TWI266591B - Heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method - Google Patents

Heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method

Info

Publication number
TWI266591B
TWI266591B TW094114559A TW94114559A TWI266591B TW I266591 B TWI266591 B TW I266591B TW 094114559 A TW094114559 A TW 094114559A TW 94114559 A TW94114559 A TW 94114559A TW I266591 B TWI266591 B TW I266591B
Authority
TW
Taiwan
Prior art keywords
melting point
low
point alloy
layer
manufacturing
Prior art date
Application number
TW094114559A
Other languages
Chinese (zh)
Other versions
TW200640346A (en
Inventor
Jiun-Hou Jan
Original Assignee
Amulaire Thermal Technology In
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amulaire Thermal Technology In filed Critical Amulaire Thermal Technology In
Priority to TW094114559A priority Critical patent/TWI266591B/en
Priority to JP2006127785A priority patent/JP2006324657A/en
Priority to KR1020060040196A priority patent/KR20060115620A/en
Application granted granted Critical
Publication of TWI266591B publication Critical patent/TWI266591B/en
Publication of TW200640346A publication Critical patent/TW200640346A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A kind of heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method are revealed. In the invention, the low-melting point alloy material is heated to a temperature higher than its melting point; and the melted low-melting point alloy material is sprayed and coated on the heat sink to form a coating layer that is directly coated on the heat sink such that it is capable of using the coating layer to contact with heat source. Thus, it is capable of saving the working-hour and making the operation convenient so as to further raise the heat conduction effects.
TW094114559A 2005-05-05 2005-05-05 Heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method TWI266591B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094114559A TWI266591B (en) 2005-05-05 2005-05-05 Heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method
JP2006127785A JP2006324657A (en) 2005-05-05 2006-05-01 Heat-radiator device having low-melting metal alloy-coated layer and method of fabricating the same
KR1020060040196A KR20060115620A (en) 2005-05-05 2006-05-03 Heat dissipation device having low melting point alloy coating and a method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094114559A TWI266591B (en) 2005-05-05 2005-05-05 Heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method

Publications (2)

Publication Number Publication Date
TWI266591B true TWI266591B (en) 2006-11-11
TW200640346A TW200640346A (en) 2006-11-16

Family

ID=37544063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094114559A TWI266591B (en) 2005-05-05 2005-05-05 Heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method

Country Status (3)

Country Link
JP (1) JP2006324657A (en)
KR (1) KR20060115620A (en)
TW (1) TWI266591B (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135758A (en) * 1999-11-04 2001-05-18 Toyota Autom Loom Works Ltd Heat-radiating structure for power module
JP4287020B2 (en) * 2000-04-05 2009-07-01 Ｎｅｃトーキン株式会社 High frequency current suppression type heat sink
US6797758B2 (en) * 2000-04-05 2004-09-28 The Bergquist Company Morphing fillers and thermal interface materials
JP2003027080A (en) * 2001-07-11 2003-01-29 Hitachi Ltd Thermally conductive grease, method for mounting the same, method for cooling electronic component, electronic device and information processing device

Also Published As

Publication number Publication date
JP2006324657A (en) 2006-11-30
KR20060115620A (en) 2006-11-09
TW200640346A (en) 2006-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees