DK0459745T3 - Hærdningsmiddel til epoxyharpiks - Google Patents

Hærdningsmiddel til epoxyharpiks

Info

Publication number
DK0459745T3
DK0459745T3 DK91304790.8T DK91304790T DK0459745T3 DK 0459745 T3 DK0459745 T3 DK 0459745T3 DK 91304790 T DK91304790 T DK 91304790T DK 0459745 T3 DK0459745 T3 DK 0459745T3
Authority
DK
Denmark
Prior art keywords
curing agent
epoxy resin
curable compositions
epoxy
automobiles
Prior art date
Application number
DK91304790.8T
Other languages
English (en)
Inventor
Souichi Muroi
Hsi-Chuan Tsai
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP02138176A external-priority patent/JP3098760B2/ja
Priority claimed from JP2163966A external-priority patent/JP2914390B2/ja
Priority claimed from JP07061591A external-priority patent/JP3168016B2/ja
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of DK0459745T3 publication Critical patent/DK0459745T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
DK91304790.8T 1990-05-28 1991-05-28 Hærdningsmiddel til epoxyharpiks DK0459745T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP02138176A JP3098760B2 (ja) 1990-05-28 1990-05-28 球状エポキシ樹脂用硬化剤
JP2163966A JP2914390B2 (ja) 1990-06-21 1990-06-21 改良されたエポキシ樹脂用硬化剤マスターバッチ
JP07061591A JP3168016B2 (ja) 1991-03-11 1991-03-11 エポキシ樹脂用硬化剤マスターバッチ

Publications (1)

Publication Number Publication Date
DK0459745T3 true DK0459745T3 (da) 1998-03-30

Family

ID=27300385

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91304790.8T DK0459745T3 (da) 1990-05-28 1991-05-28 Hærdningsmiddel til epoxyharpiks

Country Status (7)

Country Link
EP (1) EP0459745B1 (da)
AT (1) ATE157107T1 (da)
CA (1) CA2043337C (da)
DE (1) DE69127321T2 (da)
DK (1) DK0459745T3 (da)
ES (1) ES2107440T3 (da)
GR (1) GR3024834T3 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MXPA05013554A (es) * 2003-06-13 2006-04-05 Dow Global Technologies Inc Catalizadores fundibles y productos de poliuretano elaborados a partir de los mismos.
US7820772B2 (en) 2004-03-31 2010-10-26 Asahi Kasei Chemicals Corporation Hardener for epoxy resin and epoxy resin composition
KR101495383B1 (ko) * 2007-11-08 2015-02-24 가부시키가이샤 아데카 분말상 에폭시 수지용 잠재성 경화제의 제조 방법, 그 방법에 의해 얻어진 분말상 에폭시 수지용 잠재성 경화제, 및 그것을 이용한 경화성 에폭시 수지 조성물
US8067484B2 (en) 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
US8044154B2 (en) 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
GB2578737B (en) * 2018-11-05 2022-02-23 Aev Holding Ltd Curable epoxy resin and use thereof
CN112280244B (zh) * 2020-10-28 2023-11-03 上海库弗新材料有限公司 一种低翘曲的环氧树脂组合物及其制备方法
CN114230749B (zh) * 2021-11-29 2023-03-17 西安交通大学 一种可快速自修复环氧树脂固化物、制备方法及应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1403867A (fr) * 1963-05-16 1965-06-25 Ici Ltd Dispersions de polymères synthétiques
DE2943689A1 (de) * 1979-10-30 1981-05-14 Basf Ag, 6700 Ludwigshafen Verfahren zur herstellung von stabilen polymer-polyol-dispersionen
US4833226A (en) * 1987-08-26 1989-05-23 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system

Also Published As

Publication number Publication date
GR3024834T3 (en) 1998-01-30
EP0459745A3 (en) 1992-08-19
DE69127321T2 (de) 1998-01-29
CA2043337C (en) 2003-04-15
DE69127321D1 (de) 1997-09-25
EP0459745A2 (en) 1991-12-04
EP0459745B1 (en) 1997-08-20
ATE157107T1 (de) 1997-09-15
ES2107440T3 (es) 1997-12-01
CA2043337A1 (en) 1991-11-29

Similar Documents

Publication Publication Date Title
AU627757B2 (en) Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof
NO934352L (no) Bindemiddelblanding for pulvermalinger
DE69023088D1 (de) Wärmehärtende Pulverlackzusammensetzung.
NO891955L (no) Klebemiddel.
ES2087069T3 (es) Mezclas de resinas epoxi reticulables que contienen polioxialquilenditioles y poliaminas.
KR900013006A (ko) 반도체 봉지용 에폭시 수지 조성물 및 그 경화물
EP0315090A3 (en) Epoxy resin compositions for use in low temperature curing applications
FI921981A (fi) Epoxipresskompositon foer ytmonteringsapplikationer
KR920014906A (ko) 분말상 에폭시 수지 코팅 조성물
DK0459745T3 (da) Hærdningsmiddel til epoxyharpiks
ATE120222T1 (de) Eingedickte härtbare formmassen aus einem vinylester- oder vinylesterurethanharz.
DE68922938T2 (de) Härtbare Epoxydharzzusammensetzungen.
ES2120490T3 (es) Suspension estable al almacenamiento de endurecedores y modificadores de impacto para resinas epoxi.
ATE110097T1 (de) Pulverförmige überzugsmittel auf der basis von epoxyharzen.
EP0197524A3 (en) Curable epoxy-acrylamide compositions
Waddill Epoxy adhesive formulations with enhanced properties
KR900000420A (ko) 열경화성 에폭시 수지에 의거한 분말 피복 조성물
KR910021426A (ko) 글리시딜에스테르-무수물 부가물, 그로써 에폭시 수지를 경화시키는 방법 및 에폭시 수지 분말 코우팅 시스템으로의 상기 방법의 적용