NO20083174L - Anordning og fremgangsmate for overflatebehandling av substrater - Google Patents
Anordning og fremgangsmate for overflatebehandling av substraterInfo
- Publication number
- NO20083174L NO20083174L NO20083174A NO20083174A NO20083174L NO 20083174 L NO20083174 L NO 20083174L NO 20083174 A NO20083174 A NO 20083174A NO 20083174 A NO20083174 A NO 20083174A NO 20083174 L NO20083174 L NO 20083174L
- Authority
- NO
- Norway
- Prior art keywords
- plane
- process medium
- transport
- conveying unit
- suction
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005062527A DE102005062527A1 (de) | 2005-12-16 | 2005-12-16 | Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten |
PCT/EP2006/012117 WO2007073887A1 (fr) | 2005-12-16 | 2006-12-15 | Procede et dispositif de traitement de surface de substrats |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20083174L true NO20083174L (no) | 2008-08-26 |
Family
ID=37714456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20083174A NO20083174L (no) | 2005-12-16 | 2008-07-16 | Anordning og fremgangsmate for overflatebehandling av substrater |
Country Status (13)
Country | Link |
---|---|
US (1) | US7862661B2 (fr) |
EP (1) | EP1961035B1 (fr) |
JP (1) | JP5313684B2 (fr) |
KR (1) | KR101352855B1 (fr) |
CN (1) | CN101331584B (fr) |
AT (1) | ATE431963T1 (fr) |
AU (1) | AU2006331081B2 (fr) |
CA (1) | CA2632897A1 (fr) |
DE (2) | DE102005062527A1 (fr) |
ES (1) | ES2326240T3 (fr) |
IL (1) | IL192071A (fr) |
NO (1) | NO20083174L (fr) |
WO (1) | WO2007073887A1 (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007054090A1 (de) * | 2007-11-13 | 2009-05-20 | Rena Sondermaschinen Gmbh | Vorrichtung und Verfahren zur einseitigen Nassbehandlung von Gut |
DE102007054091A1 (de) | 2007-11-13 | 2009-05-28 | Rena Sondermaschinen Gmbh | Vorrichtung und Verfahren zum gleichmäßigen Transport von Substraten |
DE102008026199B3 (de) * | 2008-05-30 | 2009-10-08 | Rena Gmbh | Vorrichtung und Verfahren zur elektrischen Kontaktierung von ebenem Gut in Durchlaufanlagen |
DE102008037404A1 (de) | 2008-09-30 | 2010-04-01 | Schott Solar Ag | Verfahren zur chemischen Behandlung eines Substrats |
DE102009050845A1 (de) | 2009-10-19 | 2011-04-21 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung einer Substratoberfläche eines Substrats |
DE102009051847A1 (de) | 2009-10-29 | 2011-05-19 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung einer Substratoberlfäche eines Substrats |
DE102010056046A1 (de) | 2010-12-23 | 2012-06-28 | Schott Solar Ag | Verfahren zur Herstellung von sauberen visuell fleckenfreien Wafern, derart erhaltene Wafer sowie deren Verwendung |
CN103620800A (zh) | 2011-04-19 | 2014-03-05 | 弗劳恩霍弗实用研究促进协会 | 用于制造太阳能电池的方法 |
CN103021905B (zh) | 2011-07-20 | 2016-12-21 | 显示器生产服务株式会社 | 基板处理装置 |
DE102011081327A1 (de) * | 2011-08-22 | 2013-02-28 | Gebr. Schmid Gmbh | Vorrichtung zur Oberflächenbehandlung von Substraten |
DE102011081980B4 (de) | 2011-09-01 | 2023-07-06 | Gebr. Schmid Gmbh & Co. | Vorrichtung zum Benetzen von flachen Substraten und Anlage mit einer solchen Vorrichtung |
DE102011081981A1 (de) * | 2011-09-01 | 2013-03-07 | Gebr. Schmid Gmbh & Co. | Vorrichtung und Anlage zum Bearbeiten von flachen Substraten |
CN102916075A (zh) * | 2012-09-27 | 2013-02-06 | 奥特斯维能源(太仓)有限公司 | 一种制绒深度稳定的方法 |
DE102012221012B4 (de) * | 2012-11-16 | 2023-01-19 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur Behandlung von flachem Behandlungsgut |
