TWI837207B - 對於待測裝置具有增進的接觸性質的垂直探針頭及其探針卡 - Google Patents
對於待測裝置具有增進的接觸性質的垂直探針頭及其探針卡 Download PDFInfo
- Publication number
- TWI837207B TWI837207B TW108139541A TW108139541A TWI837207B TW I837207 B TWI837207 B TW I837207B TW 108139541 A TW108139541 A TW 108139541A TW 108139541 A TW108139541 A TW 108139541A TW I837207 B TWI837207 B TW I837207B
- Authority
- TW
- Taiwan
- Prior art keywords
- guide
- guide holes
- probe head
- contact
- probes
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 299
- 238000012360 testing method Methods 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 230000033001 locomotion Effects 0.000 claims abstract description 19
- 238000007790 scraping Methods 0.000 claims description 43
- 238000006073 displacement reaction Methods 0.000 claims description 35
- 230000009466 transformation Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 30
- 238000003825 pressing Methods 0.000 description 5
- 238000006748 scratching Methods 0.000 description 4
- 230000002393 scratching effect Effects 0.000 description 4
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 3
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102018000010071A IT201800010071A1 (it) | 2018-11-06 | 2018-11-06 | Testa di misura a sonde verticali con migliorate proprietà di contatto con un dispositivo di test |
| IT102018000010071 | 2018-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202022387A TW202022387A (zh) | 2020-06-16 |
| TWI837207B true TWI837207B (zh) | 2024-04-01 |
Family
ID=65409291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108139541A TWI837207B (zh) | 2018-11-06 | 2019-10-31 | 對於待測裝置具有增進的接觸性質的垂直探針頭及其探針卡 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US12085588B2 (https=) |
| EP (1) | EP3877768A1 (https=) |
| JP (1) | JP7470114B2 (https=) |
| KR (1) | KR20210089206A (https=) |
| CN (1) | CN113039444A (https=) |
| IT (1) | IT201800010071A1 (https=) |
| PH (1) | PH12021550959A1 (https=) |
| SG (1) | SG11202104299SA (https=) |
| TW (1) | TWI837207B (https=) |
| WO (1) | WO2020094608A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI831307B (zh) * | 2022-07-26 | 2024-02-01 | 思達科技股份有限公司 | 導板結構及探針陣列 |
| IT202200026214A1 (it) * | 2022-12-21 | 2024-06-21 | Technoprobe Spa | Testa di misura a sonde verticali perfezionata |
| KR20240160318A (ko) | 2023-05-02 | 2024-11-11 | 김상한 | 수직형 프로브 핀을 가진 프로브 핀 조립체 및 그 제작 방법 |
| KR102923549B1 (ko) * | 2023-11-23 | 2026-02-06 | 주식회사 에스디에이 | 핀 포스가 조절되는 버티컬 프로브카드 |
| KR102854722B1 (ko) * | 2024-01-30 | 2025-09-02 | 경북대학교 산학협력단 | 반도체 소자 검사용 스크럽 발생 방지형 멤스 핀 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007127488A (ja) * | 2005-11-02 | 2007-05-24 | Rika Denshi Co Ltd | プローブカード |
| US8723546B2 (en) * | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
| TW201839408A (zh) * | 2017-04-28 | 2018-11-01 | 義大利商探針科技公司 | 電子裝置的測試設備的探針卡 |
| WO2019129585A1 (en) * | 2017-12-28 | 2019-07-04 | Technoprobe S.P.A. | Probe head having vertical probes with respectively opposite scrub directions |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6411112B1 (en) * | 1998-02-19 | 2002-06-25 | International Business Machines Corporation | Off-axis contact tip and dense packing design for a fine pitch probe |
| JP3942823B2 (ja) * | 2000-12-28 | 2007-07-11 | 山一電機株式会社 | 検査装置 |
| FR2860347A1 (fr) * | 2003-09-29 | 2005-04-01 | Probest | Connecteur electrique a au moins deux contacts |
| EP2107380A1 (en) * | 2008-04-01 | 2009-10-07 | Technoprobe S.p.A | Testing head having vertical probes configured to improve the electric contact with a device to be tested |
| JP2009276097A (ja) | 2008-05-12 | 2009-11-26 | Nidec-Read Corp | 基板検査治具 |
| TWI435083B (zh) * | 2010-07-27 | 2014-04-21 | Mpi Corp | Combination probe head for vertical probe card and its assembly alignment method |
| JP6305754B2 (ja) * | 2013-12-20 | 2018-04-04 | 東京特殊電線株式会社 | コンタクトプローブユニット |
| CN107003335B (zh) * | 2015-01-04 | 2020-05-22 | 金日 | 接触测试装置 |
| MY187095A (en) * | 2015-03-13 | 2021-08-31 | Technoprobe Spa | Testing head with vertical probes, particularly for high frequency applications |
| JP5822042B1 (ja) | 2015-03-27 | 2015-11-24 | 日本電産リード株式会社 | 検査治具、基板検査装置、及び検査治具の製造方法 |
| WO2016156002A1 (en) * | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications |
| WO2016177850A1 (en) | 2015-05-07 | 2016-11-10 | Technoprobe S.P.A. | Testing head having vertical probes, in particular for reduced pitch applications |
| US10866266B2 (en) * | 2015-10-29 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company Ltd. | Probe head receiver and probe card assembly having the same |
| KR101886536B1 (ko) * | 2016-12-27 | 2018-08-07 | 주식회사 텝스 | 접촉력을 조절할 수 있는 스트레이트 니들 프로브 카드 |
-
2018
- 2018-11-06 IT IT102018000010071A patent/IT201800010071A1/it unknown
-
2019
- 2019-10-31 TW TW108139541A patent/TWI837207B/zh active
- 2019-11-05 WO PCT/EP2019/080171 patent/WO2020094608A1/en not_active Ceased
- 2019-11-05 KR KR1020217016991A patent/KR20210089206A/ko not_active Ceased
- 2019-11-05 CN CN201980073132.8A patent/CN113039444A/zh active Pending
- 2019-11-05 SG SG11202104299SA patent/SG11202104299SA/en unknown
- 2019-11-05 EP EP19797728.3A patent/EP3877768A1/en not_active Withdrawn
- 2019-11-05 JP JP2021523712A patent/JP7470114B2/ja active Active
-
2021
- 2021-04-27 PH PH12021550959A patent/PH12021550959A1/en unknown
- 2021-05-05 US US17/308,636 patent/US12085588B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007127488A (ja) * | 2005-11-02 | 2007-05-24 | Rika Denshi Co Ltd | プローブカード |
| US8723546B2 (en) * | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
| TW201839408A (zh) * | 2017-04-28 | 2018-11-01 | 義大利商探針科技公司 | 電子裝置的測試設備的探針卡 |
| WO2019129585A1 (en) * | 2017-12-28 | 2019-07-04 | Technoprobe S.P.A. | Probe head having vertical probes with respectively opposite scrub directions |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7470114B2 (ja) | 2024-04-17 |
| JP2022506377A (ja) | 2022-01-17 |
| US12085588B2 (en) | 2024-09-10 |
| PH12021550959A1 (en) | 2021-11-29 |
| EP3877768A1 (en) | 2021-09-15 |
| KR20210089206A (ko) | 2021-07-15 |
| TW202022387A (zh) | 2020-06-16 |
| US20210255218A1 (en) | 2021-08-19 |
| SG11202104299SA (en) | 2021-05-28 |
| WO2020094608A1 (en) | 2020-05-14 |
| CN113039444A (zh) | 2021-06-25 |
| IT201800010071A1 (it) | 2020-05-06 |
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