CN115340767A - High-thermal-conductivity insulating silica gel and preparation method thereof - Google Patents
High-thermal-conductivity insulating silica gel and preparation method thereof Download PDFInfo
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- CN115340767A CN115340767A CN202211035622.9A CN202211035622A CN115340767A CN 115340767 A CN115340767 A CN 115340767A CN 202211035622 A CN202211035622 A CN 202211035622A CN 115340767 A CN115340767 A CN 115340767A
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Abstract
The invention provides high-thermal-conductivity insulating silica gel and a preparation method thereof, wherein the preparation method comprises the following steps: step S1, coating liquid silica gel on two surfaces of a layer of fluorinated graphene film; s2, placing another layer of fluorinated graphene film on the liquid silica gel; s3, coating liquid silica gel on the other layer of fluorinated graphene film; s4, repeating the step S2 and the step S3 to obtain a fluorinated graphene film/silica gel stacked body; and S5, curing the fluorinated graphene film/silica gel stacked body. According to the invention, the high-thermal-conductivity fluorinated graphene film is used as the thermal conductive filler, so that the thermal conductivity is obviously improved.
Description
Technical Field
The invention relates to the technical field of heat conduction materials, in particular to high-heat-conductivity insulating silica gel and a preparation method thereof.
Background
The heat-conducting silica gel is a high-molecular organic silicon material which is applied to the surface of a heating device and serves as a heat transfer medium. During operation of the high-power heating device, even if the two planes (the radiator surface and the heater surface) have very smooth surfaces, gaps can be formed when the two planes are in contact with each other, and air in the gaps is a poor medium for heat conduction and can hinder heat conduction to the radiating fins. The heat-conducting silica gel is a material which can fill the gaps, so that heat can be conducted more smoothly and rapidly. Such materials are also referred to as thermal interface materials.
The heat-conducting silica gel mainly comprises heat-conducting filler and organic silicon. Wherein, the heat conductivity of the heat-conducting silica gel is related to the composition, the structure, the adding proportion and the like of the heat-conducting filler.
Generally, the thermally conductive silicone rubber is required to have high insulation property due to direct contact with a chip or a power device. The thermally conductive filler is therefore typically an electrically insulating and thermally conductive material such as alumina, boron nitride, or the like. However, these materials have low thermal conductivity, generally < 50W/mK, resulting in low thermal conductivity of thermally conductive silica gel, typically < 10W/mK.
Therefore, there is a need for an insulating silica gel with high thermal conductivity.
Disclosure of Invention
Aiming at one or more problems in the prior art, the invention provides a preparation method of high-thermal-conductivity insulating silica gel, which comprises the following steps:
step S1, coating liquid silica gel on two surfaces of a layer of fluorinated graphene film;
s2, placing another layer of fluorinated graphene film on the liquid silica gel;
s3, coating liquid silica gel on the other layer of fluorinated graphene film;
s4, repeating the step S2 and the step S3 to obtain a fluorinated graphene film/silica gel stacked body;
and S5, curing the fluorinated graphene film/silica gel stacked body to obtain the fluorinated graphene film/silica gel composite material.
According to an aspect of the present invention, the step S1 further comprises:
and processing a hollow space on the fluorinated graphene film.
According to one aspect of the invention, the hollowed-out space is processed on the fluorinated graphene film by adopting a laser cutting method.
According to one aspect of the invention, a rectangular or square fluorinated graphene film is laid on a laser cutting platform, a plurality of strips are cut off at equal intervals by laser cutting, a plurality of strip-shaped hollows are formed, and the plurality of strip-shaped hollowed fluorinated graphene films with frames are obtained.
According to an aspect of the invention, the fluorinated graphene film has a fluorine content of 45wt% to 65wt%. The excessively low fluorine content is advantageous in improving the thermal conductivity, but is poor in insulation properties; the fluorine content is too high, which is advantageous for insulation, but the thermal conductivity is too low.
