PL184902B1 - Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N - Google Patents

Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N

Info

Publication number
PL184902B1
PL184902B1 PL97319329A PL31932997A PL184902B1 PL 184902 B1 PL184902 B1 PL 184902B1 PL 97319329 A PL97319329 A PL 97319329A PL 31932997 A PL31932997 A PL 31932997A PL 184902 B1 PL184902 B1 PL 184902B1
Authority
PL
Poland
Prior art keywords
polishing
gan
epitaxial layers
chemical etchant
crystals
Prior art date
Application number
PL97319329A
Other languages
English (en)
Polish (pl)
Other versions
PL319329A1 (en
Inventor
Porowski┴Sylwester
Grzegory┴Izabella
Weyher┴Jan
Nowak┴Grzegorz
Original Assignee
Centrum Badan Wysokocisnieniowych Pan
Ct Badan Wysokocisnieniowych P
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centrum Badan Wysokocisnieniowych Pan, Ct Badan Wysokocisnieniowych P filed Critical Centrum Badan Wysokocisnieniowych Pan
Priority to PL97319329A priority Critical patent/PL184902B1/pl
Priority to JP54264598A priority patent/JP4184441B2/ja
Priority to PCT/PL1998/000010 priority patent/WO1998045511A1/en
Priority to AT98907295T priority patent/ATE204037T1/de
Priority to DE69801316T priority patent/DE69801316T2/de
Priority to EP98907295A priority patent/EP0972097B1/en
Priority to US09/402,692 priority patent/US6399500B1/en
Publication of PL319329A1 publication Critical patent/PL319329A1/xx
Publication of PL184902B1 publication Critical patent/PL184902B1/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Semiconductor Lasers (AREA)
PL97319329A 1997-04-04 1997-04-04 Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N PL184902B1 (pl)

Priority Applications (7)

Application Number Priority Date Filing Date Title
PL97319329A PL184902B1 (pl) 1997-04-04 1997-04-04 Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N
JP54264598A JP4184441B2 (ja) 1997-04-04 1998-03-13 GaN及びGa▲下1−x−y▼Al▲下x▼In▲下y▼Nの結晶及びエピタキシャル層の機械−化学研摩
PCT/PL1998/000010 WO1998045511A1 (en) 1997-04-04 1998-03-13 MECHANO-CHEMICAL POLISHING OF CRYSTALS AND EPITAXIAL LAYERS OF GaN AND Ga1-x-yAlxInyN
AT98907295T ATE204037T1 (de) 1997-04-04 1998-03-13 Mechanisch -chemisches polieren von kristallen und epitaxie-schichten aus gan und ga1-x-yalxinyn
DE69801316T DE69801316T2 (de) 1997-04-04 1998-03-13 MECHANISCH -CHEMISCHES POLIEREN VON KRISTALLEN UND EPITAXIE-SCHICHTEN AUS GaN UND Ga1-x-yAlxInyN
EP98907295A EP0972097B1 (en) 1997-04-04 1998-03-13 MECHANO-CHEMICAL POLISHING OF CRYSTALS AND EPITAXIAL LAYERS OF GaN AND Ga1-x-yAlxInyN
US09/402,692 US6399500B1 (en) 1997-04-04 1998-03-13 Mechano-chemical polishing of crystals and epitaxial layers of GaN and Ga1-x-yA1xInyN

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL97319329A PL184902B1 (pl) 1997-04-04 1997-04-04 Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N

Publications (2)

Publication Number Publication Date
PL319329A1 PL319329A1 (en) 1998-10-12
PL184902B1 true PL184902B1 (pl) 2003-01-31

Family

ID=20069596

Family Applications (1)

Application Number Title Priority Date Filing Date
PL97319329A PL184902B1 (pl) 1997-04-04 1997-04-04 Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N

Country Status (7)

