EP1580562B1 - Contact probe for a testing head - Google Patents
Contact probe for a testing head Download PDFInfo
- Publication number
- EP1580562B1 EP1580562B1 EP04425205A EP04425205A EP1580562B1 EP 1580562 B1 EP1580562 B1 EP 1580562B1 EP 04425205 A EP04425205 A EP 04425205A EP 04425205 A EP04425205 A EP 04425205A EP 1580562 B1 EP1580562 B1 EP 1580562B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- probe
- section
- testing head
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000523 sample Substances 0.000 title claims abstract description 137
- 238000012360 testing method Methods 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims description 22
- 239000011295 pitch Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Definitions
- the present invention relates to a testing head effective to test a plurality of semiconductor-integrated electronic devices comprising a plurality of so-called contact pads.
- the invention relates to a testing head effective to test a plurality of semiconductor-integrated electronic devices, said probe comprising a rod-like probe body having a rectangular cross section and provided in correspondence with at least one end with an eccentric contact tip.
- the invention relates to a method for realising a contact probe of the type comprising at least one rod-like probe body having a rectangular cross section and provided in correspondence with at least one tip portion with an eccentric contact tip.
- the invention particularly, but not exclusively, relates to a testing head having vertical probes for testing semiconductor-integrated electronic devices and the following description is made with reference to this field of application for convenience of illustration only.
- a testing head is essentially a device effective to electrically interconnect a plurality of contact pads of a semiconductor-integrated electronic device with corresponding channels of a testing machine which performs the test thereof.
- testing heads are thus used for the electric test of the semiconductor-integrated electronic devices, or integrated on a silicon wafer, before cutting and assembling the same inside a package for containing chips.
- connection between the testing apparatus and the contact pads of the tested integrated electronic device being tested is carried out by using a plurality of contact elements or probes.
- these contact probes are normally made of wires of a special alloy having good electrical and mechanical properties.
- a testing head having vertical probes comprises at least a pair of dies or plate-like parallel holders placed at a certain distance from one another in order to leave an air gap as well as a plurality of contact probes.
- Each plate-like holder called die in the technical field here considered and hereafter in the description, is provided with a respective plurality of through-going guide holes, each hole in one of the dies corresponding to a hole in the other die, wherein a respective contact probe is slidingly engaged and guided.
- the movable contact probes elastically flex inside the air gap between the two dies.
- a testing head 1 of the known type comprises at least an upper die 2 and a lower die 3, having respective upper 4 and lower 5 through-going guide holes wherein at least one contact probe 6 is slidingly engaged.
- the contact probe 6 has a contact end or tip 7.
- the contact tip 7 is in mechanical contact with a contact pad 8 of an integrated electronic device to be tested, performing at the same time the electrical contact between said device and a testing apparatus (not shown) of which this testing head is a terminal element.
- the upper 2 and lower 3 dies are suitably spaced from an air gap 9 which allows the deformation or inclination of the contact probes 6 during the normal operation of the testing head, i.e. when this testing head comes into contact with the integrated electronic device to be tested.
- the upper 4 and lower 5 guide holes are sized in order to guide the contact probe 6.
- Figure 1 schematically indicates a testing head 1 having loose-fitting probes associated with a micro-contact strip or space transformer, globally indicated with 10.
- the contact probes 6 have a further contact tip towards a plurality of contact pads 11 of the space transformer 10, the good electrical contact between probes and space transformer 10 being ensured in a similar way to the contact with the integrated electronic device to be tested through the pressure of the probes 6 on the contact pads 11 of the space transformer 10.
- the technological development and the miniaturisation of the chips requires the continuous reduction of the pitch of the integrated electronic device to be tested, and thus the distance between two adjacent probes 6 of the testing head which performs the test thereof.
- a probe system for electrical contact testing of a row of densely spaced wire bonding pads is describe in US Patent No. 6,411,112 issued on June 25, 2002 to Das et al . (IBM).
- testing head 30 shown in Figure 3 comprises an upper die 12A and a lower die 12B having respective guide holes 13A and 13B effective to house a contact probe 14.
- the contact probes 14 have contact tips 15 intended for abutting on a plurality of contact pads 16 of an integrated electronic device to be tested, schematically indicated with 17.
- the testing head 30 shown in Figure 3 comprises loose-fitting probes having a further end 18 in contact with a micro-contact strip or space transformer 19.