According to one aspect of the invention, each layer of the fluorinated graphene film has a thickness of 10 μm to 25 μm, a length of 1cm to 15cm, and a width of 1cm to 15cm. The thickness of the fluorinated graphene film is less than 10 microns, the width of a heat conduction path inside the heat conduction insulating silica gel is reduced, the heat conductivity of the heat conduction silica gel is too low, and the thickness of the fluorinated graphene film is more than 25 microns, so that the reduction of the hardness of the insulating heat conduction silica gel is not facilitated.
According to one aspect of the invention, the width of the strip-shaped hollow is 0.3mm-0.8mm, the width of the frame is 0.5cm-2cm, and the width of the graphene fluoride strip membrane between adjacent strip-shaped hollows is 0.5mm-1.5mm. The width of bar fretwork is too little, is unfavorable for laser cutting, and the width of bar fretwork is too big for fluoridize graphite alkene content in the insulating silica gel of high heat conduction is too little, and the thermal conductivity of insulating silica gel of high heat conduction is crossed lowly.
According to an aspect of the present invention, the coating thickness of the liquid silicone gel is 0.03mm to 0.1mm. The coating thickness of the liquid silica gel is too small to facilitate coating, and the coating thickness of the liquid silica gel is too large, so that the heat-conducting property of the high-heat-conduction insulating silica gel is lower.
According to one aspect of the invention, the fluorinated graphene film/silica gel stack has a thickness of 1cm to 15cm.
According to an aspect of the present invention, said step S5 is followed by:
and cutting the fluorinated graphene film/silica gel composite material along the thickness direction to obtain the high-thermal-conductivity insulating silica gel.
According to one aspect of the invention, the high-heat-conductivity insulating silica gel is obtained by cutting with multi-line diamond at equal intervals along the thickness direction and the direction vertical to the length direction of the strip-shaped hollow parts.
According to one aspect of the invention, the pitch of the multi-wire diamond cutting is 0.5mm to 6mm.
According to an aspect of the present invention, the length of each of the cut fluorinated graphene film/silica gel composite obtained is the thickness of each of the high thermal conductive insulating silica gels.
According to an aspect of the present invention, in the step S1 and the step S3, a liquid silica gel is sprayed on the fluorinated graphene film by a spraying method.
According to one aspect of the invention, the liquid silica gel is a two-component liquid silica gel mixed liquid. The silica gel mixed solution of the two-component liquid comprises a component A and a component B, and can adopt any silica gel of two-component liquid in the prior art, preferably, the component A is organosilicon, the component B comprises one or more of a cross-linking agent (which can be any cross-linking agent of organosilicon in the prior art, such as a silane coupling agent), a catalyst (which can be any catalyst of organosilicon in the prior art, such as a titanium chelate catalyst) and an initiator (which can be any initiator of organosilicon in the prior art, such as a silylene ether type initiator), the mass ratio of the component A to the component B is 10. The curing mechanism of the silica gel of the two-component liquid is different from that of the common silica gel, the silica gel of the two-component liquid is cross-linked and cured, the common silica gel is mostly moisture-absorbing and cured, and moisture can not enter a fluorinated graphene film/silica gel stacked body, so that the middle silica gel can not be cured, and the two-component liquid is not suitable for the application.
According to one aspect of the invention, the hollowed-out fluorinated graphene film is placed in a scraper coater, a silica gel mixed solution of two-component liquid is uniformly sprayed on the surface of the hollowed-out fluorinated graphene film, and the clearance of the scraper is adjusted to scrape the excess silica gel mixed solution of two-component liquid.
According to an aspect of the invention, said step S5 comprises:
and (3) placing the fluorinated graphene membrane/silica gel composite material in an oven, and heating and curing.
According to another aspect of the present invention, there is provided an insulating silica gel with high thermal conductivity, comprising a silica gel and a plurality of graphene fluoride films, wherein the graphene fluoride films are distributed in the silica gel along the thickness direction in an oriented manner.
According to another aspect of the invention, the plurality of fluorinated graphene films are arranged in an array.
According to another aspect of the present invention, the plurality of fluorinated graphene films are disposed at intervals in two coordinate directions perpendicular to the thickness.