Country Link
US (1) US6399500B1 (https=)
EP (1) EP0972097B1 (https=)
JP (1) JP4184441B2 (https=)
AT (1) ATE204037T1 (https=)
DE (1) DE69801316T2 (https=)
PL (1) PL184902B1 (https=)
WO (1) WO1998045511A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4145437B2 (ja) * 1999-09-28 2008-09-03 住友電気工業株式会社 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板
JP2001144014A (ja) * 1999-11-17 2001-05-25 Ngk Insulators Ltd エピタキシャル成長用基板およびその製造方法
IL159165A0 (en) * 2001-06-06 2004-06-01 Ammono Sp Zoo Process and apparatus for obtaining bulk monocrystalline gallium containing nitride
US6488767B1 (en) * 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
EP1453158A4 (en) * 2001-10-26 2007-09-19 Ammono Sp Zoo NITRIDE SEMICONDUCTOR LASER ELEMENT AND MANUFACTURING METHOD THEREFOR
PL225235B1 (pl) * 2001-10-26 2017-03-31 Ammono Spółka Z Ograniczoną Odpowiedzialnością Objętościowy monokryształ azotkowy oraz jego zastosowanie jako podłoże do epitaksji
AU2002354467A1 (en) * 2002-05-17 2003-12-02 Ammono Sp.Zo.O. Light emitting element structure having nitride bulk single crystal layer
WO2003097906A1 (en) * 2002-05-17 2003-11-27 Ammono Sp.Zo.O. Bulk single crystal production facility employing supercritical ammonia
US20060138431A1 (en) * 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
CN100339512C (zh) * 2002-06-26 2007-09-26 波兰商艾蒙诺公司 获得大单晶含镓氮化物的方法的改进
US7811380B2 (en) * 2002-12-11 2010-10-12 Ammono Sp. Z O.O. Process for obtaining bulk mono-crystalline gallium-containing nitride
AU2003285769A1 (en) * 2002-12-11 2004-06-30 Ammono Sp. Z O.O. A substrate for epitaxy and a method of preparing the same
JP4511801B2 (ja) * 2003-03-14 2010-07-28 株式会社リコー Iii族窒化物結晶の研磨方法およびiii族窒化物結晶および半導体デバイス
CN1723548A (zh) * 2003-06-16 2006-01-18 住友电气工业株式会社 加工氮化物半导体晶体表面的方法和由该方法得到的氮化物半导体晶体
PL1769105T3 (pl) * 2004-06-11 2014-11-28 Ammono S A Objętościowy monokrystaliczny azotek galu oraz sposób jego wytwarzania
PL371405A1 (pl) * 2004-11-26 2006-05-29 Ammono Sp.Z O.O. Sposób wytwarzania objętościowych monokryształów metodą wzrostu na zarodku
JP2007299979A (ja) * 2006-05-01 2007-11-15 Sumitomo Electric Ind Ltd Iii族窒化物結晶の表面処理方法およびiii族窒化物結晶基板
KR101363316B1 (ko) 2006-07-26 2014-02-14 프라이베르게르 컴파운드 마터리얼스 게엠베하 Ⅲ-n 기판의 평활화방법
US7585772B2 (en) * 2006-07-26 2009-09-08 Freiberger Compound Materials Gmbh Process for smoothening III-N substrates
JP2009272380A (ja) 2008-05-01 2009-11-19 Sumitomo Electric Ind Ltd Iii族窒化物結晶およびその表面処理方法、iii族窒化物積層体およびその製造方法、ならびにiii族窒化物半導体デバイスおよびその製造方法

Also Published As

Publication number Publication date
WO1998045511A1 (en) 1998-10-15
US6399500B1 (en) 2002-06-04
ATE204037T1 (de) 2001-08-15
EP0972097A1 (en) 2000-01-19
JP4184441B2 (ja) 2008-11-19
DE69801316T2 (de) 2002-05-02
PL319329A1 (en) 1998-10-12
EP0972097B1 (en) 2001-08-08
JP2001518870A (ja) 2001-10-16
DE69801316D1 (de) 2001-09-13

Similar Documents

Publication Publication Date Title
PL184902B1 (pl) Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N
Gutsche et al. Polishing of sapphire with colloidal silica
KR101110682B1 (ko) 탄화규소 단결정 기판 연마용 수계 연마 슬러리 및 그 연마방법
CN101930911B (zh) 生产外延涂布的半导体晶片的方法
JP2000235941A (ja) 半導体ウェハ、半導体ウェハの製造方法および該製造方法の使用
US4011099A (en) Preparation of damage-free surface on alpha-alumina
EP2330615A1 (en) Silicon carbide single crystal substrate
JP2004530306A (ja) 高表面品質GaNウェーハおよびその製造方法
KR101104635B1 (ko) 에피택셜 실리콘 웨이퍼의 제조 방법
JP2003249466A (ja) シリコンからなる半導体ウェーハ、多数の半導体ウェーハの製造方法及びその使用
Kubota et al. Tribochemical polishing of bulk gallium nitride substrate
WO2016039116A1 (ja) 窒化アルミニウム単結晶基板の洗浄方法および積層体
JP2007204286A (ja) エピタキシャルウェーハの製造方法
JP2023108951A (ja) シリコンエピタキシャルウェーハの製造方法
JP3482982B2 (ja) Eg層付きエピタキシャルウェーハの製造方法
RU2072585C1 (ru) Способ подготовки полупроводниковых подложек
El Azab et al. Preparation and characterization of tellurium surfaces
JPH03135027A (ja) 半導体スライスの表面処理方法
Reisman et al. Further Comments on the Thermal Etching of Silicon: The Surface Morphology of (100),(111) and (110) Wafers in the Temperature Range 900°–1150° C
JPS59129439A (ja) 半導体装置用基板の製造方法
KR20020033592A (ko) 사파이어 웨이퍼의 화학-기계적 광택공정에서의 표면처리공정방법
Storm et al. Preparation of (0 0 1) ZnSe surfaces for homoepitaxy
JPH03131025A (ja) CdTeウエハーの鏡面研磨液及びそれを用いる鏡面研磨方法
Shih et al. Autoepitaxy of tellurium using vacuum deposition
Zauner et al. Temperature dependent morphology transition of GaN films