NO921632L - Epoksymateriale for paafoering paa flater - Google Patents

Epoksymateriale for paafoering paa flater

Info

Publication number
NO921632L
NO921632L NO92921632A NO921632A NO921632L NO 921632 L NO921632 L NO 921632L NO 92921632 A NO92921632 A NO 92921632A NO 921632 A NO921632 A NO 921632A NO 921632 L NO921632 L NO 921632L
Authority
NO
Norway
Prior art keywords
application
epoxy material
multifunctional
silica
disclosed
Prior art date
Application number
NO92921632A
Other languages
English (en)
Norwegian (no)
Other versions
NO921632D0 (no
Inventor
Michael Kenrick Gallagher
Michael Anthony Petti
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of NO921632D0 publication Critical patent/NO921632D0/no
Publication of NO921632L publication Critical patent/NO921632L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Wrappers (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Paints Or Removers (AREA)
  • Knives (AREA)
NO92921632A 1991-05-01 1992-04-28 Epoksymateriale for paafoering paa flater NO921632L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69388291A 1991-05-01 1991-05-01

Publications (2)

Publication Number Publication Date
NO921632D0 NO921632D0 (no) 1992-04-28
NO921632L true NO921632L (no) 1992-11-02

Family

ID=24786516

Family Applications (1)

Application Number Title Priority Date Filing Date
NO92921632A NO921632L (no) 1991-05-01 1992-04-28 Epoksymateriale for paafoering paa flater

Country Status (21)

Country Link
US (1) US5434199A (fi)
EP (1) EP0511833B1 (fi)
JP (1) JP3340462B2 (fi)
KR (1) KR100234942B1 (fi)
CN (1) CN1041578C (fi)
AT (1) ATE142370T1 (fi)
AU (1) AU660666B2 (fi)
BR (1) BR9201580A (fi)
CA (1) CA2066497A1 (fi)
DE (1) DE69213308T2 (fi)
FI (1) FI921981A (fi)
IE (1) IE921403A1 (fi)
IL (1) IL101664A (fi)
MX (1) MX9202065A (fi)
MY (1) MY110809A (fi)
NO (1) NO921632L (fi)
NZ (1) NZ242461A (fi)
PH (1) PH30678A (fi)
SG (1) SG38926A1 (fi)
TW (1) TW252138B (fi)
ZA (1) ZA923022B (fi)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW398163B (en) 1996-10-09 2000-07-11 Matsushita Electric Ind Co Ltd The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
JPH10195179A (ja) * 1997-01-08 1998-07-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
SG63803A1 (en) * 1997-01-23 1999-03-30 Toray Industries Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device
US6214905B1 (en) * 1997-12-23 2001-04-10 Cookson Singapore Pte Ltd C/O Alpha Metals, Inc. Epoxy mold compound and method
TW459016B (en) 1998-03-13 2001-10-11 Sumitomo Chemical Co Epoxy resin composition and resin-encapsulated semiconductor device
JP3479827B2 (ja) * 1998-04-27 2003-12-15 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3388537B2 (ja) * 1998-05-15 2003-03-24 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US6297306B1 (en) 1998-05-15 2001-10-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
US6291556B1 (en) 1999-03-26 2001-09-18 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
JP2000294692A (ja) * 1999-04-06 2000-10-20 Hitachi Ltd 樹脂封止型電子装置及びその製造方法並びにそれを使用した内燃機関用点火コイル装置
TW538482B (en) * 1999-04-26 2003-06-21 Shinetsu Chemical Co Semiconductor encapsulating epoxy resin composition and semiconductor device
JP4187062B2 (ja) * 2000-08-24 2008-11-26 電気化学工業株式会社 金属ベース回路基板
WO2002083792A1 (fr) * 2001-04-13 2002-10-24 Idemitsu Petrochemical Co., Ltd. Composition de resine de sulfure de polyarylene pour fabrication de pieces pour transmission optique
US20040166241A1 (en) * 2003-02-20 2004-08-26 Henkel Loctite Corporation Molding compositions containing quaternary organophosphonium salts
JP4300418B2 (ja) * 2004-04-30 2009-07-22 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
KR101317745B1 (ko) * 2005-01-13 2013-10-15 스미토모 베이클라이트 가부시키가이샤 반도체 밀봉용 에폭시 수지 조성물 및 반도체 장치
ATE496971T1 (de) * 2005-11-16 2011-02-15 Basf Se Flammwidrige prepregs und laminate für leiterplatten
US8063120B2 (en) 2006-05-12 2011-11-22 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic powder and use thereof
JP5864828B2 (ja) 2007-08-31 2016-02-17 東レ・ダウコーニング株式会社 シリコーンゴムパウダーおよびその製造方法
JP2009057500A (ja) * 2007-08-31 2009-03-19 Dow Corning Toray Co Ltd 硬化性エポキシ樹脂組成物およびその硬化物
WO2013149386A1 (zh) * 2012-04-05 2013-10-10 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板
US9036109B2 (en) * 2012-08-20 2015-05-19 Apple Inc. Electronic device with thermally matched light guide plate
CN107275018A (zh) * 2017-05-16 2017-10-20 东莞市晴远电子有限公司 一种无感电阻及用于该无感电阻的高导热绝缘材料
EP3932987A4 (en) * 2019-02-25 2022-11-23 Kuraray Co., Ltd. WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING THE SAME, WATERPROOFING METHOD USING INSERT MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417006A (en) * 1981-06-08 1983-11-22 Material Sciences Corporation Organopolysiloxane coating compositions
JPS62270617A (ja) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
KR900006033B1 (ko) * 1987-05-30 1990-08-20 고려화학 주식회사 저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물
JP2595292B2 (ja) * 1988-03-17 1997-04-02 住友ベークライト株式会社 電気・電子部品封止用樹脂組成物
JPH01294765A (ja) * 1988-05-20 1989-11-28 Nippon Retsuku Kk エポキシ樹脂組成物
JPH0229420A (ja) * 1988-07-19 1990-01-31 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料
JPH0232117A (ja) * 1988-07-21 1990-02-01 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
JP2660012B2 (ja) * 1988-09-13 1997-10-08 株式会社東芝 ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置
JP2641277B2 (ja) * 1988-11-30 1997-08-13 住友ベークライト株式会社 エポキシ樹脂組成物
JPH02182747A (ja) * 1989-01-09 1990-07-17 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPH02212514A (ja) * 1989-02-14 1990-08-23 Sumitomo Bakelite Co Ltd 樹脂組成物
JP2642470B2 (ja) * 1989-02-23 1997-08-20 株式会社東芝 封止用樹脂組成物及び樹脂封止型半導体装置
JP2631233B2 (ja) * 1989-03-31 1997-07-16 一夫 中野 往復回転運動を１方向回転運動に変換して取り出す装置
US5134204A (en) * 1989-05-12 1992-07-28 Mitsui Toatsu Chemicals, Inc. Resin composition for sealing semiconductors
JPH02302422A (ja) * 1989-05-18 1990-12-14 Mitsui Toatsu Chem Inc 半導体封止用樹脂組成物
US5114991A (en) * 1990-02-26 1992-05-19 Gencorp Inc. Paper felts or mats