According to another aspect of the present invention, the plurality of graphene fluoride films have a pitch of 0.03mm to 0.1mm in one direction perpendicular to the thickness, the plurality of graphene fluoride films have a pitch of 0.3mm to 0.8mm in another direction perpendicular to the thickness, and the one direction and the another direction are perpendicular.
According to another aspect of the invention, the silica gel comprises a two-component silica gel.
According to another aspect of the invention, the fluorinated graphene film has a fluorine content of 45wt% to 65wt%.
According to another aspect of the invention, the thickness of the high thermal conductivity insulating silica gel is 0.5mm-6mm.
According to another aspect of the invention, the thermal conductivity of the high thermal conductivity insulating silica gel in the thickness direction is 10W/mK-18W/mK.
The high-thermal-conductivity fluorinated graphene film is used as a thermal conductive filler, the theoretical thermal conductivity coefficient of the fluorinated graphene is 1800W/mK, which is 5 times that of copper, and the fluorinated graphene film is an insulating material, is suitable for manufacturing high-thermal-conductivity insulating silica gel thermal interface materials, and is used for heat conduction of heating devices, chips, radiators and the like.
According to the invention, the fluorinated graphene film/silica gel layered structure is repeatedly stacked and then longitudinally cut to realize the oriented arrangement of the fluorinated graphene film in the silica gel along the thickness direction, so that the thermal conductivity of the insulating and heat-conducting silica gel is obviously improved. The fluorinated graphene film has anisotropic heat conduction, and the heat conduction coefficient in the film direction is very high and can reach more than 100W/mK; perpendicular to the film direction, the thermal conductivity is lower than 2W/mK. Therefore, the fluorinated graphene film is oriented in the silica gel along the thickness direction, which is beneficial to improving the thermal conductivity of the heat-conducting silica gel.
The fluorinated graphene film has a hollow space, improves the compressibility of the high-thermal-conductivity silica gel, and obviously reduces the hardness of the insulating thermal-conductivity silica gel, so that the interface contact between the insulating thermal-conductivity silica gel and a heating device/chip and a radiator is improved, and the interface thermal resistance is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of one embodiment of a fluorinated graphene membrane of the present invention;
FIG. 2 is a schematic view of one embodiment of a fluorinated graphene film/silica gel stack according to the present disclosure;
fig. 3 is a schematic view of an embodiment of the high thermal conductivity insulating silica gel of the present invention.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
The preparation method of the high-thermal-conductivity insulating silica gel comprises the following steps:
step S1, coating liquid silica gel on two surfaces of a layer of fluorinated graphene film;
s2, placing another layer of fluorinated graphene film on the liquid silica gel;
s3, coating liquid silica gel on the other layer of fluorinated graphene film;
s4, repeating the step S2 and the step S3 to obtain a fluorinated graphene film/silica gel stacked body;
and S5, curing the fluorinated graphene film/silica gel stacked body to obtain the fluorinated graphene film/silica gel composite material.
When the size of the fluorinated graphene film/silica gel composite material meets the size requirement of the high-thermal-conductivity insulating silica gel, the fluorinated graphene film/silica gel composite material is not cut, when the size of the fluorinated graphene film/silica gel composite material does not meet the size requirement of the high-thermal-conductivity insulating silica gel, the fluorinated graphene film/silica gel composite material is cut along the thickness direction (stacking direction) to obtain the high-thermal-conductivity insulating silica gel, and the length of each fluorinated graphene film/silica gel composite material after cutting is equal to the thickness of each high-thermal-conductivity insulating silica gel.
According to the high-thermal-conductivity insulating silica gel, the high-thermal-conductivity fluorinated graphene film is used as the thermal conductive filler, so that the thermal conductivity of the high-thermal-conductivity insulating silica gel is improved, but the fluorinated graphene film is arranged at intervals with the silica gel in the X direction and is continuous in the Y direction, so that the thermal conductivity of the high-thermal-conductivity insulating silica gel is improved, but the hardness of the high-thermal-conductivity insulating thermal-conductivity silica gel is not reduced, so that the interface thermal resistance is higher, and in a preferred embodiment, a hollow space is processed on the fluorinated graphene film.
