NO325816B1 - Straleanordning for vesentlig undertrykkelse av en hoyfrekvent strom i en elektrisk komponent - Google Patents
Straleanordning for vesentlig undertrykkelse av en hoyfrekvent strom i en elektrisk komponent Download PDFInfo
- Publication number
- NO325816B1 NO325816B1 NO20011706A NO20011706A NO325816B1 NO 325816 B1 NO325816 B1 NO 325816B1 NO 20011706 A NO20011706 A NO 20011706A NO 20011706 A NO20011706 A NO 20011706A NO 325816 B1 NO325816 B1 NO 325816B1
- Authority
- NO
- Norway
- Prior art keywords
- radiator
- frequency
- magnetic
- frequency current
- stated
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title description 3
- 239000000203 mixture Substances 0.000 claims description 37
- 238000004544 sputter deposition Methods 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 28
- 230000035699 permeability Effects 0.000 claims description 23
- 239000000696 magnetic material Substances 0.000 claims description 21
- 230000004044 response Effects 0.000 claims description 17
- 230000005415 magnetization Effects 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 18
- 239000011521 glass Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 12
- 238000013016 damping Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 239000002131 composite material Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005546 reactive sputtering Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007737 ion beam deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Thin Magnetic Films (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000103171A JP4287020B2 (ja) | 2000-04-05 | 2000-04-05 | 高周波電流抑制型放熱板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO20011706D0 NO20011706D0 (no) | 2001-04-04 |
| NO20011706L NO20011706L (no) | 2001-10-08 |
| NO325816B1 true NO325816B1 (no) | 2008-07-21 |
Family
ID=18616931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20011706A NO325816B1 (no) | 2000-04-05 | 2001-04-04 | Straleanordning for vesentlig undertrykkelse av en hoyfrekvent strom i en elektrisk komponent |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6624714B2 (zh) |
| EP (1) | EP1143777B1 (zh) |
| JP (1) | JP4287020B2 (zh) |
| KR (1) | KR100789051B1 (zh) |
| CN (1) | CN1222034C (zh) |
| DE (1) | DE60109343T2 (zh) |
| MY (1) | MY123590A (zh) |
| NO (1) | NO325816B1 (zh) |
| SG (1) | SG102619A1 (zh) |
| TW (1) | TWI248780B (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI266591B (en) * | 2005-05-05 | 2006-11-11 | Amulaire Thermal Technology In | Heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method |
| JPWO2008035540A1 (ja) * | 2006-09-19 | 2010-01-28 | 日本電気株式会社 | 電子装置搭載機器とその共振抑制方法 |
| CN101653056B (zh) * | 2007-02-15 | 2011-08-31 | 日本电气株式会社 | 电子器件安装设备及其噪声抑制方法 |
| JP2009253253A (ja) * | 2008-04-11 | 2009-10-29 | Fuji Electric Holdings Co Ltd | 冷却フィン |
| EP2725612A1 (en) * | 2012-10-29 | 2014-04-30 | TP Vision Holding B.V. | Heat conductor device and method of forming a heat conductor device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5291064A (en) * | 1991-04-16 | 1994-03-01 | Nec Corporation | Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing |
| US5164683A (en) * | 1991-10-21 | 1992-11-17 | Motorola, Inc. | RF amplifier assembly |
| US5303113A (en) | 1992-03-30 | 1994-04-12 | General Electric Company | Digital circuit interrupter with RFI and EMI shielding |
| JP2828059B2 (ja) * | 1996-08-28 | 1998-11-25 | 日本電気株式会社 | ヒートシンクの実装構造 |
| US5956576A (en) * | 1996-09-13 | 1999-09-21 | International Business Machines Corporation | Enhanced protection of semiconductors with dual surface seal |
| TW571373B (en) * | 1996-12-04 | 2004-01-11 | Seiko Epson Corp | Semiconductor device, circuit substrate, and electronic machine |
| US5880930A (en) | 1997-06-18 | 1999-03-09 | Silicon Graphics, Inc. | Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism |
| JP3012867B2 (ja) * | 1998-01-22 | 2000-02-28 | インターナショナル・ビジネス・マシーンズ・コーポレイション | コンピュ―タ用ヒ―トシンク装置 |
| KR100302986B1 (ko) * | 1999-07-08 | 2001-09-22 | 이종석 | 사출성형용 금형 |
| US6390475B1 (en) | 1999-08-31 | 2002-05-21 | Intel Corporation | Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die |
-
2000
- 2000-04-05 JP JP2000103171A patent/JP4287020B2/ja not_active Expired - Fee Related
-
2001
- 2001-04-03 US US09/824,935 patent/US6624714B2/en not_active Expired - Fee Related
- 2001-04-03 KR KR1020010017665A patent/KR100789051B1/ko not_active IP Right Cessation
- 2001-04-03 SG SG200101992A patent/SG102619A1/en unknown
- 2001-04-04 TW TW090108101A patent/TWI248780B/zh active
- 2001-04-04 DE DE60109343T patent/DE60109343T2/de not_active Expired - Lifetime
- 2001-04-04 EP EP01108514A patent/EP1143777B1/en not_active Expired - Lifetime
- 2001-04-04 NO NO20011706A patent/NO325816B1/no unknown
- 2001-04-04 CN CNB011165650A patent/CN1222034C/zh not_active Expired - Fee Related
- 2001-04-05 MY MYPI20011654A patent/MY123590A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NO20011706D0 (no) | 2001-04-04 |
| DE60109343T2 (de) | 2006-02-09 |
| US6624714B2 (en) | 2003-09-23 |
| KR20010095275A (ko) | 2001-11-03 |
| EP1143777B1 (en) | 2005-03-16 |
| NO20011706L (no) | 2001-10-08 |
| TWI248780B (en) | 2006-02-01 |
| KR100789051B1 (ko) | 2007-12-26 |
| CN1222034C (zh) | 2005-10-05 |
| SG102619A1 (en) | 2004-03-26 |
| EP1143777A1 (en) | 2001-10-10 |
| US20010040790A1 (en) | 2001-11-15 |
| DE60109343D1 (de) | 2005-04-21 |
| JP4287020B2 (ja) | 2009-07-01 |
| JP2001291981A (ja) | 2001-10-19 |
| CN1316775A (zh) | 2001-10-10 |
| MY123590A (en) | 2006-05-31 |
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