RU2004108042A - Электронный контур, содержащий проводящие перемычки, и способ изготовления таких перемычек - Google Patents

Электронный контур, содержащий проводящие перемычки, и способ изготовления таких перемычек

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Publication number
RU2004108042A
RU2004108042A RU2004108042/09A RU2004108042A RU2004108042A RU 2004108042 A RU2004108042 A RU 2004108042A RU 2004108042/09 A RU2004108042/09 A RU 2004108042/09A RU 2004108042 A RU2004108042 A RU 2004108042A RU 2004108042 A RU2004108042 A RU 2004108042A
Authority
RU
Russia
Prior art keywords
substrate
conductive layer
conductive
electronic circuit
segment
Prior art date
Application number
RU2004108042/09A
Other languages
English (en)
Other versions
RU2296440C2 (ru
Inventor
Франсуа ДРОЗ (CH)
Франсуа ДРОЗ
Original Assignee
Награид Са (Ch)
Награид Са
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Награид Са (Ch), Награид Са filed Critical Награид Са (Ch)
Publication of RU2004108042A publication Critical patent/RU2004108042A/ru
Application granted granted Critical
Publication of RU2296440C2 publication Critical patent/RU2296440C2/ru

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Structure Of Printed Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electronic Switches (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Claims (7)

1. Электронная схема, содержащая, по меньшей мере, один электронный элемент (6), выполненную из гибкого изолирующего материала подложку (5), по меньшей мере, один адгезионный слой и проводящий слой с множеством дорожек (4), причем электронный элемент (6) содержит, по меньшей мере, две соединительные зоны (7), по меньшей мере, одна из которых электрически соединена с проводящим слоем посредством проводящей перемычки, отличающаяся тем, что подложка содержит, по меньшей мере, одну полоску (2, 3) преимущественно прямоугольной формы, созданную путем прорезания подложки (5) по трем сторонам полоски, причем оставшаяся сторона полоски связана с подложкой (5), а перемычка образована проводящим сегментом (1), выделенным из проводящего слоя, свободным от любого клеящего вещества, проведенным сквозь подложку через один из вырезов, которые образованы за счет формирования полосок (2, 3), и соединенным с соединительной зоной (7).
2. Электронная схема по п.1, отличающаяся тем, что подложка (5) имеет первую поверхность с первым адгезионным слоем и первым проводящим слоем, а также вторую поверхность со вторым адгезионным слоем и вторым проводящим слоем, причем перемычка образована проводящим сегментом (1), выделенным только из второго проводящего слоя, свободным от клеящего вещества, проходящим сквозь подложку (5) через один из вырезов, которые образованы за счет формирования полосок (2, 3), и соединенным с соединительной зоной (7) и/или первым проводящим слоем.
3. Электронная схема, по п.1 или 2, отличающаяся тем, что несколько перемычек, образованных сегментами (1) дорожек, проведено сквозь подложку (5) через один и тот же вырез.
4. Электронная схема, по п.1 или 2, отличающаяся тем, что, по меньшей мере, одна перемычка, образованная сегментами (1) дорожек, проведена через подложку (5) столько раз, сколько необходимо для пересечения дорожек (4), принадлежащих проводящему слою, чтобы обеспечить соединение с соединительной зоной (7).
5. Электронная этикетка, отличающаяся тем, что содержит электронную схему согласно любому из пп.1-4.
6. Способ изготовления электронной схемы, содержащей подложку (5), образованную из гибкого изолирующего материала, по меньшей мере, один адгезионный слой и проводящий слой с множеством дорожек (4), а также электронный элемент (6), отличающийся тем, что выполнение перемычки между зоной проводящего слоя и целевой соединительной зоной (7) осуществляют посредством следующих операций:
продлевают дорожку в проводящем слое для образования проводящего сегмента (1),
вырезают в подложке (5) полоску преимущественно прямоугольной формы, одна из сторон которой связана с подложкой (5),
временно открывают вырез в подложке путем отжатия полоски (2, 3), которую отгибают по стороне, связанной с подложкой (5),
проводят проводящий сегмент (1) через указанный вырез,
сгибают проводящий сегмент (1), располагая его на противоположной поверхности подложки (5),
закрывают вырез после проводки проводящего сегмента (1) возвращением полоски в первоначальное положение на уровне подложки (5),
соединяют проводящий сегмент (1) с целевой соединительной зоной (7).
7. Способ по п.6, отличающийся тем, что целевая соединительная зона расположена на проводящем слое, и проводящий сегмент (1) возвращают к указанному проводящему слою посредством его повторной проводки сквозь подложку через вырез, образованный при формировании дополнительной полоски (2, 3), а затем закрепляют сегмент (1) на подложке (5) активацией клея, входящего в состав адгезионного слоя.
RU2004108042/09A 2001-10-01 2002-10-01 Электронная схема с проводящими перемычками и способ изготовления таких перемычек RU2296440C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1798/01 2001-10-01
CH17982001 2001-10-01

Publications (2)

Publication Number Publication Date
RU2004108042A true RU2004108042A (ru) 2005-09-20
RU2296440C2 RU2296440C2 (ru) 2007-03-27

Family

ID=4566320

Family Applications (1)

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RU2004108042/09A RU2296440C2 (ru) 2001-10-01 2002-10-01 Электронная схема с проводящими перемычками и способ изготовления таких перемычек

Country Status (15)

Country Link
US (1) US7071422B2 (ru)
EP (1) EP1433368B1 (ru)
JP (1) JP3978730B2 (ru)
CN (1) CN100357967C (ru)
AT (1) ATE285664T1 (ru)
AU (1) AU2002334330B2 (ru)
BR (1) BRPI0213069B1 (ru)
CA (1) CA2462252C (ru)
DE (1) DE60202380T2 (ru)
ES (1) ES2235112T3 (ru)
MX (1) MXPA04002693A (ru)
PT (1) PT1433368E (ru)
RU (1) RU2296440C2 (ru)
WO (1) WO2003030601A1 (ru)
ZA (1) ZA200402146B (ru)

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Also Published As

Publication number Publication date
DE60202380T2 (de) 2005-12-08
AU2002334330B2 (en) 2007-06-07
ZA200402146B (en) 2005-07-27
PT1433368E (pt) 2005-05-31
US20040238212A1 (en) 2004-12-02
CA2462252A1 (en) 2003-04-10
DE60202380D1 (de) 2005-01-27
WO2003030601A1 (fr) 2003-04-10
ES2235112T3 (es) 2005-07-01
CA2462252C (en) 2011-11-29
CN100357967C (zh) 2007-12-26
BR0213069A (pt) 2004-09-28
EP1433368B1 (fr) 2004-12-22
CN1561657A (zh) 2005-01-05
US7071422B2 (en) 2006-07-04
JP3978730B2 (ja) 2007-09-19
BRPI0213069B1 (pt) 2015-08-18
RU2296440C2 (ru) 2007-03-27
MXPA04002693A (es) 2004-06-18
ATE285664T1 (de) 2005-01-15
JP2005523572A (ja) 2005-08-04
EP1433368A1 (fr) 2004-06-30

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