Fig. 1 is a schematic view of an embodiment of a fluorinated graphene film according to the present invention, fig. 2 is a schematic view of an embodiment of a fluorinated graphene film/silica gel stack according to the present invention, and fig. 3 is a schematic view of an embodiment of a high thermal conductive insulating silica gel according to the present invention, and as shown in fig. 1 to 3, the method for preparing the high thermal conductive insulating silica gel includes:
step S10, processing a hollow space 20 on the fluorinated graphene film 10, as shown in fig. 1;
step S20, coating liquid silica gel 30 on two surfaces of a layer of fluorinated graphene film;
step S30, placing another layer of fluorinated graphene film 10 on the liquid silica gel 30;
step S40, coating a liquid silica gel 30 on another layer of fluorinated graphene film 10;
step S50, repeating step S30 and step S40 to obtain a fluorinated graphene film/silica gel stacked body, as shown in fig. 2;
step S60, curing the fluorinated graphene film/silica gel stacked body to obtain a fluorinated graphene film/silica gel composite material;
step S70, cutting the fluorinated graphene film/silica gel composite material in the thickness direction to obtain the high thermal conductivity insulating silica gel, as shown in fig. 3.
In a preferred embodiment, the preparation method of the high thermal conductive insulating silica gel comprises the following steps:
step S100, tiling a rectangular or square fluorinated graphene film on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame;
step S200, uniformly spraying the prepared silica gel mixed solution of the bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coater with the frame. Then adjusting a scraper gap to scrape off redundant silica gel mixed liquid of the double-component liquid to obtain a fluorinated graphene membrane with a certain coating thickness;
step S300, repeatedly manufacturing the fluorinated graphene film in the step S100, placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step S200, aligning the fluorinated graphene film with the fluorinated graphene film coating up and down, and repeating the step S200;
step S400, repeating the steps S100-S300 to obtain a fluorinated graphene film/silica gel stacked body with a certain thickness;
step S500, placing the fluorinated graphene film/silica gel stacked body in an oven, and heating and curing to obtain a fluorinated graphene film/silica gel composite material;
step S600, cutting the fluorinated graphene film/silica gel composite material at equal intervals by using multi-line diamonds along the thickness (stacking direction) and the direction perpendicular to the laser cutting direction (the length direction perpendicular to the strip-shaped hollow), and then turning over for 90 degrees to obtain the high-thermal-conductivity insulating silica gel with a certain thickness.
As shown in fig. 3, the high thermal conductive insulating silica gel of the present invention includes a silica gel 30 and a plurality of fluorinated graphene films 10, wherein the fluorinated graphene films 10 are distributed in the silica gel 30 along a thickness direction.
In order to illustrate the technical effects of the present invention, the following specific examples were carried out:
example 1:
the specific steps for preparing the high thermal conductivity insulating silica gel in the embodiment are as follows:
(1) The fluorinated graphene film is a square fluorinated graphene film with the fluorinated graphene fluorine content of 45wt%, the thickness of 25 micrometers, the length of 15cm and the width of 15cm;
(2) And (3) uniformly spraying silica gel of bi-component liquid on the surface of the fluorinated graphene film transfer scraper coating machine. Then adjusting a scraper gap to scrape redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.03 mm;
(3) Repeating the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 15cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction vertical to the laser cutting direction by using multi-line diamond at equal intervals of 0.5mm, and then turning over for 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 0.5mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films which are periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 25 micrometers, the width of the fluorinated graphene film is 1.5mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the fluorinated graphene films were 0.03mm apart in the X direction and continuous in the Y direction.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 18W/mK, the hardness (Shore 00) is 75, and the interface thermal resistance is0.23Kcm 2 And the insulation degree is 15kV/mm.