Also Published As

Publication number Publication date
DE69213308D1 (de) 1996-10-10
AU660666B2 (en) 1995-07-06
MX9202065A (es) 1992-12-01
NZ242461A (en) 1994-04-27
NO921632D0 (no) 1992-04-28
ATE142370T1 (de) 1996-09-15
CN1069147A (zh) 1993-02-17
JP3340462B2 (ja) 2002-11-05
AU1519592A (en) 1992-11-05
ZA923022B (en) 1992-12-30
CA2066497A1 (en) 1992-11-02
DE69213308T2 (de) 1997-01-30
KR920021646A (ko) 1992-12-18
CN1041578C (zh) 1999-01-06
EP0511833A2 (en) 1992-11-04
BR9201580A (pt) 1992-12-15
MY110809A (en) 1999-05-31
TW252138B (fi) 1995-07-21
US5434199A (en) 1995-07-18
KR100234942B1 (ko) 1999-12-15
FI921981A (fi) 1992-11-02
IE921403A1 (en) 1992-11-04
EP0511833B1 (en) 1996-09-04
PH30678A (en) 1997-09-16
SG38926A1 (en) 1999-09-21
EP0511833A3 (en) 1992-12-30
JPH05152467A (ja) 1993-06-18
IL101664A0 (en) 1992-12-30
IL101664A (en) 1996-01-31
FI921981A0 (fi) 1992-04-30

Similar Documents

Publication Publication Date Title
NO921632L (no) Epoksymateriale for paafoering paa flater
AU627757B2 (en) Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof
DK0408990T3 (da) Varmehærdende reaktionsharpiksblandinger.
DE60109366D1 (de) Klebstoff auf der Basis von Epoxidharzen mit Allyl- oder Vinylgruppen zur Befestigung von Halbleitern
DE58909681D1 (de) Polyoxyalkylendithiole und Polyamine enthaltende härtbare Epoxidharz-Stoffgemische
HK71096A (en) Method for packing a measured quantity of thermosetting resin intended for encapsulating a componentpacking obtained using this method method for operating a mould and mould for carrying out this method
DE68923152T2 (de) Epoxyharz und siliciumhaltiges Elastomer umfassende härtbare Zweikomponentenzusammensetzung.
NO167399C (no) Pulverformig belegningsmiddel for formbelegning paa basis av en umettet polyesterharpiks.
DE68928275D1 (de) Härtbare Zweikomponentenzusammensetzung, enthaltend Epoxidharz und ein Silizium umfassendes elastomerisches Polymer
MX165861B (es) Resina acrilica estabilizada y procedimiento de fabricacion
DE69121926T2 (de) Kautschuk-modifizierte Epoxyharzzusammensetzungen
DE68922938D1 (de) Härtbare Epoxydharzzusammensetzungen.
EP0818511A3 (en) Curable liquid-form composition, cured product of the same, and electronic part
NO854684L (no) Grunningsmiddel.
DK0459745T3 (da) Hærdningsmiddel til epoxyharpiks
EP0197524A3 (en) Curable epoxy-acrylamide compositions
KR840008536A (ko) 반도체장치 및 그 제조법
DE59408336D1 (de) Rieselfähige pulverförmige Pressmassen auf Epoxidharzbasis