NL8600534A - Inrichting en werkwijze voor geautomatiseerde wafelverwerking. - Google Patents

Inrichting en werkwijze voor geautomatiseerde wafelverwerking. Download PDF

Info

Publication number
NL8600534A
NL8600534A NL8600534A NL8600534A NL8600534A NL 8600534 A NL8600534 A NL 8600534A NL 8600534 A NL8600534 A NL 8600534A NL 8600534 A NL8600534 A NL 8600534A NL 8600534 A NL8600534 A NL 8600534A
Authority
NL
Netherlands
Prior art keywords
strain gauge
workpiece
coupled
parts
housing
Prior art date
Application number
NL8600534A
Other languages
English (en)
Dutch (nl)
Original Assignee
Epsilon Techn Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epsilon Techn Inc filed Critical Epsilon Techn Inc
Publication of NL8600534A publication Critical patent/NL8600534A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/085—Force or torque sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/08—Gripping heads and other end effectors having finger members
    • B25J15/10—Gripping heads and other end effectors having finger members with three or more finger members
    • B25J15/103—Gripping heads and other end effectors having finger members with three or more finger members for gripping the object in three contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
NL8600534A 1985-03-07 1986-03-03 Inrichting en werkwijze voor geautomatiseerde wafelverwerking. NL8600534A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70951885A 1985-03-07 1985-03-07
US70951885 1985-03-07

Publications (1)

Publication Number Publication Date
NL8600534A true NL8600534A (nl) 1986-10-01

Family

ID=24850195

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8600534A NL8600534A (nl) 1985-03-07 1986-03-03 Inrichting en werkwijze voor geautomatiseerde wafelverwerking.

Country Status (5)

Country Link
JP (1) JPS61226287A (ja)
DE (1) DE3607588A1 (ja)
FR (1) FR2578471A1 (ja)
GB (1) GB2171978B (ja)
NL (1) NL8600534A (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816116A (en) * 1985-10-24 1989-03-28 Texas Instruments Incorporated Semiconductor wafer transfer method and arm mechanism
CA1331163C (en) * 1986-04-18 1994-08-02 Applied Materials, Inc. Multiple-processing and contamination-free plasma etching system
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
JPS6323332A (ja) * 1986-04-28 1988-01-30 バリアン・アソシエイツ・インコ−ポレイテツド ウエーハ移送方法及び装置
DE3707672A1 (de) * 1987-03-10 1988-09-22 Sitesa Sa Epitaxieanlage
WO1988009303A1 (en) * 1987-05-21 1988-12-01 Hine Design Inc. Method and apparatus for aligning silicon wafers
US5102291A (en) * 1987-05-21 1992-04-07 Hine Design Inc. Method for transporting silicon wafers
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
DE3837688A1 (de) * 1988-11-05 1990-05-10 Leybold Ag Vorrichtung zur bearbeitung von werkstuecken, vorzugsweise von kreisscheibenfoermigen, flachen substraten
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5022695A (en) * 1989-01-30 1991-06-11 Texas Instruments Incorporated Semiconductor slice holder
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
FR2778496B1 (fr) 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
JP3407192B2 (ja) * 1998-12-31 2003-05-19 株式会社ダイトー テストハンドの制御方法及び計測制御システム
US6690284B2 (en) 1998-12-31 2004-02-10 Daito Corporation Method of controlling IC handler and control system using the same
US6393694B2 (en) * 1999-04-23 2002-05-28 Koninklijke Philips Electronics N.V. Gripping device
FR2835337B1 (fr) 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
DE10304019A1 (de) 2003-02-01 2004-11-04 Kuka Roboter Gmbh Verfahren zum Überwachen einer Maschine und derartige Maschine, insbesondere Roboter
US7290813B2 (en) 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
US8657352B2 (en) 2011-04-11 2014-02-25 International Business Machines Corporation Robotic device for substrate transfer applications
US8936293B2 (en) 2011-12-21 2015-01-20 International Business Machines Corporation Robotic device for substrate transfer applications
CN108515527B (zh) * 2018-04-18 2020-06-16 东莞理工学院 一种机械手反馈装置
US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3824674A (en) * 1972-07-19 1974-07-23 Hitachi Ltd Automatic assembly control method and device therefor
EP0076135A3 (en) * 1981-09-28 1984-05-09 Hitachi, Ltd. Apparatus for taking out articles
US4543032A (en) * 1983-03-02 1985-09-24 International Business Machines Corporation Robot manipulator with automatically changeable finger tools
CA1276710C (en) * 1983-11-30 1990-11-20 Kazuo Asakawa Robot force controlling system

Also Published As

Publication number Publication date
JPS61226287A (ja) 1986-10-08
GB2171978A (en) 1986-09-10
GB2171978B (en) 1988-09-01
DE3607588A1 (de) 1986-09-18
FR2578471A1 (fr) 1986-09-12
GB8605580D0 (en) 1986-04-09

Similar Documents

Publication Publication Date Title
NL8600534A (nl) Inrichting en werkwijze voor geautomatiseerde wafelverwerking.
US4813732A (en) Apparatus and method for automated wafer handling
US9144908B2 (en) Manipulator device
DE102015115115B4 (de) Gegenstandsaufnahmevorrichtung zum Aufnehmen von zufällig gehäuften Gegenständen
CN110271019B (zh) 协作机器人的控制装置以及控制方法
US11701775B2 (en) Method of setting target force upper limit and robot system
JP6805323B2 (ja) ロボットグリッパーと構成要素との間の位置方位を較正する方法及び装置
EP3066477B1 (en) Confirmed placement of sample tubes in a servo driven automation system using trajectory deviation
CN110636924B (zh) 把持系统
JP3361134B2 (ja) ワイヤハーネスの自動結線装置及び方法
US7264432B2 (en) Device and method for transferring objects
JP2001179669A (ja) ロボットの制御装置
US10675767B2 (en) Robot system and robot controller
CN113661138B (zh) 机器人手、机器人以及机器人系统
JP2727241B2 (ja) プレスブレーキシステムのワーク位置決め装置および方法
US20180354133A1 (en) Control Device And Robot System
CN110315558B (zh) 协作机器人的控制装置和控制方法
JP4156822B2 (ja) ハンドリング装置
JPH03202290A (ja) ばら積み物体の取出装置
JPH0822515B2 (ja) センサー及びセンサーを用いた制御システム
JPS60221281A (ja) 物体把持装置
JPH03270890A (ja) 視覚センサを備えたワーク把持制御装置
CN217777028U (zh) 物料夹取装置及夹取机械手
CN114367323B (zh) 移载装置、移液设备和移载方法
JPS63120092A (ja) 把持装置

Legal Events

Date Code Title Description
A1A A request for search or an international-type search has been filed
BB A search report has been drawn up
BV The patent application has lapsed