DE102013202138A1 (de) | 2013-02-08 | 2014-08-14 | Gebr. Schmid Gmbh | Vorrichtung zur Substratnassbehandlung und Verwendung |
CN105592944B (zh) * | 2013-07-29 | 2018-05-11 | 贝克太阳能有限公司 | 对基板进行的空间有限的加工 |
DE102014110222B4 (de) | 2014-07-21 | 2016-06-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Strukturierung von Ober- und Unterseite eines Halbleitersubstrats |
DE102015221646A1 (de) * | 2015-11-04 | 2017-05-04 | Gebr. Schmid Gmbh | Behandlungsfluid-Absaugvorrichtung und diese enthaltende Ätzvorrichtung |
DE102016009499A1 (de) | 2016-08-04 | 2018-02-08 | International Solar Energy Research Center Konstanz E.V. | Verfahren und Vorrichtung zum Aufbringen einer Flüssigkeitskappe auf einer Substratoberseite als Schutz der Substratoberseite in einseitigen, horizontalen nasschemischen Behandlungsprozessen |
CN108735595A (zh) * | 2017-04-13 | 2018-11-02 | Rct解决方法有限责任公司 | 用于化学处理半导体衬底的方法和设备 |
DE202018005633U1 (de) | 2018-12-08 | 2019-03-26 | H2GEMINI Technology Consulting GmbH | Vorrichtung zur selektiven Ätzung von Substraten |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1269510A (en) | 1968-09-20 | 1972-04-06 | Pilkington Tiles Ltd | Improved method for the protection of glazed surfaces |
DE2004706A1 (de) | 1970-02-03 | 1971-08-26 | Goetzewerke Friedrich Goetze Ag, 5673 Burscheid | Vorrichtung zum gleichmaßigen Auftragen von Flüssigkeiten auf Werkstoffbahnen |
AU3687671A (en) | 1970-12-18 | 1973-06-21 | Pucci Luigi | Machine foe coating bya uniform layer of paint ora similar product wood board or similar |
GB1373959A (en) * | 1971-08-05 | 1974-11-13 | Kodak Ltd | Surface application processors |
DE3205911C2 (de) | 1982-02-19 | 1985-12-05 | Küsters, Eduard, 4150 Krefeld | Vorrichtung zum gleichmäßigen Auftragen geringer Flüssigkeitsmengen auf eine laufende Textilbahn |
DE3401588A1 (de) | 1983-02-01 | 1984-08-02 | Molins PLC, London | Vorrichtung zum aufbringen von klebstoff |
DE3813518A1 (de) * | 1988-04-22 | 1989-11-02 | Hoellmueller Maschbau H | Maschine zum reinigen und/oder spuelen von bohrungen in leiterplatten |
DE3816614A1 (de) | 1988-05-16 | 1989-11-30 | Siemens Ag | Verfahren und vorrichtung zur beschichtung von flachbaugruppen |
DE8907704U1 (de) | 1989-06-23 | 1989-08-31 | Herberts Gmbh, 5600 Wuppertal | Vorrichtung zur Kantenbeschichtung von Tafelschnittstellen |
JPH03266432A (ja) * | 1990-03-16 | 1991-11-27 | Toshiba Corp | 半導体基板の洗浄方法およびその洗浄装置 |
JP2595838B2 (ja) * | 1991-06-19 | 1997-04-02 | 富士通株式会社 | 水溶液中のガス吸引装置 |
DE4201057C2 (de) | 1992-01-17 | 1995-11-23 | Voith Gmbh J M | Auftrags- bzw. Dosiereinrichtung |
US5232501A (en) * | 1992-02-21 | 1993-08-03 | Advanced Systems Incorporated | Apparatus for processing printed circuit board substrates |
JP2735433B2 (ja) * | 1992-05-14 | 1998-04-02 | 富山日本電気株式会社 | 薬液処理用スリット機構 |
DE19516032C2 (de) | 1995-05-04 | 2001-03-01 | Zecher Gmbh Kurt | Verfahren zur Oberflächenveredelung einer Farbübertragungswalze durch Ionenimplantation |
JP2855257B2 (ja) | 1994-09-19 | 1999-02-10 | ニチアス株式会社 | オイル保持筒およびオイル塗布ローラ |
DE19605601C1 (de) | 1996-02-15 | 1997-11-20 | Singulus Technologies Gmbh | Vorrichtung zur Oberflächenbeschichtung bzw. zum Lackieren von Substraten |
US5844030A (en) * | 1996-07-09 | 1998-12-01 | Andros; Nicholas | Charged ion cleaning devices and cleaning system |
DE19633741C2 (de) * | 1996-08-22 | 1998-06-04 | Sundwiger Eisen Maschinen | Vorrichtung zum Benetzen einer Seite einer laufenden Materialbahn |