Example 2:
the specific steps for preparing the high thermal conductivity insulating silica gel in the embodiment are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 45wt%, the thickness of 25 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 0.5cm, the periodic strip-shaped hollowed width W1 is 0.3mm, and the width W2 of the long strip-shaped fluorinated graphene is 1.5mm;
(2) And uniformly spraying silica gel of bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting the gap of a scraper to scrape off redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.03 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 15cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 0.5mm, and then turning over for 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 0.5mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films which are periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 25 micrometers, the width of the fluorinated graphene film is 1.5mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.03mm, and the distance in the Y direction was 0.3mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 18W/mK, the hardness (Shore 00) is 55, and the interface thermal resistance is 0.11Kcm 2 And the insulation degree is 18kV/mm.
Example 3
The specific steps for preparing the high thermal conductivity insulating silica gel in the embodiment are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 60wt%, the thickness of 15 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 1cm, the periodic strip-shaped hollowed width W1 is 0.5mm, and the width W2 of the long strip-shaped fluorinated graphene is 1mm;
(2) And uniformly spraying silica gel of bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting a scraper gap to scrape redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.06 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 8 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction at equal intervals of 3mm by using multi-line diamond, and then turning over for 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 3mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films which are periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 15 micrometers, the width of the fluorinated graphene film is 1mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.5mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 18W/mK, the hardness (Shore 00) is 50, and the interface thermal resistance is 0.10Kcm 2 And the insulation degree is 20kV/mm.
Example 4:
the preparation method of the high thermal conductivity insulating silica gel comprises the following specific steps:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 65wt%, the thickness of 25 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 0.5cm, the periodic strip-shaped hollowed width W1 is 0.3mm, and the width W2 of the long strip-shaped fluorinated graphene is 1.5mm;
(2) And uniformly spraying the silica gel of the just-made bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting a scraper gap to scrape redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.03 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 15cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 0.5mm, and then turning over for 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 0.5mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 25 micrometers, the width of the fluorinated graphene film is 1.5mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.03mm, and the distance between the fluorinated graphene films in the Y direction was 0.3mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 16W/mK.
Example 5:
the specific steps for preparing the high thermal conductivity insulating silica gel in the embodiment are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 65wt%, the thickness of 10 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width is 0.5cm, the periodic strip-shaped hollowed width is 0.3mm, and the width of the long strip-shaped fluorinated graphene is 1.5mm;
(2) And (3) carefully transferring the periodic strip-shaped hollowed fluorinated graphene film with the frame on a scraper coater, and uniformly spraying the silica gel of the just-made bi-component liquid on the surface of the fluorinated graphene film. Then adjusting a scraper gap to scrape redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.03 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 15cm;
(5) Placing the fluorinated graphene film/silica gel stack in an oven, and heating and curing to obtain a fluorinated graphene film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness and in the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 2mm, and then turning over the material by 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 2 mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films which are periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 10 micrometers, the width of the fluorinated graphene film is 1.5mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.03mm, and the distance between the fluorinated graphene films in the Y direction was 0.3mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 15W/mK.
Example 6:
the specific steps for preparing the high-thermal-conductivity insulating silica gel in the embodiment are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 65wt%, the thickness of 10 micrometers, the length of 10cm and the width of 10cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width is 2cm, the periodic strip-shaped hollowed width is 0.8mm, and the width of the long strip-shaped fluorinated graphene is 1.5mm;
(2) And (3) carefully transferring the periodic strip-shaped hollowed fluorinated graphene film with the frame on a scraper coater, and uniformly spraying the silica gel of the just-made bi-component liquid on the surface of the fluorinated graphene film. Then adjusting a scraper gap to scrape redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.03 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 10 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 4mm, and then turning over the material by 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 4 mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 10 micrometers, the width of the fluorinated graphene film is 1.5mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.03mm, and the distance in the Y direction was 0.8mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 14W/mK.
