SG11202104299SA - Vertical probe head with improved contact properties towards a device under test - Google Patents

Vertical probe head with improved contact properties towards a device under test

Info

Publication number
SG11202104299SA
SG11202104299SA SG11202104299SA SG11202104299SA SG11202104299SA SG 11202104299S A SG11202104299S A SG 11202104299SA SG 11202104299S A SG11202104299S A SG 11202104299SA SG 11202104299S A SG11202104299S A SG 11202104299SA SG 11202104299S A SG11202104299S A SG 11202104299SA
Authority
SG
Singapore
Prior art keywords
under test
device under
probe head
improved contact
vertical probe
Prior art date
Application number
SG11202104299SA
Inventor
Stefano Felici
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11202104299SA publication Critical patent/SG11202104299SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
SG11202104299SA 2018-11-06 2019-11-05 Vertical probe head with improved contact properties towards a device under test SG11202104299SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102018000010071A IT201800010071A1 (en) 2018-11-06 2018-11-06 Vertical probe measuring head with improved contact properties with a test device
PCT/EP2019/080171 WO2020094608A1 (en) 2018-11-06 2019-11-05 Vertical probe head with improved contact properties towards a device under test

Publications (1)

Publication Number Publication Date
SG11202104299SA true SG11202104299SA (en) 2021-05-28

Family

ID=65409291

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202104299SA SG11202104299SA (en) 2018-11-06 2019-11-05 Vertical probe head with improved contact properties towards a device under test

Country Status (10)

Country Link
US (1) US12085588B2 (en)
EP (1) EP3877768A1 (en)
JP (1) JP7470114B2 (en)
KR (1) KR20210089206A (en)
CN (1) CN113039444A (en)
IT (1) IT201800010071A1 (en)
PH (1) PH12021550959A1 (en)
SG (1) SG11202104299SA (en)
TW (1) TWI837207B (en)
WO (1) WO2020094608A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202200026214A1 (en) * 2022-12-21 2024-06-21 Technoprobe S P A Improved vertical probe measuring head

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6411112B1 (en) * 1998-02-19 2002-06-25 International Business Machines Corporation Off-axis contact tip and dense packing design for a fine pitch probe
JP3942823B2 (en) * 2000-12-28 2007-07-11 山一電機株式会社 Inspection device
FR2860347A1 (en) * 2003-09-29 2005-04-01 Probest Testing apparatus and microcomputer chip connector, has two plates maintained one above another, such that openings of plates are respectively situated on two parallel axes, and third plate having width equal to section of contact pins
JP2007127488A (en) * 2005-11-02 2007-05-24 Rika Denshi Co Ltd Probe card
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
EP2107380A1 (en) * 2008-04-01 2009-10-07 Technoprobe S.p.A Testing head having vertical probes configured to improve the electric contact with a device to be tested
JP2009276097A (en) 2008-05-12 2009-11-26 Nidec-Read Corp Substrate inspection jig
TWI435083B (en) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
JP6305754B2 (en) * 2013-12-20 2018-04-04 東京特殊電線株式会社 Contact probe unit
WO2016108520A1 (en) * 2015-01-04 2016-07-07 김일 Contact inspection device
KR102536001B1 (en) * 2015-03-13 2023-05-24 테크노프로브 에스.피.에이. Test head with vertical probe especially for high frequency applications
JP5822042B1 (en) 2015-03-27 2015-11-24 日本電産リード株式会社 Inspection jig, substrate inspection apparatus, and manufacturing method of inspection jig
WO2016156002A1 (en) * 2015-03-31 2016-10-06 Technoprobe S.P.A. Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications
JP6820277B2 (en) 2015-05-07 2021-01-27 テクノプローベ エス．ピー．エー． Test head with vertical probe, especially for reduced pitch applications
US10866266B2 (en) * 2015-10-29 2020-12-15 Taiwan Semiconductor Manufacturing Company Ltd. Probe head receiver and probe card assembly having the same
KR101886536B1 (en) * 2016-12-27 2018-08-07 주식회사 텝스 Straight needle probe card with adjustable probe force
IT201700046645A1 (en) * 2017-04-28 2018-10-28 Technoprobe Spa Measurement board for a test device of electronic devices
WO2019129585A1 (en) * 2017-12-28 2019-07-04 Technoprobe S.P.A. Probe head having vertical probes with respectively opposite scrub directions

Also Published As

Publication number Publication date
WO2020094608A1 (en) 2020-05-14
IT201800010071A1 (en) 2020-05-06
JP7470114B2 (en) 2024-04-17
PH12021550959A1 (en) 2021-11-29
TWI837207B (en) 2024-04-01
CN113039444A (en) 2021-06-25
US12085588B2 (en) 2024-09-10
TW202022387A (en) 2020-06-16
US20210255218A1 (en) 2021-08-19
KR20210089206A (en) 2021-07-15
JP2022506377A (en) 2022-01-17
EP3877768A1 (en) 2021-09-15

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