US5820673A (en) * | 1996-11-12 | 1998-10-13 | Sentilles; J. Bruce | Apparatus for applying coatings to lenses and curing the coatings |
JP3511441B2 (ja) * | 1996-11-29 | 2004-03-29 | 忠弘 大見 | 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法 |
TW391893B (en) * | 1997-05-30 | 2000-06-01 | Fairchild Corp | Method and apparatus for spin-coating chemicals |
DE19800955A1 (de) * | 1998-01-13 | 1999-07-15 | Voith Sulzer Papiertech Patent | Vorrichtung zum Auftragen eines flüssigen oder pastösen Auftragsmediums auf eine laufende Materialbahn, insbesondere aus Papier oder Karton |
DE19916762A1 (de) * | 1999-04-14 | 2000-11-02 | Klaschka Gmbh & Co | Vorrichtung zum Besprühen von Werkstücken mit einer Flüssigkeit |
JP2001212533A (ja) | 2000-02-03 | 2001-08-07 | Dainippon Printing Co Ltd | 基板端面の洗浄装置 |
DE20010388U1 (de) | 2000-06-09 | 2001-10-11 | Timatec Maschinen Und Anlagenbau Gmbh, Velden | Vorrichtung zum Auftragen von Substanzen auf bahnförmiges Material |
US6794300B1 (en) * | 2001-08-10 | 2004-09-21 | Creative Design Corp. | Mechanically scanned wet chemical processing |
DE10225848A1 (de) * | 2002-06-04 | 2003-12-24 | Schmid Gmbh & Co Geb | Vorrichtung und Verfahren zum Lösen von Schichten von der Oberseite von flächigen Substraten |
JP2004228301A (ja) * | 2003-01-22 | 2004-08-12 | Sharp Corp | 基板処理装置および基板処理方法 |
JP2006196784A (ja) * | 2005-01-14 | 2006-07-27 | Sharp Corp | 基板表面処理装置 |
JP2006196781A (ja) * | 2005-01-14 | 2006-07-27 | Sharp Corp | 基板表面処理装置 |
JP2006303042A (ja) * | 2005-04-18 | 2006-11-02 | Sharp Corp | 基板表面処理装置 |
DE102005062528A1 (de) * | 2005-12-16 | 2007-06-21 | Gebr. Schmid Gmbh & Co. | Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten |
-
2005
- 2005-12-16 DE DE102005062527A patent/DE102005062527A1/de not_active Withdrawn
-
2006
- 2006-12-15 CN CN2006800471446A patent/CN101331584B/zh active Active
- 2006-12-15 AT AT06829658T patent/ATE431963T1/de active
- 2006-12-15 DE DE502006003786T patent/DE502006003786D1/de active Active
- 2006-12-15 AU AU2006331081A patent/AU2006331081B2/en not_active Ceased
- 2006-12-15 KR KR1020087014380A patent/KR101352855B1/ko active IP Right Grant
- 2006-12-15 JP JP2008544889A patent/JP5313684B2/ja not_active Expired - Fee Related
- 2006-12-15 EP EP06829658A patent/EP1961035B1/fr active Active
- 2006-12-15 ES ES06829658T patent/ES2326240T3/es active Active
- 2006-12-15 CA CA002632897A patent/CA2632897A1/fr not_active Abandoned
- 2006-12-15 WO PCT/EP2006/012117 patent/WO2007073887A1/fr active Application Filing
-
2008
- 2008-06-11 IL IL192071A patent/IL192071A/en not_active IP Right Cessation
- 2008-06-12 US US12/138,125 patent/US7862661B2/en active Active
- 2008-07-16 NO NO20083174A patent/NO20083174L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP5313684B2 (ja) | 2013-10-09 |
AU2006331081B2 (en) | 2011-09-01 |
KR20080093974A (ko) | 2008-10-22 |
EP1961035B1 (fr) | 2009-05-20 |
CA2632897A1 (fr) | 2007-07-05 |
KR101352855B1 (ko) | 2014-01-20 |
CN101331584B (zh) | 2010-06-16 |
DE502006003786D1 (de) | 2009-07-02 |
EP1961035A1 (fr) | 2008-08-27 |
WO2007073887A1 (fr) | 2007-07-05 |
US20080241378A1 (en) | 2008-10-02 |
DE102005062527A1 (de) | 2007-06-21 |
ATE431963T1 (de) | 2009-06-15 |
AU2006331081A1 (en) | 2007-07-05 |
CN101331584A (zh) | 2008-12-24 |
IL192071A (en) | 2011-11-30 |
ES2326240T3 (es) | 2009-10-05 |
US7862661B2 (en) | 2011-01-04 |
IL192071A0 (en) | 2009-02-11 |
JP2009519591A (ja) | 2009-05-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |