HK1040473B - 热控制器件以及制造这种器件的方法 - Google Patents

热控制器件以及制造这种器件的方法 Download PDF

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Publication number
HK1040473B
HK1040473B HK02101746.3A HK02101746A HK1040473B HK 1040473 B HK1040473 B HK 1040473B HK 02101746 A HK02101746 A HK 02101746A HK 1040473 B HK1040473 B HK 1040473B
Authority
HK
Hong Kong
Prior art keywords
carbon
thermal control
control device
encapsulating material
pyrolytic graphite
Prior art date
Application number
HK02101746.3A
Other languages
English (en)
Chinese (zh)
Other versions
HK1040473A1 (en
Inventor
A‧甘迪
R‧德欧利维拉
A‧A‧卡特尔
R‧德歐利維拉
A‧A‧卡特爾
Original Assignee
玛丽皇后和威斯特-弗尔德学院
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 玛丽皇后和威斯特-弗尔德学院 filed Critical 玛丽皇后和威斯特-弗尔德学院
Publication of HK1040473A1 publication Critical patent/HK1040473A1/xx
Publication of HK1040473B publication Critical patent/HK1040473B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Heat Treatment Processes (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Making Paper Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
HK02101746.3A 1998-07-08 1999-07-08 热控制器件以及制造这种器件的方法 HK1040473B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GB9814835.6 1998-07-08
GBGB9814835.6A GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GB9825376.8 1998-11-19
GBGB9825376.8A GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board
GB9900924 1999-01-15
GB9900924.3 1999-01-15
PCT/GB1999/002180 WO2000003567A1 (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device

Publications (2)

Publication Number Publication Date
HK1040473A1 HK1040473A1 (en) 2002-06-07
HK1040473B true HK1040473B (zh) 2005-05-27

Family

ID=27269389

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02101746.3A HK1040473B (zh) 1998-07-08 1999-07-08 热控制器件以及制造这种器件的方法

Country Status (17)

Country Link
US (2) US6514616B1 (enExample)
EP (2) EP1492396A3 (enExample)
JP (1) JP2002520863A (enExample)
KR (1) KR100707155B1 (enExample)
CN (1) CN1184866C (enExample)
AT (1) ATE277497T1 (enExample)
AU (1) AU4790799A (enExample)
CA (1) CA2336889C (enExample)
DE (1) DE69920459T2 (enExample)
DK (1) DK1095545T3 (enExample)
ES (1) ES2229727T3 (enExample)
GB (2) GB9814835D0 (enExample)
HK (1) HK1040473B (enExample)
PT (1) PT1095545E (enExample)
RU (1) RU2214698C2 (enExample)
SI (1) SI1095545T1 (enExample)
WO (1) WO2000003567A1 (enExample)

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KR100468122B1 (ko) * 2002-07-08 2005-01-26 삼성전자주식회사 전자렌지
US20070090519A1 (en) * 2003-05-01 2007-04-26 Carter Antony A Encased thermal management device and method of making such a device
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
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KR100792056B1 (ko) * 2004-01-08 2008-01-04 히다치 가세고교 가부시끼가이샤 폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물
US7918591B2 (en) 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US7797808B2 (en) * 2005-10-11 2010-09-21 General Electric Company Thermal management system and associated method
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
US7297399B2 (en) * 2005-10-11 2007-11-20 General Electric Company Thermal transport structure and associated method
GB2432830A (en) * 2005-12-02 2007-06-06 Morganite Elect Carbon Formation of thermally anisotropic carbon material
US20070251456A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc., A Delaware Corporation Composite heater and chill plate
US8148647B2 (en) * 2006-08-23 2012-04-03 Mitsubishi Electric Corporation Printed circuit board and method of manufacturing the same
GB0700917D0 (en) * 2007-01-17 2007-02-28 Queen Mary & Westfield College Structures with improved properties
US7808787B2 (en) * 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
US20090169410A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a thermo pyrolytic graphite-embedded heatsink
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WO2010065035A1 (en) * 2008-12-04 2010-06-10 Hewlett-Packard Development Company, L.P. Carbon laminated enclosure
US7903418B2 (en) 2009-04-21 2011-03-08 Hewlett-Packard Development Company, L.P. Thermal mitigation device and method
MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
DE102009035850A1 (de) * 2009-07-31 2011-02-03 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leiterplattenordnung mit Keramikplatte und Grafitschicht
GB0917098D0 (en) 2009-09-29 2009-11-11 Morganite Elect Carbon Carbon materials
JP5035356B2 (ja) * 2010-01-26 2012-09-26 株式会社デンソー 樹脂封止型電子装置およびその製造方法
RU2474004C1 (ru) * 2011-08-16 2013-01-27 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ изготовления многоуровневых тонкопленочных микросхем
JP5619830B2 (ja) * 2011-08-24 2014-11-05 パナソニック株式会社 樹脂−反磁性物質複合構造体、その製造方法、およびそれを用いた半導体装置
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
CN108218428A (zh) * 2014-01-26 2018-06-29 太仓斯迪克新材料科技有限公司 用于平板电脑均热贴片的制造方法
US20180229825A1 (en) * 2014-05-01 2018-08-16 Blue Robotics Inc. Submersible electric thruster
WO2017159528A1 (ja) * 2016-03-14 2017-09-21 パナソニックＩｐマネジメント株式会社 複合シートおよびこれを用いた電池パック
US10736222B2 (en) 2016-06-29 2020-08-04 AT&S Austria Technologies & Systemtechnik Aktiengesellschaft Cooling component carrier material by carbon structure within dielectric shell
CN207939941U (zh) * 2018-03-27 2018-10-02 京东方科技集团股份有限公司 用于显示面板的散热装置和显示装置
CN110147127A (zh) * 2019-05-24 2019-08-20 珠海格力智能装备有限公司 控制系统及方法
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Also Published As

Publication number Publication date
SI1095545T1 (en) 2005-02-28
CN1184866C (zh) 2005-01-12
PT1095545E (pt) 2005-01-31
EP1492396A2 (en) 2004-12-29
JP2002520863A (ja) 2002-07-09
CA2336889C (en) 2008-09-30
CA2336889A1 (en) 2000-01-20
US20030099836A1 (en) 2003-05-29
RU2214698C2 (ru) 2003-10-20
EP1095545A1 (en) 2001-05-02
US6514616B1 (en) 2003-02-04
US6689471B2 (en) 2004-02-10
ATE277497T1 (de) 2004-10-15
AU4790799A (en) 2000-02-01
KR100707155B1 (ko) 2007-04-16
EP1095545B1 (en) 2004-09-22
DE69920459D1 (de) 2004-10-28
DK1095545T3 (da) 2005-01-24
EP1492396A3 (en) 2005-07-27
GB9814835D0 (en) 1998-09-09
KR20010079508A (ko) 2001-08-22
ES2229727T3 (es) 2005-04-16
WO2000003567A1 (en) 2000-01-20
HK1040473A1 (en) 2002-06-07
GB9825376D0 (en) 1999-01-13
DE69920459T2 (de) 2005-10-13
CN1313023A (zh) 2001-09-12

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Effective date: 20090708