DE3607588A1 - Verfahren und vorrichtung zum automatischen handhaben von halbleiterplaettchen - Google Patents

Verfahren und vorrichtung zum automatischen handhaben von halbleiterplaettchen

Info

Publication number
DE3607588A1
DE3607588A1 DE19863607588 DE3607588A DE3607588A1 DE 3607588 A1 DE3607588 A1 DE 3607588A1 DE 19863607588 DE19863607588 DE 19863607588 DE 3607588 A DE3607588 A DE 3607588A DE 3607588 A1 DE3607588 A1 DE 3607588A1
Authority
DE
Germany
Prior art keywords
workpiece
strain gauge
arm
housing
robot arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19863607588
Other languages
German (de)
English (en)
Inventor
David C. Mesa Ariz. Klem
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epsilon Technology Inc
Original Assignee
Epsilon Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epsilon Technology Inc filed Critical Epsilon Technology Inc
Publication of DE3607588A1 publication Critical patent/DE3607588A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/085—Force or torque sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/08—Gripping heads and other end effectors having finger members
    • B25J15/10—Gripping heads and other end effectors having finger members with three or more finger members
    • B25J15/103—Gripping heads and other end effectors having finger members with three or more finger members for gripping the object in three contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
DE19863607588 1985-03-07 1986-03-07 Verfahren und vorrichtung zum automatischen handhaben von halbleiterplaettchen Withdrawn DE3607588A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70951885A 1985-03-07 1985-03-07

Publications (1)

Publication Number Publication Date
DE3607588A1 true DE3607588A1 (de) 1986-09-18

Family

ID=24850195

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863607588 Withdrawn DE3607588A1 (de) 1985-03-07 1986-03-07 Verfahren und vorrichtung zum automatischen handhaben von halbleiterplaettchen

Country Status (5)

Country Link
JP (1) JPS61226287A (ja)
DE (1) DE3607588A1 (ja)
FR (1) FR2578471A1 (ja)
GB (1) GB2171978B (ja)
NL (1) NL8600534A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3837688A1 (de) * 1988-11-05 1990-05-10 Leybold Ag Vorrichtung zur bearbeitung von werkstuecken, vorzugsweise von kreisscheibenfoermigen, flachen substraten
DE10304019A1 (de) * 2003-02-01 2004-11-04 Kuka Roboter Gmbh Verfahren zum Überwachen einer Maschine und derartige Maschine, insbesondere Roboter

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816116A (en) * 1985-10-24 1989-03-28 Texas Instruments Incorporated Semiconductor wafer transfer method and arm mechanism
CA1331163C (en) * 1986-04-18 1994-08-02 Applied Materials, Inc. Multiple-processing and contamination-free plasma etching system
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
JPS6323332A (ja) * 1986-04-28 1988-01-30 バリアン・アソシエイツ・インコ−ポレイテツド ウエーハ移送方法及び装置
DE3707672A1 (de) * 1987-03-10 1988-09-22 Sitesa Sa Epitaxieanlage
WO1988009303A1 (en) * 1987-05-21 1988-12-01 Hine Design Inc. Method and apparatus for aligning silicon wafers
US5102291A (en) * 1987-05-21 1992-04-07 Hine Design Inc. Method for transporting silicon wafers
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5022695A (en) * 1989-01-30 1991-06-11 Texas Instruments Incorporated Semiconductor slice holder
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
FR2778496B1 (fr) 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
JP3407192B2 (ja) * 1998-12-31 2003-05-19 株式会社ダイトー テストハンドの制御方法及び計測制御システム
US6690284B2 (en) 1998-12-31 2004-02-10 Daito Corporation Method of controlling IC handler and control system using the same
US6393694B2 (en) * 1999-04-23 2002-05-28 Koninklijke Philips Electronics N.V. Gripping device
FR2835337B1 (fr) 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
US7290813B2 (en) 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
US8657352B2 (en) 2011-04-11 2014-02-25 International Business Machines Corporation Robotic device for substrate transfer applications
US8936293B2 (en) 2011-12-21 2015-01-20 International Business Machines Corporation Robotic device for substrate transfer applications
CN108515527B (zh) * 2018-04-18 2020-06-16 东莞理工学院 一种机械手反馈装置
US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3824674A (en) * 1972-07-19 1974-07-23 Hitachi Ltd Automatic assembly control method and device therefor
EP0076135A3 (en) * 1981-09-28 1984-05-09 Hitachi, Ltd. Apparatus for taking out articles
US4543032A (en) * 1983-03-02 1985-09-24 International Business Machines Corporation Robot manipulator with automatically changeable finger tools
CA1276710C (en) * 1983-11-30 1990-11-20 Kazuo Asakawa Robot force controlling system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3837688A1 (de) * 1988-11-05 1990-05-10 Leybold Ag Vorrichtung zur bearbeitung von werkstuecken, vorzugsweise von kreisscheibenfoermigen, flachen substraten
US4936180A (en) * 1988-11-05 1990-06-26 Leybold Aktiengesellschaft Apparatus for machining workpieces, particularly flat circular disk-shaped substrates
DE10304019A1 (de) * 2003-02-01 2004-11-04 Kuka Roboter Gmbh Verfahren zum Überwachen einer Maschine und derartige Maschine, insbesondere Roboter
US7086293B2 (en) 2003-02-01 2006-08-08 Kuka Roboter Gmbh Method for monitoring a machine and such a machine, particularly a robot

Also Published As

Publication number Publication date
JPS61226287A (ja) 1986-10-08
GB2171978A (en) 1986-09-10
GB2171978B (en) 1988-09-01
NL8600534A (nl) 1986-10-01
FR2578471A1 (fr) 1986-09-12
GB8605580D0 (en) 1986-04-09

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee