RU2016119458A - Гибко оборачиваемый кристалл интегральной схемы - Google Patents
Гибко оборачиваемый кристалл интегральной схемы Download PDFInfo
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- RU2016119458A RU2016119458A RU2016119458A RU2016119458A RU2016119458A RU 2016119458 A RU2016119458 A RU 2016119458A RU 2016119458 A RU2016119458 A RU 2016119458A RU 2016119458 A RU2016119458 A RU 2016119458A RU 2016119458 A RU2016119458 A RU 2016119458A
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- integrated circuit
- chip
- substrate
- flexible
- device based
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- 239000013078 crystal Substances 0.000 title claims 12
- 238000010586 diagram Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims 26
- 229910000679 solder Inorganic materials 0.000 claims 8
- 230000004927 fusion Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
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- Ceramic Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Claims (38)
1. Устройство на основе кристалла интегральной схемы, содержащее:
подложку; и
гибкий кристалл интегральной схемы, соединенный с подложкой, по существу, в вертикальной ориентации относительно поверхности подложки.
2. Устройство на основе кристалла интегральной схемы по п. 1, в котором имеющий криволинейную форму кристалл интегральной схемы содержит сегментированный материал подложки, содержащий множество связанных сегментов.
3. Устройство на основе кристалла интегральной схемы по п. 1, в котором имеющий криволинейную форму кристалл интегральной схемы содержит активную сторону и неактивную сторону.
4. Устройство на основе кристалла интегральной схемы по п. 3, в котором активная сторона кристалла содержит дополнительную относительно неактивной стороны электронную схему.
5. Устройство на основе кристалла интегральной схемы по п. 1, дополнительно содержащее проволочные перемычки, соединяющие электронную схему на имеющем криволинейную форму кристалле интегральной схеме со схемой на подложке.
6. Устройство на основе кристалла интегральной схемы по п. 1, дополнительно содержащее по меньшей мере один кристалл интегральной схемы, соединенный с подложкой, по существу, в горизонтальной ориентации относительно гибкого кристалла интегральной схемы, причем имеющий криволинейную форму кристалл интегральной схемы обернут вокруг по меньшей мере части периферии указанного по меньшей мере одного кристалла интегральной схемы.
7. Устройство на основе кристалла интегральной схемы по п. 6, в котором электронная схема на имеющем криволинейную форму кристалле интегральной схемы соединена посредством одной или более проволочных перемычек с указанным по меньшей мере одним кристаллом интегральной схемы.
8. Устройство на основе кристалла интегральной схемы по п. 6, в котором имеющий криволинейную форму кристалл интегральной схемы соединен с подложкой по круговой схеме вокруг периферии указанного по меньшей мере одного кристалла интегральной схемы.
9. Устройство на основе кристалла интегральной схемы по п. 8, в котором концы имеющего криволинейную форму кристалла интегральной схемы соединены друг с другом.
10. Устройство на основе кристалла интегральной схемы по п. 1, дополнительно содержащее экран, выполненный на неактивной стороне имеющего криволинейную форму кристалла интегральной схемы.
11. Устройство на основе гибко оборачиваемого кристалла интегральной схемы, содержащее:
подложку;
кристалл интегральной схемы, прикрепленный к подложке; и
гибкий кристалл интегральной схемы, причем гибкий кристалл интегральной схемы соединен с подложкой по существу в вертикальной ориентации относительно поверхности подложки, при этом гибкий кристалл интегральной схемы, по существу, окружает расположенный на подложке кристалл интегральной схемы по периферии.
12. Устройство на основе гибко оборачиваемого кристалла интегральной схемы по п. 11, в котором кристалл интегральной схемы, соединенный с подложкой, содержит множество расположенных друг на друге кристаллов интегральных схем.
13. Устройство на основе гибко оборачиваемого кристалла интегральной схемы по п. 11, дополнительно содержащее трубку, соединенную с подложкой и, по существу, окружающую гибкий кристалл интегральной схемы.
14. Устройство на основе гибко оборачиваемого кристалла интегральной схемы по п. 11, в котором гибкий кристалл интегральной схемы дополнительно содержит множество контактных площадок, расположенных по нижнему краю гибкого кристалла интегральной схемы в соответствии с определенной схемой, причем каждая из контактных площадок соединена с соответствующим припойным шариком из множества припойных шариков, соединенных с подложкой в соответствии с определенной схемой.
15. Устройство на основе гибко оборачиваемого кристалла интегральной схемы по п. 11, в котором подложка представляет собой часть корпуса, по существу, окружающего устройство на основе гибко оборачиваемого кристалла интегральной схемы.
16. Устройство на основе гибко оборачиваемого кристалла интегральной схемы по п. 11, дополнительно содержащее юстировочные столбики, соединенные с подложкой и выполненные с возможностью совмещения гибкого кристалла интегральной схемы с подложкой.
17. Способ монтажа гибко оборачиваемого кристалла интегральной схемы на подложку, содержащий этапы, на которых:
обеспечивают множество припойных областей, расположенных по определенной схеме на подложке;
совмещают каждую из множества контактных площадок, расположенных по указанной определенной схеме на нижнем крае гибко оборачиваемого кристалла интегральной схемы, с соответствующей из множества припойных областей; и
обеспечивают сплавление каждой из указанного множества контактных площадок с соответствующей одной из множества припойных областей.
18. Способ по п. 17, дополнительно содержащий этапы, на которых:
формируют многоуровневые столбики на гибко оборачиваемом кристалле интегральной схемы; и
прикрепляют проволочные перемычки между многоуровневыми столбиками и подложкой.
19. Способ по п. 18, в котором на этапе формирования многоуровневых столбиков укладывают друг на друга множество припойных шариков на припойную площадку гибко оборачиваемого кристалла интегральной схемы.
20. Способ по п. 17, в котором на этапе совмещения каждой из множества контактных площадок используют юстировочные столбики на подложке для совмещения гибко оборачиваемого кристалла интегральной схемы с расположенными на подложке в соответствии с указанной конкретной схемой припойными областями.
21. Способ по п. 17, в котором на этапе совмещения каждой из множества контактных площадок формируют гибко оборачиваемый кристалл интегральной схемы внутри трубки, прикрепленной к подложке.
22. Способ по п. 21, дополнительно содержащий этап, на котором соединяют концы гибкого кристалла интегральной схемы друг с другом посредством одной или более проволочных перемычек.
23. Устройство на основе гибко оборачиваемого кристалла интегральной схемы, содержащее:
корпус, имеющий подложку на нижней поверхности;
гибкий кристалл интегральной схемы, причем гибкий кристалл интегральной схемы соединен с подложкой по существу в вертикальной ориентации относительно поверхности подложки; и
экран, соединенный с гибким кристаллом интегральной схемы.
24. Устройство по п. 23, в котором корпус, по существу, окружает гибкий кристалл интегральной схемы.
25. Устройство по п. 23, в котором корпус содержит теплоотвод.
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PCT/US2013/076397 WO2015094259A1 (en) | 2013-12-19 | 2013-12-19 | Flexibly-wrapped integrated circuit die |
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JP (1) | JP6167375B2 (ru) |
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JP6167375B2 (ja) | 2013-12-19 | 2017-07-26 | インテル・コーポレーション | 集積回路ダイデバイス、柔軟性を伴って包まれた集積回路ダイデバイス、及び、柔軟性を伴って包まれた集積回路ダイを基板に実装する方法 |
KR102157942B1 (ko) | 2014-09-26 | 2020-09-21 | 인텔 코포레이션 | 플렉시블 패키징 아키텍처 |
GB2566029B (en) * | 2017-08-30 | 2022-11-02 | Pragmatic Printing Ltd | Methods and apparatus for manufacturing a plurality of electronic circuits |
WO2020092683A1 (en) * | 2018-10-31 | 2020-05-07 | Avery Dennison Retail Information Services, Llc | Wafer-scale integration with wafers that can be folded into three-dimensional packages |
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JP6167375B2 (ja) | 2013-12-19 | 2017-07-26 | インテル・コーポレーション | 集積回路ダイデバイス、柔軟性を伴って包まれた集積回路ダイデバイス、及び、柔軟性を伴って包まれた集積回路ダイを基板に実装する方法 |
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RU2642170C2 (ru) | 2018-01-24 |
JP6167375B2 (ja) | 2017-07-26 |
WO2015094259A1 (en) | 2015-06-25 |
DE102014116930A1 (de) | 2015-06-25 |
EP3084824A4 (en) | 2017-08-16 |
JP2016537814A (ja) | 2016-12-01 |
CN106030781B (zh) | 2019-06-14 |
EP3084824A1 (en) | 2016-10-26 |
US20170084578A1 (en) | 2017-03-23 |
KR20160074586A (ko) | 2016-06-28 |
US20150214188A1 (en) | 2015-07-30 |
US9515049B2 (en) | 2016-12-06 |
KR101833155B1 (ko) | 2018-02-27 |
CN106030781A (zh) | 2016-10-12 |
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