PH12015500100A1 - Mold release film - Google Patents

Mold release film

Info

Publication number
PH12015500100A1
PH12015500100A1 PH12015500100A PH12015500100A PH12015500100A1 PH 12015500100 A1 PH12015500100 A1 PH 12015500100A1 PH 12015500100 A PH12015500100 A PH 12015500100A PH 12015500100 A PH12015500100 A PH 12015500100A PH 12015500100 A1 PH12015500100 A1 PH 12015500100A1
Authority
PH
Philippines
Prior art keywords
mold release
release film
test piece
measurement
base layer
Prior art date
Application number
PH12015500100A
Other languages
English (en)
Inventor
Taniguchi Hirohito
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of PH12015500100A1 publication Critical patent/PH12015500100A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/005—Presence of styrenic polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/006—Presence of styrenic polymer in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
PH12015500100A 2012-07-17 2015-01-14 Mold release film PH12015500100A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012158584A JP5895755B2 (ja) 2012-07-17 2012-07-17 離型フィルム
PCT/JP2013/068396 WO2014013884A1 (ja) 2012-07-17 2013-07-04 離型フィルム

Publications (1)

Publication Number Publication Date
PH12015500100A1 true PH12015500100A1 (en) 2015-03-02

Family

ID=49948714

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015500100A PH12015500100A1 (en) 2012-07-17 2015-01-14 Mold release film

Country Status (6)

Country Link
JP (1) JP5895755B2 (ja)
KR (1) KR20150035596A (ja)
CN (1) CN104507680B (ja)
PH (1) PH12015500100A1 (ja)
TW (1) TWI554375B (ja)
WO (1) WO2014013884A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6398221B2 (ja) * 2014-02-26 2018-10-03 住友ベークライト株式会社 樹脂封止半導体装置製造用離型フィルム、樹脂封止半導体装置製造用離型フィルムの製造方法及び樹脂封止半導体装置の製造方法
JP6303727B2 (ja) * 2014-03-31 2018-04-04 住友ベークライト株式会社 離型フィルム
JP6467800B2 (ja) * 2014-07-30 2019-02-13 住友ベークライト株式会社 離型フィルム
JP6648400B2 (ja) * 2014-11-10 2020-02-14 凸版印刷株式会社 端子用樹脂フィルム、それを用いたタブ及び蓄電デバイス
WO2018173683A1 (ja) * 2017-03-22 2018-09-27 住友ベークライト株式会社 離型フィルムおよびフレキシブルプリント回路基板の製造方法
CN113226758B (zh) * 2018-12-28 2023-06-27 株式会社可乐丽 装饰薄膜用的基础薄膜及包含其的装饰薄膜
JP7281381B2 (ja) * 2019-10-04 2023-05-25 出光興産株式会社 低誘電材用樹脂積層体
CN113924825B (zh) * 2020-10-21 2022-10-25 住友电木株式会社 脱模膜及成型品的制造方法
JP6870775B1 (ja) * 2020-10-21 2021-05-12 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
CN114080866B (zh) * 2020-10-21 2022-09-16 住友电木株式会社 脱模膜及成型品的制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001161747A (ja) * 1999-12-08 2001-06-19 Kao Corp 吸収性物品
JP2004082502A (ja) * 2002-08-27 2004-03-18 Mitsubishi Plastics Ind Ltd 離型用フィルム
JP5585079B2 (ja) * 2007-07-31 2014-09-10 住友ベークライト株式会社 離型フィルム
JP5272589B2 (ja) * 2008-09-01 2013-08-28 住友ベークライト株式会社 離型フィルム
JP5353217B2 (ja) * 2008-12-11 2013-11-27 住友ベークライト株式会社 離型フィルム並びにそれを用いた接着方法及び回路基板の製造方法
TWI451959B (zh) * 2009-10-19 2014-09-11 Kureha Corp Solvent release film and laminates made of polyphenylene sulfide resin
JP2011088287A (ja) * 2009-10-20 2011-05-06 Pilot Ink Co Ltd 多芯筆記具
JP2011088387A (ja) * 2009-10-23 2011-05-06 Idemitsu Kosan Co Ltd フレキシブルプリント基盤製造用積層体
JP5488809B2 (ja) * 2010-02-09 2014-05-14 住友ベークライト株式会社 積層フィルム
JP5557152B2 (ja) * 2010-02-09 2014-07-23 住友ベークライト株式会社 積層フィルム
WO2011099252A1 (ja) * 2010-02-09 2011-08-18 住友ベークライト株式会社 積層フィルム
JP4918181B2 (ja) * 2010-06-02 2012-04-18 三井化学東セロ株式会社 半導体ウェハ表面保護用シート、およびそれを用いた半導体ウェハの保護方法と半導体装置の製造方法

Also Published As

Publication number Publication date
TW201406518A (zh) 2014-02-16
TWI554375B (zh) 2016-10-21
KR20150035596A (ko) 2015-04-06
CN104507680A (zh) 2015-04-08
WO2014013884A1 (ja) 2014-01-23
JP5895755B2 (ja) 2016-03-30
JP2014019017A (ja) 2014-02-03
CN104507680B (zh) 2016-10-19

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