RU2214698C2 - Устройство отвода тепла, электрическая система, содержащая устройство отвода тепла, способ изготовления устройства отвода тепла и способ изготовления электрического компонента - Google Patents

Устройство отвода тепла, электрическая система, содержащая устройство отвода тепла, способ изготовления устройства отвода тепла и способ изготовления электрического компонента Download PDF

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RU2214698C2
RU2214698C2 RU2001103633/09A RU2001103633A RU2214698C2 RU 2214698 C2 RU2214698 C2 RU 2214698C2 RU 2001103633/09 A RU2001103633/09 A RU 2001103633/09A RU 2001103633 A RU2001103633 A RU 2001103633A RU 2214698 C2 RU2214698 C2 RU 2214698C2
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Russia
Prior art keywords
pyrographite
thermalized
removal device
heat removal
sealing material
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RU2001103633/09A
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English (en)
Russian (ru)
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RU2001103633A (ru
Inventor
Анджело ГАНДИ
ОЛИВЕЙРА Руи ДЕ
Энтони Артур КАРТЕР
Original Assignee
Квин Мэри Энд Уестфилд Колледж
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Heat Treatment Processes (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Making Paper Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
RU2001103633/09A 1998-07-08 1999-07-08 Устройство отвода тепла, электрическая система, содержащая устройство отвода тепла, способ изготовления устройства отвода тепла и способ изготовления электрического компонента RU2214698C2 (ru)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
GB9814835.6 1998-07-08
GBGB9814835.6A GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GB9825376.8 1998-11-19
GBGB9825376.8A GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board
GB9900924 1999-01-15
GB9900924.3 1999-01-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
RU2003115417/09A Division RU2256307C2 (ru) 1998-07-08 1999-07-08 Устройство отвода тепла (варианты), электрическая система, содержащая устройство отвода тепла (варианты), способ изготовления устройства отвода тепла (варианты) и способ изготовления электрического компонента (варианты)

Publications (2)

Publication Number Publication Date
RU2001103633A RU2001103633A (ru) 2003-03-10
RU2214698C2 true RU2214698C2 (ru) 2003-10-20

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RU2001103633/09A RU2214698C2 (ru) 1998-07-08 1999-07-08 Устройство отвода тепла, электрическая система, содержащая устройство отвода тепла, способ изготовления устройства отвода тепла и способ изготовления электрического компонента

Country Status (17)

Country Link
US (2) US6514616B1 (enExample)
EP (2) EP1492396A3 (enExample)
JP (1) JP2002520863A (enExample)
KR (1) KR100707155B1 (enExample)
CN (1) CN1184866C (enExample)
AT (1) ATE277497T1 (enExample)
AU (1) AU4790799A (enExample)
CA (1) CA2336889C (enExample)
DE (1) DE69920459T2 (enExample)
DK (1) DK1095545T3 (enExample)
ES (1) ES2229727T3 (enExample)
GB (2) GB9814835D0 (enExample)
HK (1) HK1040473B (enExample)
PT (1) PT1095545E (enExample)
RU (1) RU2214698C2 (enExample)
SI (1) SI1095545T1 (enExample)
WO (1) WO2000003567A1 (enExample)

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MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat

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JP5619830B2 (ja) * 2011-08-24 2014-11-05 パナソニック株式会社 樹脂−反磁性物質複合構造体、その製造方法、およびそれを用いた半導体装置
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
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CN108218428A (zh) * 2014-01-26 2018-06-29 太仓斯迪克新材料科技有限公司 用于平板电脑均热贴片的制造方法
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CN110147127A (zh) * 2019-05-24 2019-08-20 珠海格力智能装备有限公司 控制系统及方法
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Publication number Publication date
SI1095545T1 (en) 2005-02-28
CN1184866C (zh) 2005-01-12
PT1095545E (pt) 2005-01-31
EP1492396A2 (en) 2004-12-29
JP2002520863A (ja) 2002-07-09
CA2336889C (en) 2008-09-30
CA2336889A1 (en) 2000-01-20
US20030099836A1 (en) 2003-05-29
EP1095545A1 (en) 2001-05-02
US6514616B1 (en) 2003-02-04
US6689471B2 (en) 2004-02-10
ATE277497T1 (de) 2004-10-15
AU4790799A (en) 2000-02-01
KR100707155B1 (ko) 2007-04-16
EP1095545B1 (en) 2004-09-22
DE69920459D1 (de) 2004-10-28
DK1095545T3 (da) 2005-01-24
EP1492396A3 (en) 2005-07-27
GB9814835D0 (en) 1998-09-09
KR20010079508A (ko) 2001-08-22
ES2229727T3 (es) 2005-04-16
WO2000003567A1 (en) 2000-01-20
HK1040473A1 (en) 2002-06-07
GB9825376D0 (en) 1999-01-13
DE69920459T2 (de) 2005-10-13
HK1040473B (zh) 2005-05-27
CN1313023A (zh) 2001-09-12

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