Example 7:
the specific steps for preparing the high thermal conductivity insulating silica gel in the embodiment are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 65wt%, the thickness of 10 micrometers, the length of 10cm and the width of 10cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width is 2cm, the periodic strip-shaped hollowed width is 0.8mm, and the width of the strip-shaped fluorinated graphene is 1.5mm;
(2) And (3) carefully transferring the periodic strip-shaped hollowed fluorinated graphene film with the frame on a scraper coater, and uniformly spraying the silica gel of the just-made bi-component liquid on the surface of the fluorinated graphene film. Then adjusting the gap of a scraper to scrape off redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.06 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 10 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 6mm, and then turning over the material by 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 6mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films which are periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 10 micrometers, the width of the fluorinated graphene film is 1.5mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.8mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 12W/mK.
Example 8:
the specific steps for preparing the high thermal conductivity insulating silica gel in the embodiment are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 65wt%, the thickness of 10 micrometers, the length of 10cm and the width of 10cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width is 2cm, the periodic strip-shaped hollowed width is 0.8mm, and the width of the strip-shaped fluorinated graphene is 1.5mm;
(2) And (3) carefully transferring the periodic strip-shaped hollowed fluorinated graphene film with the frame on a scraper coater, and uniformly spraying the silica gel of the just-made bi-component liquid on the surface of the fluorinated graphene film. Then adjusting a scraper gap to scrape redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.1mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 10 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction vertical to the laser cutting direction at equal intervals of 6mm by using multi-line diamond, and then turning over for 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 6mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 10 micrometers, the width of the fluorinated graphene film is 1.5mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.1mm, and the distance in the Y direction was 0.8mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 10W/mK.
Comparative example 1:
the specific steps for preparing the high-thermal-conductivity insulating silica gel in the comparative example are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 30wt%, the thickness of 15 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 1cm, the periodic strip-shaped hollowed width W1 is 0.5mm, and the width W2 of the long strip-shaped fluorinated graphene is 1mm;
(2) And uniformly spraying silica gel of bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting the gap of a scraper to scrape off redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.06 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 8 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction at equal intervals of 3mm by using multi-line diamond, and then turning over for 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 3mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 15 micrometers, the width of the fluorinated graphene film is 1mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.5mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 20W/mK, and the insulating degree is 6kV/mm.
Comparative example 2:
the specific steps for preparing the high-thermal-conductivity insulating silica gel in the comparative example are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 70wt%, the thickness of 15 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 1cm, the periodic strip-shaped hollowed width W1 is 0.5mm, and the width W2 of the long strip-shaped fluorinated graphene is 1mm;
(2) And uniformly spraying silica gel of bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting the gap of a scraper to scrape off redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.06 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 8 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 3mm, and then turning over the material by 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 3mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 15 micrometers, the width of the fluorinated graphene film is 1mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.5mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 9W/mK, and the insulating degree is 21kV/mm.
Comparative example 3:
the specific steps for preparing the high-thermal-conductivity insulating silica gel in the comparative example are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 60wt%, the thickness of 15 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 1cm, the periodic strip-shaped hollowed width W1 is 0.9mm, and the width W2 of the long strip-shaped fluorinated graphene is 1mm;
(2) And uniformly spraying silica gel of bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting the gap of a scraper to scrape off redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.06 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 8 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 3mm, and then turning over the material by 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 3mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 15 micrometers, the width of the fluorinated graphene film is 1mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.9mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 8W/mK.
Comparative example 4:
the specific steps for preparing the high-thermal-conductivity insulating silica gel in the comparative example are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 60wt%, the thickness of 9 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 1cm, the periodic strip-shaped hollowed width W1 is 0.5mm, and the width W2 of the long strip-shaped fluorinated graphene is 1mm;
(2) And uniformly spraying silica gel of bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting a scraper gap to scrape redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.06 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 8 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 3mm, and then turning over the material by 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 3mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films which are periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 9 micrometers, the width of the fluorinated graphene film is 1mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.5mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 9W/mK, and the hardness (Shore 00) is 53.
Comparative example 5:
the specific steps for preparing the high-thermal-conductivity insulating silica gel in the comparative example are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 60wt%, the thickness of 30 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 1cm, the periodic strip-shaped hollowed width W1 is 0.5mm, and the width W2 of the long strip-shaped fluorinated graphene is 1mm;
(2) And uniformly spraying silica gel of bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting a scraper gap to scrape redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.06 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 8 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 3mm, and then turning over the material by 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 3mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 30 micrometers, the width of the fluorinated graphene film is 1mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.5mm.
