PL3696555T3 - Urządzenie sondy o konstrukcji pływającej - Google Patents

Urządzenie sondy o konstrukcji pływającej

Info

Publication number
PL3696555T3
PL3696555T3 PL20157335.9T PL20157335T PL3696555T3 PL 3696555 T3 PL3696555 T3 PL 3696555T3 PL 20157335 T PL20157335 T PL 20157335T PL 3696555 T3 PL3696555 T3 PL 3696555T3
Authority
PL
Poland
Prior art keywords
floating structure
probe device
probe
floating
Prior art date
Application number
PL20157335.9T
Other languages
English (en)
Inventor
Ki Sool Nah
Original Assignee
Phoenixon Controls Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenixon Controls Inc. filed Critical Phoenixon Controls Inc.
Publication of PL3696555T3 publication Critical patent/PL3696555T3/pl

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PL20157335.9T 2019-02-15 2020-02-14 Urządzenie sondy o konstrukcji pływającej PL3696555T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190017522A KR102158735B1 (ko) 2019-02-15 2019-02-15 플로팅 구조의 프로브 장치

Publications (1)

Publication Number Publication Date
PL3696555T3 true PL3696555T3 (pl) 2022-07-25

Family

ID=69593594

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20157335.9T PL3696555T3 (pl) 2019-02-15 2020-02-14 Urządzenie sondy o konstrukcji pływającej

Country Status (6)

Country Link
US (1) US11320460B2 (pl)
EP (1) EP3696555B1 (pl)
JP (2) JP2020134529A (pl)
KR (1) KR102158735B1 (pl)
CN (1) CN111584379B (pl)
PL (1) PL3696555T3 (pl)

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812137Y2 (ja) 1978-04-11 1983-03-08 松下電器産業株式会社 電気機器の試験装置
EP0331163A1 (de) * 1988-03-04 1989-09-06 Manfred Prokopp Kontaktiervorrichtung für Prüfvorrichtungen zum Prüfen von Leiterplatten oder dgl.
JPH03185847A (ja) * 1989-12-15 1991-08-13 Toshiba Corp ユニバーサルプローブカード
JP2000150594A (ja) * 1998-11-05 2000-05-30 Hitachi Ltd 接続装置および押さえ部材付配線フィルムの製造方法並びに検査システムおよび半導体素子の製造方法
US6422886B1 (en) * 2000-10-27 2002-07-23 Agilent Technologies, Inc. Method and apparatus for aligning and electrically connecting mating connectors
JP2002228705A (ja) 2001-02-02 2002-08-14 Nec Yamagata Ltd コンタクト機構および半導体装置の検査方法
JP3587301B2 (ja) 2001-06-20 2004-11-10 株式会社エンプラス 電気部品用ソケット
JP3981042B2 (ja) * 2003-06-09 2007-09-26 アルプス電気株式会社 コンタクトプローブ及びプローブソケット及び電気特性測定装置並びにコンタクトプローブの押し当て方法
KR100541730B1 (ko) 2003-06-26 2006-01-10 삼성전자주식회사 반도체소자 검사장치
EP1580562B1 (en) * 2004-03-24 2007-10-24 Technoprobe S.p.A Contact probe for a testing head
US7161369B2 (en) 2004-10-29 2007-01-09 Agilent Technologies, Inc. Method and apparatus for a wobble fixture probe for probing test access point structures
US7268567B2 (en) * 2005-02-04 2007-09-11 Research In Motion Limited Probe assembly with multi-directional freedom of motion and mounting assembly therefor
DE102007015284A1 (de) * 2007-03-29 2008-10-02 Qimonda Ag Testvorrichtung für Halbleiterbauelemente
KR101334458B1 (ko) 2007-07-20 2013-11-29 주식회사 미코 프로브 구조물과 형성 방법
JP2009115664A (ja) * 2007-11-07 2009-05-28 Yunikon Kk 電子部品とプローブカードの接触におけるセルフアライメント機構
US7507110B1 (en) 2008-03-25 2009-03-24 Cheng Uei Precision Industry Co., Ltd. Probe connector
JP2010014544A (ja) * 2008-07-03 2010-01-21 Masashi Okuma 外ばね方式のプローブピンの製造方法
US8269516B1 (en) 2009-04-03 2012-09-18 Xilinx, Inc. High-speed contactor interconnect with circuitry
KR100919394B1 (ko) * 2009-05-19 2009-09-29 에버테크노 주식회사 에스에스디(ｓｓｄ)용 소켓장치
JP5488874B2 (ja) * 2009-07-16 2014-05-14 国立大学法人東北大学 集積回路基板用検査装置
JP5197754B2 (ja) 2009-11-13 2013-05-15 テスト ツーリング ソリューションズ グループ ピイ ティ イー リミテッド プローブピン
JP4873759B2 (ja) 2009-12-25 2012-02-08 Ｓｍｋ株式会社 レセプタクルとコンタクトプローブの嵌合方法及びこの方法に使用されるコンタクトプローブ
JP5597108B2 (ja) * 2010-11-29 2014-10-01 株式会社精研 接触検査用治具
JP2013024684A (ja) 2011-07-20 2013-02-04 Mitsubishi Electric Corp 検査治具および検査装置
JP5280511B2 (ja) * 2011-09-05 2013-09-04 株式会社島野製作所 接触端子
JP6040532B2 (ja) * 2012-01-26 2016-12-07 日本電産リード株式会社 プローブ及び接続治具
JP2014032111A (ja) * 2012-08-03 2014-02-20 Nidec-Read Corp 検査治具
JP6251912B2 (ja) 2014-12-26 2017-12-27 ヒロセ電機株式会社 同軸プローブ
JP2017090435A (ja) 2015-11-05 2017-05-25 日置電機株式会社 プロービング機構、プローブユニットおよび基板検査装置
JP6556612B2 (ja) 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR20180052210A (ko) 2016-11-10 2018-05-18 삼성중공업 주식회사 구난용 선박
KR102371540B1 (ko) * 2016-11-11 2022-03-08 세메스 주식회사 반도체 소자 테스트 장치
WO2018116568A1 (ja) * 2016-12-22 2018-06-28 株式会社村田製作所 プローブ構造
JP2018194411A (ja) 2017-05-17 2018-12-06 株式会社ヨコオ コンタクトプローブ及び検査用治具

Also Published As

Publication number Publication date
US20200264211A1 (en) 2020-08-20
EP3696555B1 (en) 2022-05-11
US11320460B2 (en) 2022-05-03
EP3696555A3 (en) 2020-09-09
JP7254381B2 (ja) 2023-04-10
CN111584379B (zh) 2023-10-03
CN111584379A (zh) 2020-08-25
JP2022000660A (ja) 2022-01-04
JP2020134529A (ja) 2020-08-31
EP3696555A2 (en) 2020-08-19
KR102158735B1 (ko) 2020-09-22
KR20200099659A (ko) 2020-08-25

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