Classifications

• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
  • C30B29/10—Inorganic compounds or compositions
  • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
  • C30B29/403—AIII-nitrides
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
  • C30B29/10—Inorganic compounds or compositions
  • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
  • C30B29/403—AIII-nitrides
  • C30B29/406—Gallium nitride

Definitions

• This invention relates to the method of mechano-chemical polishing crystals and epitaxial layers of GaN and GaAlInN in order to remove of irregularities and highly defected regions from the surface of crystals and epitaxial layers of GaN and Ga ⁇ .
• x _ y Al ⁇ In y N used in manufacturing of optoelectronic devices.
• the flaw of diamond micropowder polishing and annealing method is creation of highly defected surface which leads to important disturbances of the growth of epitaxial layers.
• mechano-chemical polishing proceeds via creation of a thin layer of soft reaction product which is removed by soft pad polishing.
• One object of the Invention is the method of removal of surface irregularities and highly defected regions from the surface of crystals and epitaxial layers of GaAlInN by polishing on soft pad in presence of base water solution of the concentration above 0.1 during 10 second and subsequent replacement of the solution by pure water and polishing by at least 1 minute. Subsequently the pressure exerted on the sample is diminished and the polishing machine is stopped and the polished GaAlInN crystal is removed in a well known method under the flow of dry nitrogen.
• the water solutions of the bases such as sodium base NaOH, potassium base KOH or their mixtures.
• the polishing is effected on a soft pad in presence of etching agent and water under the pressure of O.OlMPa and using angular velocity of 1 to 100 revolutions per minute.
• the polishing in the presence of etching agent is effected with the continuos adding of etching agent with the rate of 1 -5 droplets per second.
• the water polishing is effected with continuos adding the pure water with the rate higher than 1 droplet for second.
• crystals with so prepared surfaces are the optimal substrates for homoepitaxy of thin layers and highest
• the method of the Invention will not lead to creation of flat layer of the reaction product but the etching ot the surface into the sharp edged pyramidal structure.
• the polishing according to the Invention will lead to abrasion of the pyramids created in the etching process because local strain on the sharp edges considerably overcomes the nominal value of the pressure.
• the method of the Invention is simple and can be used in room temperature.
• the chemical etching agents are easy to prepare, and nontoxic.
• GaN hexagonal plate-like crystals obtained by growth from the nitrogen solution in liquid gallium under high N 2 pressure are prepared in the method described by the Invention.
• the hexagonal surfaces of the crystals correspond to crystallographic (0001) planes of wurtzite structure.
• the surface is atomically smooth. Initially the surface is polished mechanically using diamond micropowder to the smoothness of several interatomic distances. So smooth areas are between the scratches of the depth of order of 100 interatomic distances. Moreover the polishing leads to creation of several micron thick, neighboring layer of highly defected crystal of high dislocation density. The surface of the crystal is then polished according to the invention.
• GaN crystal is the located in the holder of polishing machine equipped with the polishing pad covered with the soft polishing cloth Politex Supreme type.
• the 5-n water solution of KOH is injected into the batch meter.
• the polishing cloth is saturated with the etching solution.
• the rotating pad is set into the motion with the velocity equal to 20 revolutions per minute and brought into the contact with the crystals with adding the load so that the nominal pressure on the crystal surface is 0.3 MPa.
• the polishing proceeds during 20 minutes with the continuous adding of chemical agent on the polishing cloth with the rate of 1 droplet per second. After 20 minutes the chemical agent is replaced by water without interruption of the polishing.
• the polishing is continued for 60 minutes with the gradual adding of the water with the rate of 2 droplet for second and subsequently the load is diminished and the machine is stopped.
• the holder with the crystal s removed is dried in the tream of dry nitrogen in well know way.
• heteroepitaxial layer of the nominal thickness of 0.6 micron, obtained by MOCVD deposition of GaN on sapphire substrate.
• the layer is covered by hexagonal hillocks of the height up to 0.2 micron resulting from the higher growth velocity in the neighborhood of screw dislocation.
• the substrate with the deposited layer is located in the holder of polishing machine, equipped with the rotating pad, covered with the polishing cloth of Pellon type.
• the 2-n water solution of sodium base NaOH is injected in the batch meter.
• the polishing cloth is saturated with the etching agent.
• the pad is set into the motion with the velocity equal to 30 revolutions for minute and brought into the contact with the crystal adding the load so that the nominal pressure on the crystal surface is equal to 0.1 MPa.
• the polishing last 3 minutes with the continous addition of chemical etching agent on the polishing pad with the rate of 1 droplet for second. After 3 minutes the etching agent is replaced by pure water without interruption of the polishing.
• the polishing is continued for 80 minutes adding the water with the rate of 2
• the method can be applied in the manufacturing of electronic and optoelectronic devices.
• this can be used in fabrication of light emitting diodes (LEDs) and laser diodes (LDs) active in green, blue and ultraviolet range of spectrum.
• the electronic application include fabrication of high power/ high frequency devices capable to work in high temperatures.

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Crystallography & Structural Chemistry (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Inorganic Chemistry (AREA)
• Crystals, And After-Treatments Of Crystals (AREA)
• Mechanical Treatment Of Semiconductor (AREA)
• Weting (AREA)
• Semiconductor Lasers (AREA)

Priority Applications (5)

Applications Claiming Priority (2)

Publications (1)

Family

ID=20069596

Family Applications (1)

Country Status (7)

Cited By (3)

Families Citing this family (17)

• 1997
  • 1997-04-04 PL PL97319329A patent/PL184902B1/pl unknown
• 1998
  • 1998-03-13 JP JP54264598A patent/JP4184441B2/ja not_active Expired - Fee Related
  • 1998-03-13 AT AT98907295T patent/ATE204037T1/de not_active IP Right Cessation
  • 1998-03-13 EP EP98907295A patent/EP0972097B1/en not_active Expired - Lifetime
  • 1998-03-13 WO PCT/PL1998/000010 patent/WO1998045511A1/en not_active Ceased
  • 1998-03-13 US US09/402,692 patent/US6399500B1/en not_active Expired - Fee Related
  • 1998-03-13 DE DE69801316T patent/DE69801316T2/de not_active Expired - Lifetime

Non-Patent Citations (4)

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