JP7470114B2 - 被試験デバイスに対する改善された接触特性を有する垂直プローブヘッド - Google Patents

被試験デバイスに対する改善された接触特性を有する垂直プローブヘッド Download PDF

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JP7470114B2
JP7470114B2 JP2021523712A JP2021523712A JP7470114B2 JP 7470114 B2 JP7470114 B2 JP 7470114B2 JP 2021523712 A JP2021523712 A JP 2021523712A JP 2021523712 A JP2021523712 A JP 2021523712A JP 7470114 B2 JP7470114 B2 JP 7470114B2
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Prior art keywords
guide
probe head
probe
guide holes
contact
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Japanese (ja)
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JP2022506377A5 (https=
JP2022506377A (ja
Inventor
フェリチ、ステファノ
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テクノプローべ ソシエタ ペル アチオニ
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2021523712A 2018-11-06 2019-11-05 被試験デバイスに対する改善された接触特性を有する垂直プローブヘッド Active JP7470114B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT102018000010071A IT201800010071A1 (it) 2018-11-06 2018-11-06 Testa di misura a sonde verticali con migliorate proprietà di contatto con un dispositivo di test
IT102018000010071 2018-11-06
PCT/EP2019/080171 WO2020094608A1 (en) 2018-11-06 2019-11-05 Vertical probe head with improved contact properties towards a device under test

Publications (3)

Publication Number Publication Date
JP2022506377A JP2022506377A (ja) 2022-01-17
JP2022506377A5 JP2022506377A5 (https=) 2022-10-21
JP7470114B2 true JP7470114B2 (ja) 2024-04-17

Family

ID=65409291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021523712A Active JP7470114B2 (ja) 2018-11-06 2019-11-05 被試験デバイスに対する改善された接触特性を有する垂直プローブヘッド

Country Status (10)

Country Link
US (1) US12085588B2 (https=)
EP (1) EP3877768A1 (https=)
JP (1) JP7470114B2 (https=)
KR (1) KR20210089206A (https=)
CN (1) CN113039444A (https=)
IT (1) IT201800010071A1 (https=)
PH (1) PH12021550959A1 (https=)
SG (1) SG11202104299SA (https=)
TW (1) TWI837207B (https=)
WO (1) WO2020094608A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831307B (zh) * 2022-07-26 2024-02-01 思達科技股份有限公司 導板結構及探針陣列
IT202200026214A1 (it) * 2022-12-21 2024-06-21 Technoprobe Spa Testa di misura a sonde verticali perfezionata
KR20240160318A (ko) 2023-05-02 2024-11-11 김상한 수직형 프로브 핀을 가진 프로브 핀 조립체 및 그 제작 방법
KR102923549B1 (ko) * 2023-11-23 2026-02-06 주식회사 에스디에이 핀 포스가 조절되는 버티컬 프로브카드
KR102854722B1 (ko) * 2024-01-30 2025-09-02 경북대학교 산학협력단 반도체 소자 검사용 스크럽 발생 방지형 멤스 핀

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007127488A (ja) 2005-11-02 2007-05-24 Rika Denshi Co Ltd プローブカード
US20120025859A1 (en) 2010-07-27 2012-02-02 Chao-Ching Huang Combined probe head for a vertical probe card and method for assembling and aligning the combined probe head thereof
JP2015118064A (ja) 2013-12-20 2015-06-25 東京特殊電線株式会社 コンタクトプローブユニット
JP2018523095A (ja) 2015-05-07 2018-08-16 テクノプローベ エス．ピー．エー． 特に低減ピッチ用途のための、垂直プローブを有するテストヘッド

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6411112B1 (en) * 1998-02-19 2002-06-25 International Business Machines Corporation Off-axis contact tip and dense packing design for a fine pitch probe
JP3942823B2 (ja) * 2000-12-28 2007-07-11 山一電機株式会社 検査装置
FR2860347A1 (fr) * 2003-09-29 2005-04-01 Probest Connecteur electrique a au moins deux contacts
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
EP2107380A1 (en) * 2008-04-01 2009-10-07 Technoprobe S.p.A Testing head having vertical probes configured to improve the electric contact with a device to be tested
JP2009276097A (ja) 2008-05-12 2009-11-26 Nidec-Read Corp 基板検査治具
CN107003335B (zh) * 2015-01-04 2020-05-22 金日 接触测试装置
MY187095A (en) * 2015-03-13 2021-08-31 Technoprobe Spa Testing head with vertical probes, particularly for high frequency applications
JP5822042B1 (ja) 2015-03-27 2015-11-24 日本電産リード株式会社 検査治具、基板検査装置、及び検査治具の製造方法
WO2016156002A1 (en) * 2015-03-31 2016-10-06 Technoprobe S.P.A. Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications
US10866266B2 (en) * 2015-10-29 2020-12-15 Taiwan Semiconductor Manufacturing Company Ltd. Probe head receiver and probe card assembly having the same
KR101886536B1 (ko) * 2016-12-27 2018-08-07 주식회사 텝스 접촉력을 조절할 수 있는 스트레이트 니들 프로브 카드
IT201700046645A1 (it) * 2017-04-28 2018-10-28 Technoprobe Spa Scheda di misura per un’apparecchiatura di test di dispositivi elettronici
WO2019129585A1 (en) * 2017-12-28 2019-07-04 Technoprobe S.P.A. Probe head having vertical probes with respectively opposite scrub directions

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007127488A (ja) 2005-11-02 2007-05-24 Rika Denshi Co Ltd プローブカード
US20120025859A1 (en) 2010-07-27 2012-02-02 Chao-Ching Huang Combined probe head for a vertical probe card and method for assembling and aligning the combined probe head thereof
JP2015118064A (ja) 2013-12-20 2015-06-25 東京特殊電線株式会社 コンタクトプローブユニット
JP2018523095A (ja) 2015-05-07 2018-08-16 テクノプローベ エス．ピー．エー． 特に低減ピッチ用途のための、垂直プローブを有するテストヘッド

Also Published As

Publication number Publication date
JP2022506377A (ja) 2022-01-17
US12085588B2 (en) 2024-09-10
PH12021550959A1 (en) 2021-11-29
EP3877768A1 (en) 2021-09-15
KR20210089206A (ko) 2021-07-15
TW202022387A (zh) 2020-06-16
US20210255218A1 (en) 2021-08-19
TWI837207B (zh) 2024-04-01
SG11202104299SA (en) 2021-05-28
WO2020094608A1 (en) 2020-05-14
CN113039444A (zh) 2021-06-25
IT201800010071A1 (it) 2020-05-06

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