 RU 2328840 C2 RU2328840 C2 RU 2328840C2 RU 2005134859/09 A RU2005134859/09 A RU 2005134859/09A RU 2005134859 A RU2005134859 A RU 2005134859A RU 2328840 C2 RU2328840 C2 RU 2328840C2
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RU
Russia
Prior art keywords
substrate
component
conductive
microcircuit
electronic component
Prior art date
Application number
RU2005134859/09A
Other languages
English (en)
Russian (ru)
Other versions
RU2005134859A (ru
Inventor
Франсуа ДРОЗ (CH)
Франсуа ДРОЗ
Original Assignee
Награид Са
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Награид Са filed Critical Награид Са
Publication of RU2005134859A publication Critical patent/RU2005134859A/ru
Application granted granted Critical
Publication of RU2328840C2 publication Critical patent/RU2328840C2/ru

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Die Bonding (AREA)
RU2005134859/09A 2003-05-13 2004-05-12 Способ монтажа электронного компонента на подложке RU2328840C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH20030832/03 2003-05-13
CH8322003 2003-05-13

Publications (2)

Publication Number Publication Date
RU2005134859A RU2005134859A (ru) 2006-07-27
RU2328840C2 true RU2328840C2 (ru) 2008-07-10

Family

ID=33438095

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2005134859/09A RU2328840C2 (ru) 2003-05-13 2004-05-12 Способ монтажа электронного компонента на подложке

Country Status (18)

Country Link
US (1) US8127997B2 (https=)
EP (1) EP1623369B1 (https=)
JP (1) JP5042627B2 (https=)
KR (1) KR101158128B1 (https=)
CN (1) CN100468450C (https=)
AT (1) ATE353457T1 (https=)
AU (1) AU2004239501B2 (https=)
BR (1) BRPI0411163A (https=)
CA (1) CA2524673C (https=)
DE (1) DE602004004647T2 (https=)
ES (1) ES2281802T3 (https=)
MX (1) MXPA05011963A (https=)
MY (1) MY148205A (https=)
PL (1) PL1623369T3 (https=)
PT (1) PT1623369E (https=)
RU (1) RU2328840C2 (https=)
TW (1) TWI331497B (https=)
WO (1) WO2004102469A1 (https=)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
SI2036007T1 (sl) 2006-06-19 2013-05-31 Nagraid S.A. Postopek izdelave kartic, ki vsaka obsega elektronski modul, in vmesni izdelki
ES2537081T3 (es) 2006-06-19 2015-06-02 Nagravision S.A. Procedimiento de fabricación de tarjetas que comprenden por lo menos un módulo electrónico, conjunto que interviene en este procedimiento y producto intermedio
US7967214B2 (en) 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
WO2008082617A2 (en) 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
PL2132684T3 (pl) 2007-02-09 2013-03-29 Nagravision Sa Sposób produkcji kart elektronicznych zawierających co najmniej jeden nadrukowany wzór
RU2438209C1 (ru) * 2010-10-14 2011-12-27 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Электронный модуль
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9202162B2 (en) * 2012-11-09 2015-12-01 Maxim Integrated Products, Inc. Embedded radio frequency identification (RFID) package
EP3259708A1 (fr) 2015-02-20 2017-12-27 Nid Sa Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2133522C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Способ изготовления и контроля электронных компонентов

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FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
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RU2133522C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Способ изготовления и контроля электронных компонентов

Also Published As

Publication number Publication date
JP5042627B2 (ja) 2012-10-03
US20060226237A1 (en) 2006-10-12
EP1623369A1 (fr) 2006-02-08
US8127997B2 (en) 2012-03-06
KR101158128B1 (ko) 2012-06-19
MXPA05011963A (es) 2006-02-02
MY148205A (en) 2013-03-15
WO2004102469A1 (fr) 2004-11-25
BRPI0411163A (pt) 2006-07-11
AU2004239501A1 (en) 2004-11-25
CN1788275A (zh) 2006-06-14
KR20060017779A (ko) 2006-02-27
CN100468450C (zh) 2009-03-11
PT1623369E (pt) 2007-05-31
CA2524673C (en) 2012-01-24
DE602004004647D1 (de) 2007-03-22
PL1623369T3 (pl) 2007-07-31
ES2281802T3 (es) 2007-10-01
AU2004239501B2 (en) 2010-06-17
TWI331497B (en) 2010-10-01
CA2524673A1 (en) 2004-11-25
JP2007511811A (ja) 2007-05-10
TW200501859A (en) 2005-01-01
DE602004004647T2 (de) 2007-11-08
ATE353457T1 (de) 2007-02-15
EP1623369B1 (fr) 2007-02-07
RU2005134859A (ru) 2006-07-27

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MM4A The patent is invalid due to non-payment of fees

Effective date: 20150513