The thermal conductivity in the thickness direction of the high-thermal-conductivity insulating silica gel is 20W/mK, and the hardness (Shore 00) is 75.
Comparative example 6:
the specific steps for preparing the high-thermal-conductivity insulating silica gel in the comparative example are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 60wt%, the thickness of 15 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 1cm, the periodic strip-shaped hollowed width W1 is 0.5mm, and the width W2 of the long strip-shaped fluorinated graphene is 1mm;
(2) And uniformly spraying silica gel of bi-component liquid on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coating machine with the frame. Then adjusting the gap of a scraper to scrape off redundant silica gel of the bi-component liquid to obtain a fluorinated graphene film with the thickness of 0.15 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 8 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction by using multi-line diamonds at equal intervals of 3mm, and then turning over the material by 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 3mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 15 micrometers, the width of the fluorinated graphene film is 1mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.5mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 9W/mK.
Comparative example 7:
the specific steps for preparing the high thermal conductivity insulating silica gel in the embodiment are as follows:
(1) Flatly laying a square fluorinated graphene film with the fluorine content of 60wt%, the thickness of 15 micrometers, the length of 15cm and the width of 15cm on a laser cutting platform, controlling a laser cutting equipment program, and cutting off a plurality of thin strips at equal intervals in the central area of the fluorinated graphene film to obtain a periodic strip-shaped hollowed fluorinated graphene film with a frame, wherein the frame width W3 is 1cm, the periodic strip-shaped hollowed width W1 is 0.5mm, and the width W2 of the long strip-shaped fluorinated graphene is 1mm;
(2) And uniformly spraying liquid organic silicon (single-component liquid silica gel) on the surface of the periodically strip-shaped hollowed fluorinated graphene film transfer scraper coater with the frame. Then adjusting a scraper gap to scrape redundant liquid organic silicon to obtain a fluorinated graphene film with the thickness of 0.06 mm;
(3) Repeatedly manufacturing the fluorinated graphene film in the step (1), placing the fluorinated graphene film on the surface of the fluorinated graphene film coating in the step (2), aligning the fluorinated graphene film coating up and down, and repeating the step (2);
(4) Repeating the steps (1) to (3) to obtain a fluorinated graphene film/silica gel stacked body with the thickness of 8 cm;
(5) Placing the graphene fluoride film/silica gel stacked body in an oven, and heating and curing to obtain a graphene fluoride film/silica gel composite material;
(6) And cutting the fluorinated graphene film/silica gel composite material along the thickness direction and the direction perpendicular to the laser cutting direction at equal intervals of 3mm by using multi-line diamond, and then turning over for 90 degrees to obtain the high-thermal-conductivity insulating silica gel with the thickness of 3mm.
The high-thermal-conductivity insulating silica gel contains fluorinated graphene films which are periodically arranged in the thickness direction, and the fluorinated graphene films are filled with the silica gel; the thickness of the fluorinated graphene film is 15 micrometers, the width of the fluorinated graphene film is 1mm, and the length of the fluorinated graphene film is the same as that of the high-thermal-conductivity insulating silica gel; the distance between the fluorinated graphene films in the X direction was 0.06mm, and the distance in the Y direction was 0.5mm.
The thermal conductivity of the high-thermal-conductivity insulating silica gel in the thickness direction is 18W/mK, the hardness (Shore 00) is 30, the silica gel of the liquid in the high-conductor insulating silica gel is not solidified, the interface contact between the insulating thermal-conductivity silica gel and the chip is reduced, the interface thermal resistance is increased, and the interface thermal resistance is 0.3Kcm 2 /W。
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention as defined in the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A preparation method of high-thermal-conductivity insulating silica gel is characterized by comprising the following steps:
step S1, coating liquid silica gel on two surfaces of a layer of fluorinated graphene film;
s2, placing another layer of fluorinated graphene film on the liquid silica gel;
s3, coating liquid silica gel on the other layer of fluorinated graphene film;
s4, repeating the step S2 and the step S3 to obtain a fluorinated graphene film/silica gel stacked body;
and S5, curing the fluorinated graphene film/silica gel stacked body to obtain the fluorinated graphene film/silica gel composite material.
