KR101158128B1 - 기판 상에 전자 부품을 장착하는 방법 - Google Patents

기판 상에 전자 부품을 장착하는 방법 Download PDF

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Publication number
KR101158128B1
KR101158128B1 KR1020057021437A KR20057021437A KR101158128B1 KR 101158128 B1 KR101158128 B1 KR 101158128B1 KR 1020057021437 A KR1020057021437 A KR 1020057021437A KR 20057021437 A KR20057021437 A KR 20057021437A KR 101158128 B1 KR101158128 B1 KR 101158128B1
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KR
South Korea
Prior art keywords
substrate
electronic component
chip
conductive
track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057021437A
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English (en)
Korean (ko)
Other versions
KR20060017779A (ko
Inventor
프란코이스 드로즈
Original Assignee
나그라아이디 에스.에이.
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Publication date
Application filed by 나그라아이디 에스.에이. filed Critical 나그라아이디 에스.에이.
Publication of KR20060017779A publication Critical patent/KR20060017779A/ko
Application granted granted Critical
Publication of KR101158128B1 publication Critical patent/KR101158128B1/ko
Assigned to 나그라비젼 에스에이 reassignment 나그라비젼 에스에이 권리의 전부이전등록 Assignors: 나그라아이디 에스.에이.
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Die Bonding (AREA)
KR1020057021437A 2003-05-13 2004-05-12 기판 상에 전자 부품을 장착하는 방법 Expired - Fee Related KR101158128B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH20030832/03 2003-05-13
CH8322003 2003-05-13
PCT/IB2004/050645 WO2004102469A1 (fr) 2003-05-13 2004-05-12 Procédé d'assemblage d'un composant électronique sur un substrat

Publications (2)

Publication Number Publication Date
KR20060017779A KR20060017779A (ko) 2006-02-27
KR101158128B1 true KR101158128B1 (ko) 2012-06-19

Family

ID=33438095

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057021437A Expired - Fee Related KR101158128B1 (ko) 2003-05-13 2004-05-12 기판 상에 전자 부품을 장착하는 방법

Country Status (18)

Country Link
US (1) US8127997B2 (https=)
EP (1) EP1623369B1 (https=)
JP (1) JP5042627B2 (https=)
KR (1) KR101158128B1 (https=)
CN (1) CN100468450C (https=)
AT (1) ATE353457T1 (https=)
AU (1) AU2004239501B2 (https=)
BR (1) BRPI0411163A (https=)
CA (1) CA2524673C (https=)
DE (1) DE602004004647T2 (https=)
ES (1) ES2281802T3 (https=)
MX (1) MXPA05011963A (https=)
MY (1) MY148205A (https=)
PL (1) PL1623369T3 (https=)
PT (1) PT1623369E (https=)
RU (1) RU2328840C2 (https=)
TW (1) TWI331497B (https=)
WO (1) WO2004102469A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SI2036007T1 (sl) 2006-06-19 2013-05-31 Nagraid S.A. Postopek izdelave kartic, ki vsaka obsega elektronski modul, in vmesni izdelki
ES2537081T3 (es) 2006-06-19 2015-06-02 Nagravision S.A. Procedimiento de fabricación de tarjetas que comprenden por lo menos un módulo electrónico, conjunto que interviene en este procedimiento y producto intermedio
US7967214B2 (en) 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
WO2008082617A2 (en) 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
PL2132684T3 (pl) 2007-02-09 2013-03-29 Nagravision Sa Sposób produkcji kart elektronicznych zawierających co najmniej jeden nadrukowany wzór
RU2438209C1 (ru) * 2010-10-14 2011-12-27 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Электронный модуль
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9202162B2 (en) * 2012-11-09 2015-12-01 Maxim Integrated Products, Inc. Embedded radio frequency identification (RFID) package
EP3259708A1 (fr) 2015-02-20 2017-12-27 Nid Sa Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19645083A1 (de) * 1996-11-01 1998-05-07 Austria Card Gmbh Kontaktlose Chipkarte mit Transponderspule
US5969951A (en) * 1997-03-13 1999-10-19 Orga Kartensysteme Gmbh Method for manufacturing a chip card and chip card manufactured in accordance with said method
US20030052177A1 (en) * 2001-09-14 2003-03-20 Christophe Halope Contactless or hybrid contact-contactless smart card with reinforced connection of the electronic module

