PL2310558T3 - Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu - Google Patents

Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu

Info

Publication number
PL2310558T3
PL2310558T3 PL09776985T PL09776985T PL2310558T3 PL 2310558 T3 PL2310558 T3 PL 2310558T3 PL 09776985 T PL09776985 T PL 09776985T PL 09776985 T PL09776985 T PL 09776985T PL 2310558 T3 PL2310558 T3 PL 2310558T3
Authority
PL
Poland
Prior art keywords
bronze layers
tin
layers
bronze
decorative
Prior art date
Application number
PL09776985T
Other languages
English (en)
Polish (pl)
Inventor
Klaus Bronder
Bernd Weyhmueller
Frank Oberst
Sascha Berger
Uwe Manz
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of PL2310558T3 publication Critical patent/PL2310558T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
PL09776985T 2008-07-10 2009-07-06 Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu PL2310558T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008032398A DE102008032398A1 (de) 2008-07-10 2008-07-10 Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
PCT/EP2009/004879 WO2010003621A1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of bronze layers
EP09776985A EP2310558B1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of tin-bronze layers

Publications (1)

Publication Number Publication Date
PL2310558T3 true PL2310558T3 (pl) 2012-09-28

Family

ID=41258161

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09776985T PL2310558T3 (pl) 2008-07-10 2009-07-06 Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu

Country Status (10)

Country Link
US (1) US20110174631A1 (zh)
EP (1) EP2310558B1 (zh)
JP (1) JP2011527381A (zh)
KR (1) KR20110031183A (zh)
CN (1) CN102089466B (zh)
AT (1) ATE549434T1 (zh)
DE (1) DE102008032398A1 (zh)
PL (1) PL2310558T3 (zh)
TW (1) TW201014935A (zh)
WO (1) WO2010003621A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010044551A1 (de) * 2010-09-07 2012-03-08 Coventya Gmbh Anode sowie deren Verwendung in einem alkalischen Galvanikbad
DE102011121799B4 (de) * 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
AT514818B1 (de) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
CN103789803B (zh) * 2014-01-13 2016-04-27 孙松华 一种无氰铜锡合金电镀液及其制备方法
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法
AR100422A1 (es) 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo
CN106521574B (zh) * 2016-12-05 2018-10-26 浙江工业大学 一种适用于宽pH和宽电流密度范围的无氰镀铜电镀液及其制备方法
JP6980017B2 (ja) * 2016-12-28 2021-12-15 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH 錫めっき浴および錫もしくは錫合金を基材の表面に析出させる方法
CN110344079B (zh) * 2019-08-16 2021-06-08 广东超华科技股份有限公司 一种降低电解铜箔电解液中铁离子浓度的装置及方法
RU2762501C1 (ru) * 2021-05-17 2021-12-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Щелочной электролит для электролитического осаждения желтой оловянной бронзы
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US4289286A (en) * 1978-10-16 1981-09-15 East/West Industries, Inc. Replaceable harness bracket assembly
US4356067A (en) * 1979-06-13 1982-10-26 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4389286A (en) * 1980-07-17 1983-06-21 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4347108A (en) * 1981-05-29 1982-08-31 Rohco, Inc. Electrodeposition of copper, acidic copper electroplating baths and additives therefor
CN1004010B (zh) * 1986-07-11 1989-04-26 南京大学 无氰仿金电镀液
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
DE10046600C2 (de) 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
WO2002024979A1 (de) * 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
US6645364B2 (en) * 2000-10-20 2003-11-11 Shipley Company, L.L.C. Electroplating bath control
JP4249438B2 (ja) 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
DE10243139A1 (de) * 2002-09-17 2004-03-25 Omg Galvanotechnik Gmbh Dunkle Schichten
EP1408141B1 (de) 2002-10-11 2014-12-17 Enthone Inc. Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060231409A1 (en) * 2005-03-31 2006-10-19 Tdk Corporation Plating solution, conductive material, and surface treatment method of conductive material
EP1870495A1 (de) * 2006-06-21 2007-12-26 Atotech Deutschland Gmbh Wässriges alkalisches cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen
DE502007002479D1 (de) * 2007-02-14 2010-02-11 Umicore Galvanotechnik Gmbh Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Also Published As

Publication number Publication date
KR20110031183A (ko) 2011-03-24
EP2310558A1 (en) 2011-04-20
TW201014935A (en) 2010-04-16
CN102089466A (zh) 2011-06-08
EP2310558B1 (en) 2012-03-14
DE102008032398A1 (de) 2010-01-14
WO2010003621A1 (en) 2010-01-14
ATE549434T1 (de) 2012-03-15
US20110174631A1 (en) 2011-07-21
CN102089466B (zh) 2012-11-07
JP2011527381A (ja) 2011-10-27

Similar Documents

Publication Publication Date Title
PL2310558T3 (pl) Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu
CN101525711B (zh) 电镀锌、镍复合镀层镁合金及其电镀方法
ATE486157T1 (de) Modifizierter kupfer-zinn-elektrolyt und verfahren zur abscheidung von bronzeschichten
US10011913B2 (en) Substrate with a corrosion resistant coating and method of production thereof
MX2012002450A (es) Lamina de acero galvanizada en caliente por inmersion, de alta resistencia, y proceso para producir la misma.
EP3067443B1 (en) Nickel and/or chromium plated member and method for manufacturing the same
MY162826A (en) Hot-pressed member and process for producing the same
MY170543A (en) Method for manufacturing hot-dip zn alloy-plated steel sheet
WO2007147603A3 (de) Wässriges alkalisches, cyanidfreies bad zur galvanischen abscheidung von zink- und zinklegierungsüberzügen
WO2008014987A3 (en) Method for deposition of chromium layers as hard- chrome plating, electroplating bath and hard- chrome surfaces
CN103343367A (zh) 镀镍钢带及其制备方法
DE502007002479D1 (de) Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
CN102260889B (zh) 一种高耐蚀光亮柔软的锌钴合金电镀工艺
CN203593786U (zh) 一种用于汽车配件的无氰碱性镀锌复合层
CN102108533A (zh) 一种无氰电镀铜-锡合金层为表层的用于造币的多层电镀工艺
CN104195598A (zh) 用于摩托车配件电镀光亮镍钛合金的电镀液及电镀方法
CN201317140Y (zh) 一种镀锌工件
CN101675185A (zh) 电解质和沉积黑钌的装饰技术层的方法
WO2009069669A1 (ja) 銅－亜鉛合金電気めっき浴およびこれを用いためっき方法
CN204982090U (zh) 一种具有高耐蚀性和装饰性的镀层结构
CN102899695A (zh) 无镍合金镀层的电镀方法
CN201850322U (zh) 用于汽车配件的三价铬黑钝化锌铁合金镀层
CN205741243U (zh) 非真空镀的镀层结构
TH118880B (th) อิเล็กโทรไลท์ทองแดง-ดีบุกที่ดีขึ้นและกรรมวิธีสำหรับการชุบชั้นบรอนซ์
CN207210557U (zh) 一种高耐蚀性枪黑色复合镀层结构