NL9402233A - Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal. - Google Patents

Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal. Download PDF

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Publication number
NL9402233A
NL9402233A NL9402233A NL9402233A NL9402233A NL 9402233 A NL9402233 A NL 9402233A NL 9402233 A NL9402233 A NL 9402233A NL 9402233 A NL9402233 A NL 9402233A NL 9402233 A NL9402233 A NL 9402233A
Authority
NL
Netherlands
Prior art keywords
plastic material
thermoplastic
thermoset
electronic component
encapsulated
Prior art date
Application number
NL9402233A
Other languages
English (en)
Dutch (nl)
Inventor
Ireneus Johannes Theodorus Pas
Johannes Gerard Lodew Nelissen
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Priority to NL9402233A priority Critical patent/NL9402233A/nl
Priority to MYPI95004023A priority patent/MY131688A/en
Priority to CA002166043A priority patent/CA2166043A1/en
Priority to JP07337400A priority patent/JP3126104B2/ja
Priority to TW084113863A priority patent/TW312843B/zh
Priority to KR1019950059470A priority patent/KR960026681A/ko
Priority to EP95203655A priority patent/EP0720901B1/en
Priority to DE69509739T priority patent/DE69509739T2/de
Priority to ES95203655T priority patent/ES2133662T3/es
Priority to AT95203655T priority patent/ATE180201T1/de
Priority to SG1995002387A priority patent/SG35053A1/en
Priority to RU95122410/28A priority patent/RU2151447C1/ru
Priority to US08/581,132 priority patent/US5895620A/en
Priority to MX9600185A priority patent/MX9600185A/es
Publication of NL9402233A publication Critical patent/NL9402233A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
NL9402233A 1994-12-29 1994-12-29 Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal. NL9402233A (nl)

Priority Applications (14)

Application Number Priority Date Filing Date Title
NL9402233A NL9402233A (nl) 1994-12-29 1994-12-29 Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.
MYPI95004023A MY131688A (en) 1994-12-29 1995-12-21 Process for encapsulating an electronic component, an electronic component thus encapsulated, and encapsulating material designed therefor
CA002166043A CA2166043A1 (en) 1994-12-29 1995-12-22 Process for encapsulating an electronic component, an electronic component thus encapsulated, and encapsulating material designed therefor
JP07337400A JP3126104B2 (ja) 1994-12-29 1995-12-25 電子部品のカプセル封入法、そのようにしてカプセル封入された電子部品及びカプセル封入用カプセル封入材
TW084113863A TW312843B (zh) 1994-12-29 1995-12-26
KR1019950059470A KR960026681A (ko) 1994-12-29 1995-12-27 전자소자를 캡슐화하는 방법, 그 방법에 의해 캡슐화된 전자소자, 및 그 전자소자를 위해 설계된 캡슐재료
EP95203655A EP0720901B1 (en) 1994-12-29 1995-12-27 Process for encapsulating an electronic component and electronic component thus encapsulated
DE69509739T DE69509739T2 (de) 1994-12-29 1995-12-27 Verfahren zur Verkapselung von einem elektronischen Bauelement und durch dieses Verfahren verkapseltes elektronisches Bauelement
ES95203655T ES2133662T3 (es) 1994-12-29 1995-12-27 Proceso para encapsular un componente electronico y componente electronico asi encapsulado.
AT95203655T ATE180201T1 (de) 1994-12-29 1995-12-27 Verfahren zur verkapselung von einem elektronischen bauelement und durch dieses verfahren verkapseltes elektronisches bauelement
SG1995002387A SG35053A1 (en) 1994-12-29 1995-12-28 Process for encapsulating an electronic component an electronic component thus encapsulated and encapsulating material designed therefor
RU95122410/28A RU2151447C1 (ru) 1994-12-29 1995-12-28 Способ герметизации электронных компонентов и электронный компонент
US08/581,132 US5895620A (en) 1994-12-29 1995-12-29 Process for encapsulating an electronic component
MX9600185A MX9600185A (es) 1994-12-29 1996-01-10 Proceso para encapsular un componente electronico, un componente electronico encapsulado asi y material encapsulado preparado para ello.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9402233 1994-12-29
NL9402233A NL9402233A (nl) 1994-12-29 1994-12-29 Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.

Publications (1)

Publication Number Publication Date
NL9402233A true NL9402233A (nl) 1996-08-01

Family

ID=19865082

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9402233A NL9402233A (nl) 1994-12-29 1994-12-29 Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.

Country Status (14)