- a rigid arm 20 extends along a direction being perpendicular or sloping of a suitable angle with respect to the probe 14, i.e. it has an axis B-B being perpendicular or sloping with respect to an axis A-A of the contact probe 14, and it ends with the contact tip 15 of the probe 14 for the contact pads 16 of the integrated electronic device 17 to be tested.
- the contact between the tip 15 of the probe 14 and the pad 16 is spaced of a value Z with respect to the axis A-A of the contact probe 14 itself thus allowing to reduce the value of the minimum pitch of the contact tips 15 and making it possible to test integrated electronic devices with contact pads 16 with close contact centres C, i.e. reduced pitches, Z being the distance between the axis AA and a parallel axis passing through the contact centre C of the probe.
- the testing head 30 realised according to the prior art has different drawbacks.
- the method for realising the contact probe has thus to provide a deformation step which must be very precise and repeatable, in order to guarantee the fittingness of all the probes belonging to a same testing head.
- the total space of the contact probe thus realised suffers from the longitudinal size D introduced by the rigid arm 20.
- the technical problem underlying the present invention is that of devising a contact probe having a simple configuration and not needing deformation operations of the body of the probe itself, effective to ensure a good electrical contact with an integrated electronic device to be tested, and in the meantime to allow the reduction of the minimum value of the distance between adjacent probes in a testing head and thus also the pitch of the contact pads of the integrated electronic devices to be tested.
- the solution idea underlying the present invention is that of providing a testing head comprising contact probes having an eccentric contact tip positioned at one edge of the rectangular cross section of the probe body.
- Figure 4B shows an enlarged view of the sole end or tip 42 portion of the probe, in correspondence with a contact tip P effective to put into contact a contact pad of a device to be tested (not shown).
- the contact probe 40 has a substantially rod-like probe body 41 having axis XX and cross section of prefixed contour.
- the probe body 41 is provided in correspondence with at least one end with an eccentric contact tip P.
- the contact tip P of the probe 40 is positioned within the contour of the cross section of the probe body 41, as shown in Figure 4B where the projection P' of the contact tip P in correspondence with a section plane ⁇ has been indicated.
- “contour” of the cross section of the probe body means, in a general way, the envelope of this section defining the maximum space of the probe body, this envelope non coinciding with the geometrical perimeter of the section in the case of conformations being particular, lobed or provided with convex angles.
- the word “contour” indicates the union of the different sections, once again defining the maximum space of the probe body.
- the tip 42 portion thus defines a tip P decentralised with respect to the axis XX of the probe, but it does not increase the total space thereof.
- the contact probe 40 with eccentric contact tip P has a different space with respect to an axis YY parallel to the axis XX passing through the contact tip P.
- a plane ⁇ passing through the axis YY defines a first 40A a second 40B probe portion, these portions having different space and in particular this first portion 40A having an overall space lower than said second portion 40B.
- Figure 5 shows a preferred embodiment of the probe 40, wherein the contact tip P belongs to the contour of the cross section of the probe body.
- the probe 40 has a space being totally lateral with respect to the axis YY and the probes can be close to the maximum, by alternating the arrangement in correspondence with the contact pads, as shown in the Figures 6A and 6B.
- the probes 40 have an axis ZZ of the cross section sloping with respect to an alignment axis WW of the contact pads 50.
- the contact probes 40 are arranged in an alternated way and they suitably slope, in particular according to an angle of 45°. In this way, the distance between the contact probes 40 is ensured also in correspondence with the distribution angles of the contact pads on the four sides of the integrated device to be tested, as shown in Figure 6B, where the pads have alignment axes WW and W'W' being orthogonal one another.
- the contact probes 40 advantageously have non circular section. In this way, by using corresponding guide holes with rectangular section, it is possible to orient the probes as desired in a simple and safe way.
- Figures 4A, 4B and 5 show contact probes with non circular sections, and in particular rectangular, the invention is not limited to these embodiments, traditional probes with circular sections being usable as well as probes with oval sections.
- a testing head comprising a plurality of contact probes having eccentric contact tips and thus portions of different space, suitably orientated in order to alternate these portions of different space, by reducing the minimum safety distance between the probes, thus allowing to close the corresponding contact pads on the device to be tested, i.e. reducing the pitch of this device.
- a testing head comprises at least an upper die and a lower die having respective upper and lower through-going guide holes within which at least one contact probe 40 is slidingly engaged having an eccentric contact tip P.
- the testing head comprises a plurality of contact probes 40 arranged so that probes adjacent with each other have axes ZZ sloping with respect to an alignment axis WW of the contact pads 50 of the device to be tested.
