PH12021550959A1 - Vertical probe head with improved contact properties towards a device under test - Google Patents
Vertical probe head with improved contact properties towards a device under testInfo
- Publication number
- PH12021550959A1 PH12021550959A1 PH12021550959A PH12021550959A PH12021550959A1 PH 12021550959 A1 PH12021550959 A1 PH 12021550959A1 PH 12021550959 A PH12021550959 A PH 12021550959A PH 12021550959 A PH12021550959 A PH 12021550959A PH 12021550959 A1 PH12021550959 A1 PH 12021550959A1
- Authority
- PH
- Philippines
- Prior art keywords
- guide
- under test
- device under
- guide holes
- contact probes
- Prior art date
Links
- 239000000523 sample Substances 0.000 title abstract 7
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102018000010071A IT201800010071A1 (it) | 2018-11-06 | 2018-11-06 | Testa di misura a sonde verticali con migliorate proprietà di contatto con un dispositivo di test |
| PCT/EP2019/080171 WO2020094608A1 (en) | 2018-11-06 | 2019-11-05 | Vertical probe head with improved contact properties towards a device under test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PH12021550959A1 true PH12021550959A1 (en) | 2021-11-29 |
Family
ID=65409291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12021550959A PH12021550959A1 (en) | 2018-11-06 | 2021-04-27 | Vertical probe head with improved contact properties towards a device under test |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US12085588B2 (https=) |
| EP (1) | EP3877768A1 (https=) |
| JP (1) | JP7470114B2 (https=) |
| KR (1) | KR20210089206A (https=) |
| CN (1) | CN113039444A (https=) |
| IT (1) | IT201800010071A1 (https=) |
| PH (1) | PH12021550959A1 (https=) |
| SG (1) | SG11202104299SA (https=) |
| TW (1) | TWI837207B (https=) |
| WO (1) | WO2020094608A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI831307B (zh) * | 2022-07-26 | 2024-02-01 | 思達科技股份有限公司 | 導板結構及探針陣列 |
| IT202200026214A1 (it) * | 2022-12-21 | 2024-06-21 | Technoprobe Spa | Testa di misura a sonde verticali perfezionata |
| KR20240160318A (ko) | 2023-05-02 | 2024-11-11 | 김상한 | 수직형 프로브 핀을 가진 프로브 핀 조립체 및 그 제작 방법 |
| KR102923549B1 (ko) * | 2023-11-23 | 2026-02-06 | 주식회사 에스디에이 | 핀 포스가 조절되는 버티컬 프로브카드 |
| KR102854722B1 (ko) * | 2024-01-30 | 2025-09-02 | 경북대학교 산학협력단 | 반도체 소자 검사용 스크럽 발생 방지형 멤스 핀 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6411112B1 (en) * | 1998-02-19 | 2002-06-25 | International Business Machines Corporation | Off-axis contact tip and dense packing design for a fine pitch probe |
| JP3942823B2 (ja) * | 2000-12-28 | 2007-07-11 | 山一電機株式会社 | 検査装置 |
| FR2860347A1 (fr) * | 2003-09-29 | 2005-04-01 | Probest | Connecteur electrique a au moins deux contacts |
| JP2007127488A (ja) * | 2005-11-02 | 2007-05-24 | Rika Denshi Co Ltd | プローブカード |
| US8723546B2 (en) * | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
| EP2107380A1 (en) * | 2008-04-01 | 2009-10-07 | Technoprobe S.p.A | Testing head having vertical probes configured to improve the electric contact with a device to be tested |
| JP2009276097A (ja) | 2008-05-12 | 2009-11-26 | Nidec-Read Corp | 基板検査治具 |
| TWI435083B (zh) * | 2010-07-27 | 2014-04-21 | Mpi Corp | Combination probe head for vertical probe card and its assembly alignment method |
| JP6305754B2 (ja) * | 2013-12-20 | 2018-04-04 | 東京特殊電線株式会社 | コンタクトプローブユニット |
| CN107003335B (zh) * | 2015-01-04 | 2020-05-22 | 金日 | 接触测试装置 |
| MY187095A (en) * | 2015-03-13 | 2021-08-31 | Technoprobe Spa | Testing head with vertical probes, particularly for high frequency applications |
| JP5822042B1 (ja) | 2015-03-27 | 2015-11-24 | 日本電産リード株式会社 | 検査治具、基板検査装置、及び検査治具の製造方法 |
| WO2016156002A1 (en) * | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications |
| WO2016177850A1 (en) | 2015-05-07 | 2016-11-10 | Technoprobe S.P.A. | Testing head having vertical probes, in particular for reduced pitch applications |
| US10866266B2 (en) * | 2015-10-29 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company Ltd. | Probe head receiver and probe card assembly having the same |
| KR101886536B1 (ko) * | 2016-12-27 | 2018-08-07 | 주식회사 텝스 | 접촉력을 조절할 수 있는 스트레이트 니들 프로브 카드 |
| IT201700046645A1 (it) * | 2017-04-28 | 2018-10-28 | Technoprobe Spa | Scheda di misura per un’apparecchiatura di test di dispositivi elettronici |
| WO2019129585A1 (en) * | 2017-12-28 | 2019-07-04 | Technoprobe S.P.A. | Probe head having vertical probes with respectively opposite scrub directions |
-
2018
- 2018-11-06 IT IT102018000010071A patent/IT201800010071A1/it unknown
-
2019
- 2019-10-31 TW TW108139541A patent/TWI837207B/zh active
- 2019-11-05 WO PCT/EP2019/080171 patent/WO2020094608A1/en not_active Ceased
- 2019-11-05 KR KR1020217016991A patent/KR20210089206A/ko not_active Ceased
- 2019-11-05 CN CN201980073132.8A patent/CN113039444A/zh active Pending
- 2019-11-05 SG SG11202104299SA patent/SG11202104299SA/en unknown
- 2019-11-05 EP EP19797728.3A patent/EP3877768A1/en not_active Withdrawn
- 2019-11-05 JP JP2021523712A patent/JP7470114B2/ja active Active
-
2021
- 2021-04-27 PH PH12021550959A patent/PH12021550959A1/en unknown
- 2021-05-05 US US17/308,636 patent/US12085588B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7470114B2 (ja) | 2024-04-17 |
| JP2022506377A (ja) | 2022-01-17 |
| US12085588B2 (en) | 2024-09-10 |
| EP3877768A1 (en) | 2021-09-15 |
| KR20210089206A (ko) | 2021-07-15 |
| TW202022387A (zh) | 2020-06-16 |
| US20210255218A1 (en) | 2021-08-19 |
| TWI837207B (zh) | 2024-04-01 |
| SG11202104299SA (en) | 2021-05-28 |
| WO2020094608A1 (en) | 2020-05-14 |
| CN113039444A (zh) | 2021-06-25 |
| IT201800010071A1 (it) | 2020-05-06 |
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