Country Link
US (1) US5895620A (zh)
EP (1) EP0720901B1 (zh)
JP (1) JP3126104B2 (zh)
KR (1) KR960026681A (zh)
AT (1) ATE180201T1 (zh)
CA (1) CA2166043A1 (zh)
DE (1) DE69509739T2 (zh)
ES (1) ES2133662T3 (zh)
MX (1) MX9600185A (zh)
MY (1) MY131688A (zh)
NL (1) NL9402233A (zh)
RU (1) RU2151447C1 (zh)
SG (1) SG35053A1 (zh)
TW (1) TW312843B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2768707B1 (fr) * 1997-09-22 1999-10-29 Plastic Omnium Cie Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
WO2005118245A1 (en) 2004-05-20 2005-12-15 Albemarle Corporation Pelletized brominated anionic styrenic polymers and their preparation and use
US9202770B1 (en) 2014-09-01 2015-12-01 Freescale Semiconductor, Inc. Non-homogeneous molding of packaged semiconductor devices
DE102017219020A1 (de) * 2017-10-25 2019-04-25 Volkswagen Aktiengesellschaft Verfahren zur Herstellung eines fertigen Bauteils umfassend ein Elektronikelement
KR102536941B1 (ko) * 2020-09-28 2023-05-26 한국전자통신연구원 반도체 패키지의 제조 방법
CN113644203B (zh) * 2021-08-09 2024-02-27 天津大学 一种基于热塑性弹性体的有机太阳能电池及其制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0044136A1 (en) * 1980-07-04 1982-01-20 Asahi Glass Company Ltd. Encapsulation of electronic device
JPS57158271A (en) * 1981-03-26 1982-09-30 Showa Electric Wire & Cable Co Ltd Film extrusion-coating resin composition
JPS5911360A (ja) * 1982-07-09 1984-01-20 Toray Ind Inc 耐衝撃性熱可塑性樹脂組成物
EP0104543A1 (en) * 1982-09-17 1984-04-04 Dainippon Ink And Chemicals, Inc. Resin composition
FR2545653A1 (fr) * 1983-05-04 1984-11-09 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
EP0151553A2 (de) * 1984-02-03 1985-08-14 Ciba-Geigy Ag Epoxiharz/Polysulfon-Formmassen für gehärtete Produkte mit ausgezeichneter Riss- und Feuchtigkeitsbeständigkeit
EP0211147A1 (en) * 1985-07-18 1987-02-25 Mitsubishi Denki Kabushiki Kaisha Epoxy resin composition
EP0365168A2 (en) * 1988-10-05 1990-04-25 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911075A (en) * 1974-02-28 1975-10-07 Western Electric Co Transfer molding thermosetting polymeric material
US3969461A (en) * 1974-02-28 1976-07-13 Western Electric Company, Inc. Transfer molding thermosetting polymeric material
US4327369A (en) * 1979-08-06 1982-04-27 Hi-Tech Industries, Inc. Encapsulating moisture-proof coating
US4359831A (en) * 1980-05-19 1982-11-23 De Lorean Manufacturing Company Reversibly powered rotary snow tiller
US4853442A (en) * 1987-04-03 1989-08-01 Hercules Incorporated Amine-terminated polysulfone sulfide, useful as epoxy curing agent
JPS63289016A (ja) * 1987-05-22 1988-11-25 Asahi Glass Co Ltd エポキシ樹脂組成物
US5364914A (en) * 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
US5326516A (en) * 1989-10-03 1994-07-05 Plasticolors, Inc. Method of preparing a cured pigmented thermosetting polymer composition exhibiting improved color values and reduced haze
EP0545973A4 (en) * 1990-08-27 1993-09-15 E.I. Du Pont De Nemours And Company Toughened thermoplastic polyester compositions
DE4140876C2 (de) * 1991-12-11 1994-04-21 Voith Gmbh J M Walzenpresse
US5443775A (en) * 1992-05-08 1995-08-22 Plasticolors, Inc. Process for preparing pigmented thermoplastic polymer compositions and low shrinking thermosetting resin molding composition
ES2127803T3 (es) * 1992-08-11 1999-05-01 Hexcel Corp Resinas termoestables endurecidas con polimeros de sulfona.

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0044136A1 (en) * 1980-07-04 1982-01-20 Asahi Glass Company Ltd. Encapsulation of electronic device
JPS57158271A (en) * 1981-03-26 1982-09-30 Showa Electric Wire & Cable Co Ltd Film extrusion-coating resin composition
JPS5911360A (ja) * 1982-07-09 1984-01-20 Toray Ind Inc 耐衝撃性熱可塑性樹脂組成物
EP0104543A1 (en) * 1982-09-17 1984-04-04 Dainippon Ink And Chemicals, Inc. Resin composition
FR2545653A1 (fr) * 1983-05-04 1984-11-09 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
EP0151553A2 (de) * 1984-02-03 1985-08-14 Ciba-Geigy Ag Epoxiharz/Polysulfon-Formmassen für gehärtete Produkte mit ausgezeichneter Riss- und Feuchtigkeitsbeständigkeit
EP0211147A1 (en) * 1985-07-18 1987-02-25 Mitsubishi Denki Kabushiki Kaisha Epoxy resin composition
EP0365168A2 (en) * 1988-10-05 1990-04-25 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 8245, Derwent World Patents Index; AN 82-95874E *
DATABASE WPI Week 8409, Derwent World Patents Index; AN 84-052691 *

Also Published As

Publication number Publication date
KR960026681A (ko) 1996-07-22
US5895620A (en) 1999-04-20
RU2151447C1 (ru) 2000-06-20
MY131688A (en) 2007-08-30
ES2133662T3 (es) 1999-09-16
EP0720901B1 (en) 1999-05-19
JP3126104B2 (ja) 2001-01-22
MX9600185A (es) 1997-01-31
DE69509739D1 (de) 1999-06-24
JPH08274221A (ja) 1996-10-18
ATE180201T1 (de) 1999-06-15
TW312843B (zh) 1997-08-11
DE69509739T2 (de) 1999-10-21
SG35053A1 (en) 1997-02-01
CA2166043A1 (en) 1996-06-30
EP0720901A1 (en) 1996-07-10

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BV The patent application has lapsed