- the axes ZZ of the probes 40 and the alignment axis WW of the contact pads form an angle of 45°, as shown in the Figures 6A and 6B.
- the testing head comprises at least an air gap placed between the dies and effective to allow the contact probe 40 to deform when said contact tip P abuts on the corresponding contact pad of the device to be tested.
- the contact probes 40 have at least a pre-deformed section.
- the invention also makes reference to a method for realising a contact probe of the type comprising at least one probe body and a tip portion wherein an eccentric contact tip of the probe is defined, the method comprising at least one cutting step of the tip portion of the probe according to a plurality of cutting planes sloping with respect to the section plane ⁇ and passing through the eccentric contact tip P.
- the method for realising a contact probe according to the invention advantageously comprises the following steps:
- these cutting planes ⁇ and ⁇ slope of 45° with respect to the section plane ⁇ and they are rotated one another of 90° in order to define the eccentric contact tip P positioned inside the contour of the cross section of the probe body.
- the proposed contact probe with the eccentric tip allows to realise a testing head able to reduce the value of the minimum pitch of the contact tips P, making it thus possible to test integrated electronic devices with contact pads with very close contact centres C, i.e. very reduced pitches.
- the eccentricity of the contact tip P and the longitudinal axis A-A of the contact probe and its positioning inside the contour of the cross section of the probe body as well as a suitable orientation of the probes allow in fact to place the contact probes 40 in an alternatively opposed position with respect to the contact pads thus considerably increasing the space available for realising the guide holes and thus allowing the use of probes with greater diameters than those usable according to the prior art.
- a testing head is thus obtained being more reliable for testing the integrated electronic devices having very little pitches.
- the eccentric contact tip P is realised by means of cutting steps along cutting planes sloping with respect to the section ⁇ and passing through the contact tip P.
- the method according to the invention is extremely simplified in the case of probes having rectangular section needing only two cutting operations carried out along a first ⁇ and a second ⁇ plane sloping with respect to the section plane ⁇ and passing through the contact tip P, which belongs to the contour of the cross section of the probe body.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
- The present invention relates to a testing head effective to test a plurality of semiconductor-integrated electronic devices comprising a plurality of so-called contact pads.
- More specifically the invention relates to a testing head effective to test a plurality of semiconductor-integrated electronic devices, said probe comprising a rod-like probe body having a rectangular cross section and provided in correspondence with at least one end with an eccentric contact tip.
- Finally, the invention relates to a method for realising a contact probe of the type comprising at least one rod-like probe body having a rectangular cross section and provided in correspondence with at least one tip portion with an eccentric contact tip.
- The invention particularly, but not exclusively, relates to a testing head having vertical probes for testing semiconductor-integrated electronic devices and the following description is made with reference to this field of application for convenience of illustration only.
- As it is well known, a testing head is essentially a device effective to electrically interconnect a plurality of contact pads of a semiconductor-integrated electronic device with corresponding channels of a testing machine which performs the test thereof.
- The test carried out on integrated electronic devices is effective to detect and isolate devices already faulty during the manufacturing step. Normally, testing heads are thus used for the electric test of the semiconductor-integrated electronic devices, or integrated on a silicon wafer, before cutting and assembling the same inside a package for containing chips.
- The connection between the testing apparatus and the contact pads of the tested integrated electronic device being tested is carried out by using a plurality of contact elements or probes.
- In particular, these contact probes are normally made of wires of a special alloy having good electrical and mechanical properties.
- The good connection between the probes and the contact pads is also ensured by the pressure of each contact probe on the respective contact pad.
- A testing head having vertical probes comprises at least a pair of dies or plate-like parallel holders placed at a certain distance from one another in order to leave an air gap as well as a plurality of contact probes.
- Each plate-like holder, called die in the technical field here considered and hereafter in the description, is provided with a respective plurality of through-going guide holes, each hole in one of the dies corresponding to a hole in the other die, wherein a respective contact probe is slidingly engaged and guided. In particular, the movable contact probes elastically flex inside the air gap between the two dies.
- Testing heads of this type are commonly called "vertical probes".