2. The method according to claim 1, wherein the step S1 is preceded by:
processing a hollow space on the fluorinated graphene film;
preferably, a laser cutting method is adopted to process a hollow space on the fluorinated graphene film;
preferably, the rectangular or square fluorinated graphene film is tiled on a laser cutting platform, a plurality of strips are cut off at equal intervals by laser cutting, a plurality of strip-shaped hollows are formed, and the fluorinated graphene film with the plurality of strip-shaped hollows and the frame is obtained.
3. The method of claim 2, wherein the fluorinated graphene film has a fluorine content of 45wt% to 65wt%;
preferably, each layer of the fluorinated graphene film has a thickness of 10 μm to 25 μm, a length of 1cm to 15cm, and a width of 1cm to 15cm;
preferably, the width of each strip-shaped hollow is 0.3mm-0.8mm, the width of each frame is 0.5cm-2cm, and the width of each strip-shaped fluorinated graphene film between every two adjacent strip-shaped hollows is 0.5mm-1.5mm;
preferably, the coating thickness of the liquid silica gel is 0.03mm-0.1mm;
preferably, the fluorinated graphene film/silica gel stack has a thickness of 1cm to 15cm.
4. The method according to claim 2, wherein the step S5 is followed by:
cutting the fluorinated graphene film/silica gel composite material along the thickness direction to obtain high-thermal-conductivity insulating silica gel;
preferably, cutting the strip-shaped hollow part at equal intervals along the thickness direction and the direction vertical to the length direction of the strip-shaped hollow part by using multi-wire diamonds to obtain the high-heat-conductivity insulating silica gel, and further preferably, cutting the multi-wire diamonds at intervals of 0.5-6 mm;
preferably, the length of each cut obtained fluorinated graphene film/silica gel composite is the thickness of each high thermal conductive insulating silica gel.
5. The preparation method according to claim 2, wherein in the steps S1 and S3, a liquid silica gel is sprayed on the fluorinated graphene film by means of spraying; preferably, the liquid silica gel is a silica gel mixed liquid of two-component liquid;
preferably, the hollowed-out fluorinated graphene film is placed in a scraper coater, a silica gel mixed solution of the two-component liquid is uniformly sprayed on the surface of the hollowed-out fluorinated graphene film, and the gap between scrapers is adjusted to scrape the redundant silica gel mixed solution of the two-component liquid.
6. The method according to claim 1, wherein the step S5 includes:
the fluorinated graphene film/silica gel stack was placed in an oven and cured by heating.
7. The high-thermal-conductivity insulating silica gel is characterized by comprising silica gel and a plurality of fluorinated graphene films, wherein the fluorinated graphene films are distributed in the silica gel along the thickness direction in an oriented manner;
preferably, the plurality of fluorinated graphene films are arranged in an array.
8. The high thermal conductivity insulating silicone rubber according to claim 7, wherein the plurality of fluorinated graphene films are spaced in two coordinate directions perpendicular to the thickness, preferably, the plurality of fluorinated graphene films have a spacing of 0.03mm to 0.1mm in one direction perpendicular to the thickness, the plurality of fluorinated graphene films have a spacing of 0.3mm to 0.8mm in the other direction perpendicular to the thickness, and the one direction and the other direction are perpendicular.
9. The high thermal conductivity insulating silica gel according to claim 7, wherein the silica gel is a two-component silica gel;
preferably, the fluorinated graphene film has a fluorine content of 45wt% to 65wt%.
10. The high thermal conductivity insulating silica gel according to claim 7, wherein the thickness of the high thermal conductivity insulating silica gel is 0.5mm-6mm, and preferably, the thermal conductivity of the high thermal conductivity insulating silica gel in the thickness direction is 10W/mK-18W/mK.
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