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3122981A1 (de) * 1981-06-10 1983-01-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Verfahren zum einbau von ic-bausteinen in ausweiskarten
JPS6420197A (en) * 1987-07-16 1989-01-24 Toshiba Corp Portable medium
DE4401458A1 (de) * 1994-01-19 1995-07-20 Ods Gmbh & Co Kg Verfahren und Vorrichtung zum Herstellen von Chipkarten
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
EP0786357A4 (en) * 1994-09-22 2000-04-05 Rohm Co Ltd CONTACTLESS CHIP CARD AND METHOD FOR PRODUCING THE SAME
JPH091972A (ja) * 1995-06-26 1997-01-07 Hitachi Ltd Ｉｃカード
DE19527398A1 (de) * 1995-07-27 1997-01-30 Philips Patentverwaltung Verfahren zum Löten von Bauelementen auf einer Trägerfolie
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
JPH09286187A (ja) * 1996-04-22 1997-11-04 Toppan Printing Co Ltd Ｉｃカード、ｉｃカード製造用中間体およびｉｃカードの製造方法
CN1075451C (zh) * 1997-05-19 2001-11-28 日立马库塞鲁株式会社 柔性信用卡模块及其制造方法以及使用柔性信用卡模块制造信息载体的方法
KR100330652B1 (ko) * 1997-06-23 2002-03-29 사토 게니치로 Ｉｃ모듈 및 ｉｃ카드
US6607135B1 (en) * 1997-06-23 2003-08-19 Rohm Co., Ltd. Module for IC card, IC card, and method for manufacturing module for IC card
JP3914620B2 (ja) * 1997-10-16 2007-05-16 シチズン時計株式会社 Ｉｃカード
RU2133522C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Способ изготовления и контроля электронных компонентов
JP2000207521A (ja) * 1999-01-18 2000-07-28 Toppan Printing Co Ltd 複合ｉｃカ―ドとその製造方法
FR2790849B1 (fr) 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
EP1043684A1 (de) * 1999-03-29 2000-10-11 OMD Productions AG Informationsträger
JP3661482B2 (ja) * 1999-04-06 2005-06-15 ソニーケミカル株式会社 半導体装置
FR2795200B1 (fr) * 1999-06-15 2001-08-31 Gemplus Card Int Dispositif electronique comportant au moins une puce fixee sur un support et procede de fabrication d'un tel dispositif
US20020110955A1 (en) * 1999-06-15 2002-08-15 Philippe Patrice Electronic device including at least one chip fixed to a support and a method for manufacturing such a device
FR2826154B1 (fr) * 2001-06-14 2004-07-23 A S K Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux
JP2003108970A (ja) * 2001-09-29 2003-04-11 Toshiba Corp カード型電子機器
US6830193B2 (en) * 2001-11-29 2004-12-14 Matsushita Electric Industrial Co., Ltd. Non-contact IC card
CN2533525Y (zh) * 2002-04-22 2003-01-29 唐智良 远距离无源微波电子识别卡
KR100910769B1 (ko) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 Ｉｃ 카드 및, 그것의 제조 방법
EP1544787A1 (en) * 2003-12-19 2005-06-22 Axalto SA Contactless card including an antenna switch

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19645083A1 (de) * 1996-11-01 1998-05-07 Austria Card Gmbh Kontaktlose Chipkarte mit Transponderspule
US5969951A (en) * 1997-03-13 1999-10-19 Orga Kartensysteme Gmbh Method for manufacturing a chip card and chip card manufactured in accordance with said method
US20030052177A1 (en) * 2001-09-14 2003-03-20 Christophe Halope Contactless or hybrid contact-contactless smart card with reinforced connection of the electronic module

Also Published As

Publication number Publication date
JP5042627B2 (ja) 2012-10-03
US20060226237A1 (en) 2006-10-12
EP1623369A1 (fr) 2006-02-08
US8127997B2 (en) 2012-03-06
MXPA05011963A (es) 2006-02-02
MY148205A (en) 2013-03-15
WO2004102469A1 (fr) 2004-11-25
BRPI0411163A (pt) 2006-07-11
AU2004239501A1 (en) 2004-11-25
CN1788275A (zh) 2006-06-14
KR20060017779A (ko) 2006-02-27
CN100468450C (zh) 2009-03-11
PT1623369E (pt) 2007-05-31
CA2524673C (en) 2012-01-24
DE602004004647D1 (de) 2007-03-22
PL1623369T3 (pl) 2007-07-31
ES2281802T3 (es) 2007-10-01
AU2004239501B2 (en) 2010-06-17
TWI331497B (en) 2010-10-01
CA2524673A1 (en) 2004-11-25
JP2007511811A (ja) 2007-05-10
TW200501859A (en) 2005-01-01
RU2328840C2 (ru) 2008-07-10
DE602004004647T2 (de) 2007-11-08
ATE353457T1 (de) 2007-02-15
EP1623369B1 (fr) 2007-02-07
RU2005134859A (ru) 2006-07-27

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