- As schematically shown in Figure 1, a
testing head 1 of the known type comprises at least anupper die 2 and alower die 3, having respective upper 4 and lower 5 through-going guide holes wherein at least onecontact probe 6 is slidingly engaged. - The
contact probe 6 has a contact end ortip 7. In particular, thecontact tip 7 is in mechanical contact with acontact pad 8 of an integrated electronic device to be tested, performing at the same time the electrical contact between said device and a testing apparatus (not shown) of which this testing head is a terminal element. - The upper 2 and lower 3 dies are suitably spaced from an
air gap 9 which allows the deformation or inclination of thecontact probes 6 during the normal operation of the testing head, i.e. when this testing head comes into contact with the integrated electronic device to be tested. Moreover, the upper 4 and lower 5 guide holes are sized in order to guide thecontact probe 6. - Figure 1 schematically indicates a
testing head 1 having loose-fitting probes associated with a micro-contact strip or space transformer, globally indicated with 10. - In this case, the
contact probes 6 have a further contact tip towards a plurality ofcontact pads 11 of thespace transformer 10, the good electrical contact between probes andspace transformer 10 being ensured in a similar way to the contact with the integrated electronic device to be tested through the pressure of theprobes 6 on thecontact pads 11 of thespace transformer 10. - A very felt problem in the specific technical field is that of the reduction of the distance which separates the
contact pads 8 of the device being tested, this distance being known in the field as "pitch". - In particular, the technological development and the miniaturisation of the chips requires the continuous reduction of the pitch of the integrated electronic device to be tested, and thus the distance between two
adjacent probes 6 of the testing head which performs the test thereof. -
- Where, as illustrated in Figure 2 which shows a section view of a part of the
testing head 1 according to the prior art: - Pitchmin is the minimum pitch, i.e. the minimum distance between the centres of two
adjacent contact pads 8 of the integrated electronic device to be tested; - E is the value of the cross section axis of the
probe 6. - Wmin is the minimum value of the wall thickness between a
guide hole 4 and 5 and the subsequent, such as to guarantee a certain mechanical strength to the structure of thetesting head 1; and - F is the value of the cross section axis of the
guide hole 4. - In the current vertical technologies, normally using probes having circular cross section, a reduction of the pitch value is obtained by reducing the size of the
probe 6, in particular their minimum axis E (corresponding to the minimum diameter in the case of probes having circular section), being the other factors of the preceding relation practically fixed by the technological limits of realisation of the testing heads. - This solution collides with the need of using
probes 6 having sufficiently high section, able to guarantee a strength of the contact carried out by means of these probes, still miniaturising the contacts. - Moreover, most integrated devices have contact pads arranged on all the four sides of the device to be tested. In this case the arrangement of the probes in correspondence with the device angles is to be taken into account, so as to avoid the contact with one another which would invalidate the outcome of the test performed.
- A probe system for electrical contact testing of a row of densely spaced wire bonding pads is describe in
US Patent No. 6,411,112 issued on June 25, 2002 to Das et al . (IBM). - It is also known from the
Italian patent application No. MI2001A000567 European patent application No. 1243 931 of 15 / 03 / 02 to realise contact probes for testing heads provided with a rigid arm laterally projecting from a probe body, as schematically shown in Figure 3. - In particular, the
testing head 30 shown in Figure 3 comprises anupper die 12A and alower die 12B havingrespective guide holes contact probe 14. - The
contact probes 14 havecontact tips 15 intended for abutting on a plurality ofcontact pads 16 of an integrated electronic device to be tested, schematically indicated with 17. - The
testing head 30 shown in Figure 3 comprises loose-fitting probes having afurther end 18 in contact with a micro-contact strip orspace transformer 19. - A
rigid arm 20 extends along a direction being perpendicular or sloping of a suitable angle with respect to theprobe 14, i.e. it has an axis B-B being perpendicular or sloping with respect to an axis A-A of thecontact probe 14, and it ends with thecontact tip 15 of theprobe 14 for thecontact pads 16 of the integratedelectronic device 17 to be tested. - In this way, the contact between the
tip 15 of theprobe 14 and thepad 16 is spaced of a value Z with respect to the axis A-A of thecontact probe 14 itself thus allowing to reduce the value of the minimum pitch of thecontact tips 15 and making it possible to test integrated electronic devices withcontact pads 16 with close contact centres C, i.e. reduced pitches, Z being the distance between the axis AA and a parallel axis passing through the contact centre C of the probe. - Although advantageous under several aspects, the
testing head 30 realised according to the prior art has different drawbacks. - The first among all stays in the need of deforming the
probe body 21 so as to realise therigid arm 20. The method for realising the contact probe has thus to provide a deformation step which must be very precise and repeatable, in order to guarantee the fittingness of all the probes belonging to a same testing head. - Beside adding a critical step to the method for realising the contact probes, this deformation introduces weakness elements in the
body 21 of the probe itself. - Moreover, the total space of the contact probe thus realised suffers from the longitudinal size D introduced by the
rigid arm 20. - The technical problem underlying the present invention is that of devising a contact probe having a simple configuration and not needing deformation operations of the body of the probe itself, effective to ensure a good electrical contact with an integrated electronic device to be tested, and in the meantime to allow the reduction of the minimum value of the distance between adjacent probes in a testing head and thus also the pitch of the contact pads of the integrated electronic devices to be tested.
