GB0700917D0 - Structures with improved properties - Google Patents
Structures with improved propertiesInfo
- Publication number
- GB0700917D0 GB0700917D0 GB0700917A GB0700917A GB0700917D0 GB 0700917 D0 GB0700917 D0 GB 0700917D0 GB 0700917 A GB0700917 A GB 0700917A GB 0700917 A GB0700917 A GB 0700917A GB 0700917 D0 GB0700917 D0 GB 0700917D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- thermal conductivity
- constituent material
- thickness
- stack
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Abstract
A method of producing a material for use as a thermally-conductive substrate or such like, the method comprising the steps of: obtaining a plurality of layers of an anisotropic constituent material, each layer of the constituent material having a first thermal conductivity in a first direction, and a through-thickness thermal conductivity, the first thermal conductivity being different from the through-thickness thermal conductivity; stacking and joining the said plurality of layers to form a stack; and cutting through the stack to produce a slice; wherein the orientation of the slice with respect to the layers in the stack is such that the through-thickness thermal conductivity of the slice is determined by the first thermal conductivity of the layers in the stack. Also provided is a structure comprising a plurality of strips, the structure being substantially planar, wherein the strips comprise an anisotropic constituent material, the constituent material having a first thermal conductivity in a first direction and a conventionally-through-thickness thermal conductivity, the first thermal conductivity being different from the conventionally-through-thickness thermal conductivity, and wherein the orientation of the strips within the structure is such that the through-thickness thermal conductivity of the structure is determined by the first thermal conductivity of the constituent material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0700917A GB0700917D0 (en) | 2007-01-17 | 2007-01-17 | Structures with improved properties |
| PCT/GB2008/000003 WO2008087373A2 (en) | 2007-01-17 | 2008-01-02 | Structures with improved properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0700917A GB0700917D0 (en) | 2007-01-17 | 2007-01-17 | Structures with improved properties |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB0700917D0 true GB0700917D0 (en) | 2007-02-28 |
Family
ID=37846533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0700917A Ceased GB0700917D0 (en) | 2007-01-17 | 2007-01-17 | Structures with improved properties |
Country Status (2)
| Country | Link |
|---|---|
| GB (1) | GB0700917D0 (en) |
| WO (1) | WO2008087373A2 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9635285B2 (en) | 2009-03-02 | 2017-04-25 | Flir Systems, Inc. | Infrared imaging enhancement with fusion |
| US9451183B2 (en) | 2009-03-02 | 2016-09-20 | Flir Systems, Inc. | Time spaced infrared image enhancement |
| US10244190B2 (en) | 2009-03-02 | 2019-03-26 | Flir Systems, Inc. | Compact multi-spectrum imaging with fusion |
| US10091439B2 (en) | 2009-06-03 | 2018-10-02 | Flir Systems, Inc. | Imager with array of multiple infrared imaging modules |
| WO2014105904A1 (en) * | 2012-12-26 | 2014-07-03 | Flir Systems, Inc. | Infrared focal plane array heat spreaders |
| CN103748867B (en) | 2011-06-10 | 2019-01-18 | 菲力尔系统公司 | Low-power consumption and small form factor infrared imaging |
| US9961277B2 (en) * | 2011-06-10 | 2018-05-01 | Flir Systems, Inc. | Infrared focal plane array heat spreaders |
| US9143703B2 (en) | 2011-06-10 | 2015-09-22 | Flir Systems, Inc. | Infrared camera calibration techniques |
| CN103875235B (en) | 2011-06-10 | 2018-10-12 | 菲力尔系统公司 | Nonuniformity Correction for infreared imaging device |
| CN107148669B (en) * | 2014-12-18 | 2020-04-07 | 株式会社钟化 | Graphite laminate, method for producing graphite laminate, heat transport structure, and rod-shaped heat transport body |
| CN106947436B (en) * | 2017-05-10 | 2022-10-14 | 中国科学院宁波材料技术与工程研究所 | Thermal interface material and preparation and application thereof |
| SG11202002477YA (en) | 2017-09-29 | 2020-04-29 | Nagase Chemtex Corp | Manufacturing method of mounting structure, and laminate sheet therefor |
| JP7123981B2 (en) * | 2018-01-30 | 2022-08-23 | 京セラ株式会社 | Substrates for mounting electronic elements, electronic devices and electronic modules |
| WO2020004567A1 (en) * | 2018-06-27 | 2020-01-02 | 京セラ株式会社 | Electronic element mounting substrate, electronic device, and electronic module |
| CN110746622B (en) * | 2019-09-23 | 2022-09-20 | 深圳大学 | Method for improving conductivity of high polymer material and high polymer material with high conductivity |
| CN115340767A (en) * | 2022-08-26 | 2022-11-15 | 安徽宇航派蒙健康科技股份有限公司 | High-thermal-conductivity insulating silica gel and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5700342A (en) * | 1993-06-30 | 1997-12-23 | Simmonds Precision Products Inc. | Composite enclosure for electronic hardware |
| US5660917A (en) * | 1993-07-06 | 1997-08-26 | Kabushiki Kaisha Toshiba | Thermal conductivity sheet |
| GB9814835D0 (en) * | 1998-07-08 | 1998-09-09 | Europ Org For Nuclear Research | A thermal management board |
| US6075701A (en) * | 1999-05-14 | 2000-06-13 | Hughes Electronics Corporation | Electronic structure having an embedded pyrolytic graphite heat sink material |
| US7351360B2 (en) * | 2004-11-12 | 2008-04-01 | International Business Machines Corporation | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive |
-
2007
- 2007-01-17 GB GB0700917A patent/GB0700917D0/en not_active Ceased
-
2008
- 2008-01-02 WO PCT/GB2008/000003 patent/WO2008087373A2/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008087373A2 (en) | 2008-07-24 |
| WO2008087373B1 (en) | 2008-11-06 |
| WO2008087373A3 (en) | 2008-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AT | Applications terminated before publication under section 16(1) |