NO178089C - Fremgangsmåte for fremstilling av et elektronisk hukommelseskort - Google Patents
Fremgangsmåte for fremstilling av et elektronisk hukommelseskortInfo
- Publication number
- NO178089C NO178089C NO880166A NO880166A NO178089C NO 178089 C NO178089 C NO 178089C NO 880166 A NO880166 A NO 880166A NO 880166 A NO880166 A NO 880166A NO 178089 C NO178089 C NO 178089C
- Authority
- NO
- Norway
- Prior art keywords
- manufacturing
- memory card
- electronic memory
- mould
- plastic material
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Holo Graphy (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Packaging For Recording Disks (AREA)
- External Artificial Organs (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electrically Operated Instructional Devices (AREA)
- Non-Volatile Memory (AREA)
- Collating Specific Patterns (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Compression, Expansion, Code Conversion, And Decoders (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8700446A FR2609821B1 (fr) | 1987-01-16 | 1987-01-16 | Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede |
Publications (4)
Publication Number | Publication Date |
---|---|
NO880166D0 NO880166D0 (no) | 1988-01-15 |
NO880166L NO880166L (no) | 1988-07-18 |
NO178089B NO178089B (no) | 1995-10-09 |
NO178089C true NO178089C (no) | 1996-01-17 |
Family
ID=9346968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO880166A NO178089C (no) | 1987-01-16 | 1988-01-15 | Fremgangsmåte for fremstilling av et elektronisk hukommelseskort |
Country Status (18)
Country | Link |
---|---|
EP (1) | EP0277854B1 (fi) |
JP (1) | JPS63239097A (fi) |
KR (1) | KR880009317A (fi) |
AT (1) | ATE74456T1 (fi) |
AU (1) | AU600785B2 (fi) |
BR (1) | BR8800135A (fi) |
CA (1) | CA1306058C (fi) |
DE (1) | DE3869635D1 (fi) |
DK (1) | DK16988A (fi) |
ES (1) | ES2031248T3 (fi) |
FI (1) | FI93156C (fi) |
FR (1) | FR2609821B1 (fi) |
GR (1) | GR3004900T3 (fi) |
IN (1) | IN170183B (fi) |
NO (1) | NO178089C (fi) |
NZ (1) | NZ223192A (fi) |
PT (1) | PT86557A (fi) |
ZA (1) | ZA88279B (fi) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0825349B2 (ja) * | 1987-10-22 | 1996-03-13 | 日本ユーロテック株式会社 | カードの製造法 |
US4943708A (en) * | 1988-02-01 | 1990-07-24 | Motorola, Inc. | Data device module having locking groove |
FR2636755B1 (fr) * | 1988-09-16 | 1992-05-22 | Schlumberger Ind Sa | Procede de realisation de cartes a memoire et cartes obtenues par ledit procede |
US4961893A (en) * | 1988-04-28 | 1990-10-09 | Schlumberger Industries | Method for manufacturing memory cards |
EP0361194A3 (de) * | 1988-09-30 | 1991-06-12 | Siemens Aktiengesellschaft | Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen |
JP2559834B2 (ja) * | 1989-01-12 | 1996-12-04 | 三菱電機株式会社 | Icカード |
JPH0687484B2 (ja) * | 1989-04-06 | 1994-11-02 | 三菱電機株式会社 | Icカード用モジュール |
US5244840A (en) * | 1989-05-23 | 1993-09-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
FR2647571B1 (fr) * | 1989-05-26 | 1994-07-22 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede |
FR2659157B2 (fr) * | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
FR2666687A1 (fr) * | 1990-09-06 | 1992-03-13 | Sgs Thomson Microelectronics | Circuit integre a boitier moule comprenant un dissipateur thermique et procede de fabrication. |
IT1243817B (it) * | 1990-10-09 | 1994-06-28 | Sgs Thomson Microelectronics | Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato |
DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
FI913357A (fi) * | 1991-07-10 | 1993-01-11 | Valtion Teknillinen | Foerfarande och form foer framstaellning av en straengsprutad elektronikmodul |
US5286426A (en) * | 1992-04-01 | 1994-02-15 | Allegro Microsystems, Inc. | Assembling a lead frame between a pair of molding cavity plates |
DE4401588C2 (de) * | 1994-01-20 | 2003-02-20 | Gemplus Gmbh | Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul |
DE9422424U1 (de) * | 1994-02-04 | 2002-02-21 | Giesecke & Devrient GmbH, 81677 München | Chipkarte mit einem elektronischen Modul |
JPH0890600A (ja) * | 1994-09-22 | 1996-04-09 | Rhythm Watch Co Ltd | Icカード製造金型 |
DE4435802A1 (de) | 1994-10-06 | 1996-04-11 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens |
JP3409943B2 (ja) * | 1995-05-25 | 2003-05-26 | 昭和電工株式会社 | 輸液容器用口栓体及びその製法 |
FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
DE19625228C2 (de) * | 1996-06-24 | 1998-05-14 | Siemens Ag | Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse |
EP0890928A3 (en) * | 1997-07-10 | 2001-06-13 | Sarnoff Corporation | Transmission apparatus and remotely identifying an electronically coded article |
EP0938060A1 (de) * | 1998-02-20 | 1999-08-25 | ESEC Management SA | Verfahren zur Herstellung eines Chipobjektes und Chipobjekt |
EP1118111A1 (de) * | 1998-09-29 | 2001-07-25 | Tyco Electronics Logistics AG | Verfahren zum eingiessen eines flachen elektronikmoduls in einen kunststoffkartenkörper durch thermoplastisches spritzgiessen |
FR2895547B1 (fr) * | 2005-12-26 | 2008-06-06 | Oberthur Card Syst Sa | Procede de fabrication d'une carte a microcircuit |
EP1923821B1 (en) | 2006-11-17 | 2012-03-28 | Oberthur Technologies | Method of fabricating an entity and corresponding device |
US11267172B2 (en) * | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
EP3679523B1 (en) | 2017-09-07 | 2023-02-01 | Composecure LLC | Transaction card with embedded electronic components and process for manufacture |
CN118364848A (zh) | 2017-10-18 | 2024-07-19 | 安全创造有限责任公司 | 具有窗或窗图案和可选背光的金属、陶瓷或陶瓷涂层的交易卡 |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3051195C2 (de) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
JPS6086850A (ja) * | 1983-10-18 | 1985-05-16 | Dainippon Printing Co Ltd | Icカ−ド |
JPS60146383A (ja) * | 1984-01-10 | 1985-08-02 | Dainippon Printing Co Ltd | Icカ−ド |
JPS61222712A (ja) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | 樹脂封止成形体の製造方法 |
JPS6232094A (ja) * | 1985-08-05 | 1987-02-12 | カシオ計算機株式会社 | Icカ−ド |
-
1987
- 1987-01-16 FR FR8700446A patent/FR2609821B1/fr not_active Expired
-
1988
- 1988-01-11 AU AU10160/88A patent/AU600785B2/en not_active Ceased
- 1988-01-12 IN IN17/MAS/88A patent/IN170183B/en unknown
- 1988-01-12 KR KR1019880000153A patent/KR880009317A/ko not_active Application Discontinuation
- 1988-01-13 JP JP63005678A patent/JPS63239097A/ja active Pending
- 1988-01-14 EP EP88400068A patent/EP0277854B1/fr not_active Revoked
- 1988-01-14 NZ NZ223192A patent/NZ223192A/xx unknown
- 1988-01-14 ES ES198888400068T patent/ES2031248T3/es not_active Expired - Lifetime
- 1988-01-14 FI FI880152A patent/FI93156C/fi not_active IP Right Cessation
- 1988-01-14 AT AT88400068T patent/ATE74456T1/de not_active IP Right Cessation
- 1988-01-14 DE DE8888400068T patent/DE3869635D1/de not_active Revoked
- 1988-01-14 DK DK016988A patent/DK16988A/da not_active Application Discontinuation
- 1988-01-15 BR BR8800135A patent/BR8800135A/pt not_active IP Right Cessation
- 1988-01-15 CA CA000556637A patent/CA1306058C/en not_active Expired - Fee Related
- 1988-01-15 PT PT86557A patent/PT86557A/pt not_active Application Discontinuation
- 1988-01-15 NO NO880166A patent/NO178089C/no unknown
- 1988-01-15 ZA ZA880279A patent/ZA88279B/xx unknown
-
1992
- 1992-06-11 GR GR920401244T patent/GR3004900T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
CA1306058C (en) | 1992-08-04 |
ATE74456T1 (de) | 1992-04-15 |
NO880166D0 (no) | 1988-01-15 |
FI880152A0 (fi) | 1988-01-14 |
EP0277854B1 (fr) | 1992-04-01 |
FR2609821A1 (fr) | 1988-07-22 |
FR2609821B1 (fr) | 1989-03-31 |
FI93156C (fi) | 1995-02-27 |
DK16988D0 (da) | 1988-01-14 |
FI880152A (fi) | 1988-07-17 |
EP0277854A1 (fr) | 1988-08-10 |
BR8800135A (pt) | 1988-08-23 |
AU1016088A (en) | 1988-07-21 |
ZA88279B (en) | 1988-07-01 |
AU600785B2 (en) | 1990-08-23 |
ES2031248T3 (es) | 1992-12-01 |
JPS63239097A (ja) | 1988-10-05 |
NZ223192A (en) | 1989-09-27 |
GR3004900T3 (fi) | 1993-04-28 |
IN170183B (fi) | 1992-02-22 |
NO178089B (no) | 1995-10-09 |
PT86557A (pt) | 1989-01-30 |
DE3869635D1 (de) | 1992-05-07 |
DK16988A (da) | 1988-07-17 |
NO880166L (no) | 1988-07-18 |
KR880009317A (ko) | 1988-09-14 |
FI93156B (fi) | 1994-11-15 |
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