GB2171978B - Apparatus and method for automated wafer handling - Google Patents

Apparatus and method for automated wafer handling

Info

Publication number
GB2171978B
GB2171978B GB08605580A GB8605580A GB2171978B GB 2171978 B GB2171978 B GB 2171978B GB 08605580 A GB08605580 A GB 08605580A GB 8605580 A GB8605580 A GB 8605580A GB 2171978 B GB2171978 B GB 2171978B
Authority
GB
United Kingdom
Prior art keywords
wafer handling
automated wafer
automated
handling
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08605580A
Other versions
GB2171978A (en
GB8605580D0 (en
Inventor
David C Klem
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epsilon Technology Inc
Original Assignee
Epsilon Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epsilon Technology Inc filed Critical Epsilon Technology Inc
Publication of GB8605580D0 publication Critical patent/GB8605580D0/en
Publication of GB2171978A publication Critical patent/GB2171978A/en
Application granted granted Critical
Publication of GB2171978B publication Critical patent/GB2171978B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/085—Force or torque sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/08—Gripping heads and other end effectors having finger members
    • B25J15/10—Gripping heads and other end effectors having finger members with three or more finger members
    • B25J15/103—Gripping heads and other end effectors having finger members with three or more finger members for gripping the object in three contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
GB08605580A 1985-03-07 1986-03-06 Apparatus and method for automated wafer handling Expired GB2171978B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70951885A 1985-03-07 1985-03-07

Publications (3)

Publication Number Publication Date
GB8605580D0 GB8605580D0 (en) 1986-04-09
GB2171978A GB2171978A (en) 1986-09-10
GB2171978B true GB2171978B (en) 1988-09-01

Family

ID=24850195

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08605580A Expired GB2171978B (en) 1985-03-07 1986-03-06 Apparatus and method for automated wafer handling

Country Status (5)

Country Link
JP (1) JPS61226287A (en)
DE (1) DE3607588A1 (en)
FR (1) FR2578471A1 (en)
GB (1) GB2171978B (en)
NL (1) NL8600534A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108515527A (en) * 2018-04-18 2018-09-11 东莞理工学院 A kind of manipulator feedback device

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816116A (en) * 1985-10-24 1989-03-28 Texas Instruments Incorporated Semiconductor wafer transfer method and arm mechanism
CA1331163C (en) * 1986-04-18 1994-08-02 Applied Materials, Inc. Multiple-processing and contamination-free plasma etching system
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
JPS6323332A (en) * 1986-04-28 1988-01-30 バリアン・アソシエイツ・インコ−ポレイテツド Wafer transfer system
DE3707672A1 (en) * 1987-03-10 1988-09-22 Sitesa Sa EPITAXY SYSTEM
WO1988009303A1 (en) * 1987-05-21 1988-12-01 Hine Design Inc. Method and apparatus for aligning silicon wafers
US5102291A (en) * 1987-05-21 1992-04-07 Hine Design Inc. Method for transporting silicon wafers
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
DE3837688A1 (en) * 1988-11-05 1990-05-10 Leybold Ag DEVICE FOR MACHINING WORKPIECES, PREFERABLY OF DISC-SHAPED, FLAT SUBSTRATES
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5022695A (en) * 1989-01-30 1991-06-11 Texas Instruments Incorporated Semiconductor slice holder
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
FR2778496B1 (en) 1998-05-05 2002-04-19 Recif Sa METHOD AND DEVICE FOR CHANGING THE POSITION OF A SEMICONDUCTOR PLATE
JP3407192B2 (en) * 1998-12-31 2003-05-19 株式会社ダイトー Test hand control method and measurement control system
US6690284B2 (en) 1998-12-31 2004-02-10 Daito Corporation Method of controlling IC handler and control system using the same
US6393694B2 (en) * 1999-04-23 2002-05-28 Koninklijke Philips Electronics N.V. Gripping device
FR2835337B1 (en) 2002-01-29 2004-08-20 Recif Sa METHOD AND DEVICE FOR IDENTIFYING CHARACTERS REGISTERED ON A SEMICONDUCTOR PLATE HAVING AT LEAST ONE GUIDANCE MARK
DE10304019A1 (en) 2003-02-01 2004-11-04 Kuka Roboter Gmbh Method for monitoring a machine and such a machine, in particular a robot
US7290813B2 (en) 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
US8657352B2 (en) 2011-04-11 2014-02-25 International Business Machines Corporation Robotic device for substrate transfer applications
US8936293B2 (en) 2011-12-21 2015-01-20 International Business Machines Corporation Robotic device for substrate transfer applications
US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3824674A (en) * 1972-07-19 1974-07-23 Hitachi Ltd Automatic assembly control method and device therefor
EP0076135A3 (en) * 1981-09-28 1984-05-09 Hitachi, Ltd. Apparatus for taking out articles
US4543032A (en) * 1983-03-02 1985-09-24 International Business Machines Corporation Robot manipulator with automatically changeable finger tools
CA1276710C (en) * 1983-11-30 1990-11-20 Kazuo Asakawa Robot force controlling system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108515527A (en) * 2018-04-18 2018-09-11 东莞理工学院 A kind of manipulator feedback device
CN108515527B (en) * 2018-04-18 2020-06-16 东莞理工学院 Manipulator feedback device

Also Published As

Publication number Publication date
JPS61226287A (en) 1986-10-08
GB2171978A (en) 1986-09-10
DE3607588A1 (en) 1986-09-18
NL8600534A (en) 1986-10-01
FR2578471A1 (en) 1986-09-12
GB8605580D0 (en) 1986-04-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930306