- The solution idea underlying the present invention is that of providing a testing head comprising contact probes having an eccentric contact tip positioned at one edge of the rectangular cross section of the probe body.
- On the basis of this solution idea the technical problem is solved by a testing head of the previously indicated type and defined in the characterising part of
claim 1. - The technical problem is also solved by a method for realising a contact probe of the previously indicated type and defined in the characterising part of
claim 7. - The characteristics and advantages of the testing head and of the method according to the invention will be apparent from the following description of embodiments thereof given by way of indicative and nonlimiting example with reference to the annexed drawings.
- In these drawings:
- Figure 1 schematically shows an embodiment of a testing head according to the prior art;
- Figure 2 schematically shows a section view of a portion of the testing head of Figure 1;
- Figure 3 schematically shows a second embodiment of a testing head according to the prior art;
- Figures 4A and 4B schematically show a contact probe for a testing head realised according to the invention;
- Figure 5 schematically shows a further embodiment of a contact probe for a testing head realised according to the invention;
- Figures 6A and 6B schematically show particular top configurations of a plurality of contact probes of Figure 5.
- Making reference to these figures, and in particular to Figure 4A, 40 globally and schematically indicates a contact probe according to the invention.
- Figure 4B shows an enlarged view of the sole end or
tip 42 portion of the probe, in correspondence with a contact tip P effective to put into contact a contact pad of a device to be tested (not shown). - As it has been seen with reference to the prior art, the
contact probe 40 has a substantially rod-like probe body 41 having axis XX and cross section of prefixed contour. Theprobe body 41 is provided in correspondence with at least one end with an eccentric contact tip P. - Advantageously according to the invention, the contact tip P of the
probe 40 is positioned within the contour of the cross section of theprobe body 41, as shown in Figure 4B where the projection P' of the contact tip P in correspondence with a section plane π has been indicated. - It is proper to underline that "contour" of the cross section of the probe body means, in a general way, the envelope of this section defining the maximum space of the probe body, this envelope non coinciding with the geometrical perimeter of the section in the case of conformations being particular, lobed or provided with convex angles. In a similar way, in the case of probe bodies with non uniform section, the word "contour" indicates the union of the different sections, once again defining the maximum space of the probe body.
- Advantageously according to the invention, the
tip 42 portion thus defines a tip P decentralised with respect to the axis XX of the probe, but it does not increase the total space thereof. - It is thus possible, by realising a testing head by using a plurality of
probes 40 according to the invention, to reduce the distance between the probes themselves by using an alternated configuration, such as those shown in the Figures 6A and 6B, in the case ofcontact pads 50 arranged along a single side of the device to be tested or along more sides, respectively. - In fact, the
contact probe 40 with eccentric contact tip P has a different space with respect to an axis YY parallel to the axis XX passing through the contact tip P. - In particular, as shown in Figure 4B, a plane τ passing through the axis YY defines a first 40A a second 40B probe portion, these portions having different space and in particular this first portion 40A having an overall space lower than said
second portion 40B. - It is thus possible, by orienting the portions with greater space of the
probes 40 in an alternated way, to increase the packing of the probes themselves, thus decreasing the pitch of the device which the testing head thus realised is able to test. - Figure 5 shows a preferred embodiment of the
probe 40, wherein the contact tip P belongs to the contour of the cross section of the probe body. - In this way, the
probe 40 has a space being totally lateral with respect to the axis YY and the probes can be close to the maximum, by alternating the arrangement in correspondence with the contact pads, as shown in the Figures 6A and 6B. - In particular, in Figure 6A, the
probes 40 have an axis ZZ of the cross section sloping with respect to an alignment axis WW of thecontact pads 50. - Moreover, advantageously according to the invention, the contact probes 40 are arranged in an alternated way and they suitably slope, in particular according to an angle of 45°. In this way, the distance between the contact probes 40 is ensured also in correspondence with the distribution angles of the contact pads on the four sides of the integrated device to be tested, as shown in Figure 6B, where the pads have alignment axes WW and W'W' being orthogonal one another.
