PT886299E - Dispositivo e processo para a remocao de folhas - Google Patents

Dispositivo e processo para a remocao de folhas

Info

Publication number
PT886299E
PT886299E PT98110700T PT98110700T PT886299E PT 886299 E PT886299 E PT 886299E PT 98110700 T PT98110700 T PT 98110700T PT 98110700 T PT98110700 T PT 98110700T PT 886299 E PT886299 E PT 886299E
Authority
PT
Portugal
Prior art keywords
replacing sheets
replacing
sheets
Prior art date
Application number
PT98110700T
Other languages
English (en)
Inventor
Tsujimoto Masaki
Saito Hiroshi
Okamoto Koji
Kobayashi Kenji
Kurita Tsuyoshi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP18066997A external-priority patent/JP4204653B2/ja
Priority claimed from JP34189597A external-priority patent/JP4204658B2/ja
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PT886299E publication Critical patent/PT886299E/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y10S156/942—Means for delaminating semiconductive product with reorientation means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
PT98110700T 1997-06-20 1998-06-10 Dispositivo e processo para a remocao de folhas PT886299E (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18066997A JP4204653B2 (ja) 1997-06-20 1997-06-20 シート剥離装置および方法
JP34189597A JP4204658B2 (ja) 1997-11-28 1997-11-28 シート剥離装置および方法

Publications (1)

Publication Number Publication Date
PT886299E true PT886299E (pt) 2006-05-31

Family

ID=26500121

Family Applications (1)

Application Number Title Priority Date Filing Date
PT98110700T PT886299E (pt) 1997-06-20 1998-06-10 Dispositivo e processo para a remocao de folhas

Country Status (9)

Country Link
US (1) US6149758A (pt)
EP (1) EP0886299B1 (pt)
KR (1) KR100507259B1 (pt)
CN (1) CN1089946C (pt)
DE (1) DE69833237T2 (pt)
MY (1) MY126552A (pt)
PT (1) PT886299E (pt)
SG (1) SG75851A1 (pt)
TW (1) TW396366B (pt)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100278137B1 (ko) * 1997-09-04 2001-01-15 가나이 쓰도무 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
JP3560823B2 (ja) * 1998-08-18 2004-09-02 リンテック株式会社 ウェハ転写装置
JP3348700B2 (ja) * 1999-08-19 2002-11-20 株式会社東京精密 エッチング装置
JP4166920B2 (ja) 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
US20030037877A1 (en) * 2000-10-18 2003-02-27 Fritz Brinkmann Delabelling method and device for carrying out said method
JP2003152058A (ja) * 2001-11-13 2003-05-23 Lintec Corp ウェハ転写装置
KR100850459B1 (ko) * 2002-09-19 2008-08-07 삼성테크윈 주식회사 테이프 절단장치 및 이를 이용한 테이프 절단방법
JP4318471B2 (ja) * 2003-03-05 2009-08-26 日東電工株式会社 保護テープの貼付・剥離方法
JP4494753B2 (ja) * 2003-10-27 2010-06-30 リンテック株式会社 シート剥離装置及び剥離方法
WO2006003816A1 (ja) * 2004-07-02 2006-01-12 Sharp Kabushiki Kaisha フィルム剥離方法と装置
JP4564832B2 (ja) * 2004-11-30 2010-10-20 株式会社ディスコ 矩形基板の分割装置
JP4795743B2 (ja) * 2005-05-19 2011-10-19 リンテック株式会社 貼付装置
JP2007043057A (ja) * 2005-07-07 2007-02-15 Lintec Corp シート貼付用テーブル
JP2007036111A (ja) * 2005-07-29 2007-02-08 Tokyo Seimitsu Co Ltd フィルム剥離方法およびフィルム剥離装置
JP2007109927A (ja) * 2005-10-14 2007-04-26 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離方法および表面保護フィルム剥離装置
JP6343114B2 (ja) 2007-03-09 2018-06-13 ネクサス バイオシステムズ，インク． 剥離シールの除去装置および方法
JP5305604B2 (ja) * 2007-03-16 2013-10-02 株式会社東芝 粘着フィルムの剥離装置及び液晶パネルの製造方法
JP2008270543A (ja) * 2007-04-20 2008-11-06 Disco Abrasive Syst Ltd 接着フィルムの貼着方法
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
SG148884A1 (en) * 2007-06-15 2009-01-29 Micron Technology Inc Method and system for removing tape from substrates
JP5074125B2 (ja) * 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
JP4740297B2 (ja) * 2008-09-04 2011-08-03 リンテック株式会社 マウント装置及びマウント方法
KR20120027237A (ko) * 2009-04-16 2012-03-21 수스 마이크로텍 리소그라피 게엠바하 웨이퍼 가접합 및 분리를 위한 개선된 장치
JP5317280B2 (ja) * 2009-07-16 2013-10-16 株式会社タカトリ 保護テープの剥離装置
JP2011054641A (ja) * 2009-08-31 2011-03-17 Nitto Denko Corp 被切断体からのダイシング表面保護テープの剥離除去方法
US8710458B2 (en) * 2010-10-19 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. UV exposure method for reducing residue in de-taping process
JP5778116B2 (ja) * 2012-11-05 2015-09-16 日東電工株式会社 粘着シート貼付け方法および粘着シート貼付け装置
NL2012668B1 (en) * 2014-04-23 2016-07-04 Vmi Holland Bv Foil removal device and a method for removing a foil from a tire tread.
CN105059999A (zh) * 2015-07-13 2015-11-18 苏州经贸职业技术学院 一种胶带剥离装置
TWI629770B (zh) * 2016-08-09 2018-07-11 陽程科技股份有限公司 Method for separating flexible display from carrier substrate
KR102424743B1 (ko) * 2017-10-13 2022-07-26 삼성디스플레이 주식회사 보호 필름 박리 장치 및 보호 필름 박리 방법
CN110370153B (zh) * 2019-06-10 2021-07-13 浙江晶盛机电股份有限公司 一种用于抛光设备的上定盘晶片剥离装置
JP6769689B1 (ja) * 2019-06-28 2020-10-14 東芝三菱電機産業システム株式会社 剥離把持装置、剥離検査装置及び超音波振動接合システム
EP4285403A2 (de) 2021-01-29 2023-12-06 PINK GmbH Thermosysteme Anlage und verfahren zum verbinden von elektronischen baugruppen