- Moreover, in the embodiments shown in the Figures 4A, 4B and 5, the contact probes 40 advantageously have non circular section. In this way, by using corresponding guide holes with rectangular section, it is possible to orient the probes as desired in a simple and safe way.
- In reality, although Figures 4A, 4B and 5 show contact probes with non circular sections, and in particular rectangular, the invention is not limited to these embodiments, traditional probes with circular sections being usable as well as probes with oval sections.
- It is thus possible to obtain a testing head comprising a plurality of contact probes having eccentric contact tips and thus portions of different space, suitably orientated in order to alternate these portions of different space, by reducing the minimum safety distance between the probes, thus allowing to close the corresponding contact pads on the device to be tested, i.e. reducing the pitch of this device.
- In particular, a testing head according to the invention comprises at least an upper die and a lower die having respective upper and lower through-going guide holes within which at least one
contact probe 40 is slidingly engaged having an eccentric contact tip P. - In general, the testing head comprises a plurality of contact probes 40 arranged so that probes adjacent with each other have axes ZZ sloping with respect to an alignment axis WW of the
contact pads 50 of the device to be tested. - In a preferred embodiment, the axes ZZ of the
probes 40 and the alignment axis WW of the contact pads form an angle of 45°, as shown in the Figures 6A and 6B. - It is also possible to provide that the testing head comprises at least an air gap placed between the dies and effective to allow the
contact probe 40 to deform when said contact tip P abuts on the corresponding contact pad of the device to be tested. - In a preferred embodiment of the testing head according to the invention the contact probes 40 have at least a pre-deformed section.
- The invention also makes reference to a method for realising a contact probe of the type comprising at least one probe body and a tip portion wherein an eccentric contact tip of the probe is defined, the method comprising at least one cutting step of the tip portion of the probe according to a plurality of cutting planes sloping with respect to the section plane π and passing through the eccentric contact tip P.
- In the case of probes having rectangular section, such as that shown in Figure 5, the method for realising a contact probe according to the invention advantageously comprises the following steps:
- a first cutting step along a first cutting plane α sloping with respect to the section plane π and passing through the contact tip P, and
- a second cutting step along a second cutting plane β sloping with respect to the section plane π and passing through the contact tip P.
- In particular, these cutting planes α and β slope of 45° with respect to the section plane π and they are rotated one another of 90° in order to define the eccentric contact tip P positioned inside the contour of the cross section of the probe body.
- In conclusion, advantageously according to the invention, the proposed contact probe with the eccentric tip allows to realise a testing head able to reduce the value of the minimum pitch of the contact tips P, making it thus possible to test integrated electronic devices with contact pads with very close contact centres C, i.e. very reduced pitches.
- The eccentricity of the contact tip P and the longitudinal axis A-A of the contact probe and its positioning inside the contour of the cross section of the probe body as well as a suitable orientation of the probes allow in fact to place the contact probes 40 in an alternatively opposed position with respect to the contact pads thus considerably increasing the space available for realising the guide holes and thus allowing the use of probes with greater diameters than those usable according to the prior art. A testing head is thus obtained being more reliable for testing the integrated electronic devices having very little pitches.
- Moreover, advantageously according to the invention, the eccentric contact tip P is realised by means of cutting steps along cutting planes sloping with respect to the section π and passing through the contact tip P.
- In particular, the method according to the invention is extremely simplified in the case of probes having rectangular section needing only two cutting operations carried out along a first α and a second β plane sloping with respect to the section plane π and passing through the contact tip P, which belongs to the contour of the cross section of the probe body.
Claims (8)
- A testing head having vertical probes of the type comprising at least a first and a second die respectively provided with at least one guide hole for housing at least one contact probe (40) effective to ensure the mechanical and electrical contact with a corresponding contact pad (50) of an integrated electronic device to be tested, said at least one contact probe (40) comprising a rod-like probe body (41) having a rectangular cross section and provided in correspondence with at least one end with an eccentric contact tip (P) characterised in that said eccentric contact tip (P) is positioned at one edge of said rectangular cross section and is obtained by cutting along at least a first (α) and a second different cutting plane (β) sloping with respect to a section plane (π) being orthogonal to an axis (XX) of said probe body (41) and passing through said eccentric contact tip (P).
- A testing head having vertical probes according to claim 1, characterised in that said cutting planes (α, β) slope of 45° with respect to said section plane (π) and they are rotated one another of 90°.
- A testing head having vertical probes according to claim 1, characterised in that adjacent contact probes (40) have axes (ZZ) of said rectangular cross sections of said probe bodies (41) being parallel to one side of said rectangular cross sections and sloping with respect to an alignment axis (WW) of said contact pads (50).
- A testing head having vertical probes according to claim 1, characterised in that said axes (ZZ) of said rectangular cross sections of said probe bodies (41) and said alignment axis (WW) of said contact pads (50) form an angle of 45°.
- A testing head having vertical probes according to claim 1, characterised in that it comprises at least one air gap placed between said first and second die and effective to allow said contact probe (40) to deform when said eccentric contact tip (P) abuts on said contact pad.
- A testing head having vertical probes according to claim 1, characterised in that said contact probe (40) has at least one pre-deformed section.
- A method for realising a contact probe of the type comprising at least one rod-like probe body (41) having a rectangular cross section and provided in correspondence with at least one tip portion with an eccentric contact tip (P) characterised in that it comprises at least a first and a second cutting step of said tip portion along at least a first cutting plane (α) and a second different cutting plane (β) sloping with respect to a section plane (π) being orthogonal to an axis (XX) of said probe body (41), said cutting planes passing through said eccentric contact tip (P) positioned at one edge of said rectangular cross section and in that- said first cutting step is made along said first cutting plane (α) which slopes with respect to said section plane (π) and passes through said eccentric contact tip (P), and- said second cutting step is made along said second different cutting plane (β) which slopes with respect to said section plane (π) and passes through said eccentric contact tip (P).
- A method according to claim 7, characterised in that said sloping planes (α, β) slope of 45° with respect to said section plane (π) and they are rotated one another of 90°.
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE602004009662T DE602004009662T2 (en) | 2004-03-24 | 2004-03-24 | Contact pin for a test head |
EP04425205A EP1580562B1 (en) | 2004-03-24 | 2004-03-24 | Contact probe for a testing head |
AT04425205T ATE376679T1 (en) | 2004-03-24 | 2004-03-24 | CONTACT PIN FOR A TEST HEAD |
PL04425205T PL1580562T3 (en) | 2004-03-24 | 2004-03-24 | Contact probe for a testing head |
PCT/EP2005/003026 WO2005091000A1 (en) | 2004-03-24 | 2005-03-22 | Contact probe for a testing head |
CNB2005800095316A CN100510755C (en) | 2004-03-24 | 2005-03-22 | Contact probe for a testing head and a method used for realizing contact probe |
JP2007504339A JP2007530931A (en) | 2004-03-24 | 2005-03-22 | Inspection head and contact probe forming method |
US11/090,970 US7227368B2 (en) | 2004-03-24 | 2005-03-24 | Testing head contact probe with an eccentric contact tip |
TW094109112A TW200540427A (en) | 2004-03-24 | 2005-03-24 | Contact probe for a testing head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04425205A EP1580562B1 (en) | 2004-03-24 | 2004-03-24 | Contact probe for a testing head |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1580562A1 EP1580562A1 (en) | 2005-09-28 |
EP1580562B1 true EP1580562B1 (en) | 2007-10-24 |
Family
ID=34854753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04425205A Expired - Lifetime EP1580562B1 (en) | 2004-03-24 | 2004-03-24 | Contact probe for a testing head |
Country Status (9)
Country | Link |
---|---|
US (1) | US7227368B2 (en) |
EP (1) | EP1580562B1 (en) |
JP (1) | JP2007530931A (en) |
CN (1) | CN100510755C (en) |
AT (1) | ATE376679T1 (en) |
DE (1) | DE602004009662T2 (en) |
PL (1) | PL1580562T3 (en) |
TW (1) | TW200540427A (en) |
WO (1) | WO2005091000A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5192899B2 (en) * | 2008-04-30 | 2013-05-08 | 東京特殊電線株式会社 | Probe needle and manufacturing method thereof |
JP5372706B2 (en) * | 2009-11-04 | 2013-12-18 | 株式会社日本マイクロニクス | Probe needle guide member, probe card having the same, and semiconductor device testing method using the same |
TWI534432B (en) * | 2010-09-07 | 2016-05-21 | 瓊斯科技國際公司 | Electrically conductive pins for microcircuit tester |