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2030991B (en) * 1977-02-09 1982-11-24 Nitto Electric Ind Co Heat activatable pressuresensitive adhesive tape of sheet
US4285759A (en) * 1979-11-19 1981-08-25 E. I. Du Pont De Nemours And Company Apparatus for stripping a cover sheet
JPS59174677A (ja) * 1983-03-24 1984-10-03 Nitto Electric Ind Co Ltd 保護フイルムの剥離方法
JPS60250642A (ja) * 1984-05-25 1985-12-11 Nitto Electric Ind Co Ltd 保護フイルムの剥離方法
JPS60218257A (ja) * 1984-04-10 1985-10-31 Nitto Electric Ind Co Ltd 保護フイルムの剥離方法
JPH0691153B2 (ja) * 1987-11-28 1994-11-14 日東電工株式会社 保護フイルムの剥離方法
JPH0682750B2 (ja) * 1989-08-30 1994-10-19 日東電工株式会社 ウエハ保護シートの剥離方法
US5006190A (en) * 1990-02-05 1991-04-09 Motorola, Inc. Film removal method
JPH04336428A (ja) * 1991-05-13 1992-11-24 Nitto Denko Corp ウエハのテープ貼合わせ剥離装置
JP3156419B2 (ja) * 1993-02-15 2001-04-16 松下電器産業株式会社 異方性導電フィルム保護用セパレータの剥離方法
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
KR19980042878U (ko) * 1996-12-24 1998-09-25 문정환 웨이퍼 연마용 테이프 제거장치

Also Published As

Publication number Publication date
MY126552A (en) 2006-10-31
EP0886299B1 (en) 2006-01-18
EP0886299A2 (en) 1998-12-23
SG75851A1 (en) 2000-10-24
KR19990007148A (ko) 1999-01-25
CN1203181A (zh) 1998-12-30
CN1089946C (zh) 2002-08-28
TW396366B (en) 2000-07-01
EP0886299A3 (en) 2003-09-10
DE69833237D1 (de) 2006-04-06
DE69833237T2 (de) 2006-07-20
KR100507259B1 (ko) 2005-10-24
US6149758A (en) 2000-11-21

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