ITMI20110615A1 (en) * | 2011-04-12 | 2012-10-13 | Technoprobe Spa | MEASURING HEAD FOR A TEST DEVICE OF ELECTRONIC DEVICES |
EP3170009A1 (en) * | 2014-07-14 | 2017-05-24 | Technoprobe S.p.A | Contact probe for a testing head and corresponding manufacturing method |
WO2016087369A2 (en) * | 2014-12-04 | 2016-06-09 | Technoprobe S.P.A. | Testing head comprising vertical probes |
TWI704352B (en) * | 2015-03-13 | 2020-09-11 | 義大利商探針科技公司 | Contact probe for a testing head |
KR20170125070A (en) * | 2015-03-13 | 2017-11-13 | 테크노프로브 에스.피.에이. | A test head with a vertical probe that makes improved slide movement within each guide hole under different operating conditions and accurately maintains the probe within the test head |
JP7032167B2 (en) * | 2018-02-09 | 2022-03-08 | 日置電機株式会社 | Probe pins, probe units and inspection equipment |
CN108593980A (en) * | 2018-04-18 | 2018-09-28 | 强半导体(苏州)有限公司 | A kind of manufacturing method of contact probe, measuring head and contact probe |
IT201800021253A1 (en) * | 2018-12-27 | 2020-06-27 | Technoprobe Spa | Vertical probe measuring head having an improved contact with a device to be tested |
KR102158735B1 (en) * | 2019-02-15 | 2020-09-22 | 피닉슨컨트롤스 주식회사 | Probe device of floating structure |
KR102212346B1 (en) * | 2019-12-17 | 2021-02-04 | 주식회사 제네드 | A probe pin |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0256541A3 (en) * | 1986-08-19 | 1990-03-14 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Contacting device |
DE3818728A1 (en) * | 1988-06-01 | 1989-12-14 | Feinmetall Gmbh | Spring contact pin |
JPH08233860A (en) * | 1995-02-28 | 1996-09-13 | Nec Corp | Coaxial high-frequency probe and evaluating method for board using the probe |
US5923178A (en) * | 1997-04-17 | 1999-07-13 | Cerprobe Corporation | Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers |
US6411112B1 (en) * | 1998-02-19 | 2002-06-25 | International Business Machines Corporation | Off-axis contact tip and dense packing design for a fine pitch probe |
JP4398061B2 (en) * | 2000-04-28 | 2010-01-13 | 日置電機株式会社 | Contact probe manufacturing method |
ITMI20010567A1 (en) * | 2001-03-19 | 2002-09-19 | Technoprobe S R L | VERTICAL PROBE MEASUREMENT HEAD FOR ELECTRONIC DEVICES INTEGRATED ON A SEMICONDUCTOR |
JP2002296297A (en) * | 2001-03-29 | 2002-10-09 | Isao Kimoto | Contact assembly |
US6906540B2 (en) * | 2001-09-20 | 2005-06-14 | Wentworth Laboratories, Inc. | Method for chemically etching photo-defined micro electrical contacts |
US6859054B1 (en) * | 2003-08-13 | 2005-02-22 | Advantest Corp. | Probe contact system using flexible printed circuit board |
US6967492B2 (en) * | 2003-11-26 | 2005-11-22 | Asm Assembly Automation Ltd. | Spring contact probe device for electrical testing |
-
2004
- 2004-03-24 DE DE602004009662T patent/DE602004009662T2/en not_active Expired - Lifetime
- 2004-03-24 AT AT04425205T patent/ATE376679T1/en not_active IP Right Cessation
- 2004-03-24 PL PL04425205T patent/PL1580562T3/en unknown
- 2004-03-24 EP EP04425205A patent/EP1580562B1/en not_active Expired - Lifetime
-
2005
- 2005-03-22 JP JP2007504339A patent/JP2007530931A/en active Pending
- 2005-03-22 CN CNB2005800095316A patent/CN100510755C/en not_active Expired - Fee Related
- 2005-03-22 WO PCT/EP2005/003026 patent/WO2005091000A1/en active Application Filing
- 2005-03-24 US US11/090,970 patent/US7227368B2/en active Active
- 2005-03-24 TW TW094109112A patent/TW200540427A/en unknown
Also Published As
Publication number | Publication date |
---|---|
ATE376679T1 (en) | 2007-11-15 |
WO2005091000A8 (en) | 2006-01-19 |
CN1934453A (en) | 2007-03-21 |
US20050270044A1 (en) | 2005-12-08 |
EP1580562A1 (en) | 2005-09-28 |
WO2005091000A1 (en) | 2005-09-29 |
TW200540427A (en) | 2005-12-16 |
US7227368B2 (en) | 2007-06-05 |
CN100510755C (en) | 2009-07-08 |
DE602004009662T2 (en) | 2008-08-28 |
DE602004009662D1 (en) | 2007-12-06 |
JP2007530931A (en) | 2007-11-01 |
PL1580562T3 (en) | 2008-02-29 |
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