NL8102620A - Werkwijze voor de vervaardiging van gedrukte bedrading en aldus verkregen produkten. - Google Patents

Werkwijze voor de vervaardiging van gedrukte bedrading en aldus verkregen produkten. Download PDF

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Publication number
NL8102620A
NL8102620A NL8102620A NL8102620A NL8102620A NL 8102620 A NL8102620 A NL 8102620A NL 8102620 A NL8102620 A NL 8102620A NL 8102620 A NL8102620 A NL 8102620A NL 8102620 A NL8102620 A NL 8102620A
Authority
NL
Netherlands
Prior art keywords
metal
layer
solution
particles
spraying
Prior art date
Application number
NL8102620A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8102620A priority Critical patent/NL8102620A/nl
Priority to DE8282200611T priority patent/DE3267541D1/de
Priority to AT82200611T priority patent/ATE16612T1/de
Priority to EP82200611A priority patent/EP0066330B1/en
Priority to US06/380,165 priority patent/US4451505A/en
Priority to FI821877A priority patent/FI73860C/fi
Priority to JP57088970A priority patent/JPS57199294A/ja
Priority to CA000403896A priority patent/CA1170889A/en
Publication of NL8102620A publication Critical patent/NL8102620A/nl

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/76—Photosensitive materials characterised by the base or auxiliary layers
    • G03C1/91—Photosensitive materials characterised by the base or auxiliary layers characterised by subbing layers or subbing means
    • G03C1/915—Photosensitive materials characterised by the base or auxiliary layers characterised by subbing layers or subbing means using mechanical or physical means therefor, e.g. corona
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/705—Compositions containing chalcogenides, metals or alloys thereof, as photosensitive substances, e.g. photodope systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paper (AREA)
  • Medicines Containing Antibodies Or Antigens For Use As Internal Diagnostic Agents (AREA)
  • Tires In General (AREA)
NL8102620A 1981-05-29 1981-05-29 Werkwijze voor de vervaardiging van gedrukte bedrading en aldus verkregen produkten. NL8102620A (nl)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL8102620A NL8102620A (nl) 1981-05-29 1981-05-29 Werkwijze voor de vervaardiging van gedrukte bedrading en aldus verkregen produkten.
DE8282200611T DE3267541D1 (en) 1981-05-29 1982-05-18 Method of producing printed circuit boards
AT82200611T ATE16612T1 (de) 1981-05-29 1982-05-18 Verfahren zur herstellung gedruckter schaltungen.
EP82200611A EP0066330B1 (en) 1981-05-29 1982-05-18 Method of producing printed circuit boards
US06/380,165 US4451505A (en) 1981-05-29 1982-05-20 Method of producing printed circuit boards
FI821877A FI73860C (fi) 1981-05-29 1982-05-26 Foerfarande foer framstaellning av tryckta kretskort.
JP57088970A JPS57199294A (en) 1981-05-29 1982-05-27 Method of producing printed circuit board
CA000403896A CA1170889A (en) 1981-05-29 1982-05-27 Method of producing printed circuit boards and products thus obtained

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8102620 1981-05-29
NL8102620A NL8102620A (nl) 1981-05-29 1981-05-29 Werkwijze voor de vervaardiging van gedrukte bedrading en aldus verkregen produkten.

Publications (1)

Publication Number Publication Date
NL8102620A true NL8102620A (nl) 1982-12-16

Family

ID=19837584

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8102620A NL8102620A (nl) 1981-05-29 1981-05-29 Werkwijze voor de vervaardiging van gedrukte bedrading en aldus verkregen produkten.

Country Status (8)

Country Link
US (1) US4451505A (ja)
EP (1) EP0066330B1 (ja)
JP (1) JPS57199294A (ja)
AT (1) ATE16612T1 (ja)
CA (1) CA1170889A (ja)
DE (1) DE3267541D1 (ja)
FI (1) FI73860C (ja)
NL (1) NL8102620A (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594311A (en) * 1984-10-29 1986-06-10 Kollmorgen Technologies Corporation Process for the photoselective metallization on non-conductive plastic base materials
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4908259A (en) * 1986-11-18 1990-03-13 Sankyo Kasei Kabushiki Kaisha Molded article with partial metal plating and a process for producing such article
JPH0660416B2 (ja) * 1986-11-18 1994-08-10 三共化成株式会社 プラスチック成形品の製法
US4910049A (en) * 1986-12-15 1990-03-20 International Business Machines Corporation Conditioning a dielectric substrate for plating thereon
US4812353A (en) * 1986-12-27 1989-03-14 Sankyo Kasei Kabushiki Kaisha Process for the production of circuit board and the like
US4859571A (en) * 1986-12-30 1989-08-22 E. I. Du Pont De Nemours And Company Embedded catalyst receptors for metallization of dielectrics
US4910118A (en) * 1987-03-30 1990-03-20 The Mead Corporation Method and photosensitive material for forming metal patterns employing microcapsules
DE3826260A1 (de) * 1987-08-05 1989-03-02 Gartner & Co J Verglasung
US4921387A (en) * 1988-09-16 1990-05-01 The Budd Company Combination transfer/turnover machine
US5077115A (en) * 1990-05-08 1991-12-31 Rogers Corporation Thermoplastic composite material
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US6361959B1 (en) 1994-07-07 2002-03-26 Tessera, Inc. Microelectronic unit forming methods and materials
US6828668B2 (en) * 1994-07-07 2004-12-07 Tessera, Inc. Flexible lead structures and methods of making same
US6261863B1 (en) 1995-10-24 2001-07-17 Tessera, Inc. Components with releasable leads and methods of making releasable leads
US5763941A (en) * 1995-10-24 1998-06-09 Tessera, Inc. Connection component with releasable leads
US6227943B1 (en) 1998-05-01 2001-05-08 International Business Machines Corporation Method and system for pre-cleaning and post-cleaning deposited metal
DE102010006755A1 (de) 2010-02-04 2011-08-04 BASF Coatings AG, 48165 Kratzfestbeschichtete Kunststoffsubstrate, insbesondere Gehäuse von elektronischen Geräten, mit hoher Transparenz, Verfahren zu deren Herstellung und deren Verwendung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2690403A (en) * 1953-07-24 1954-09-28 Gen Am Transport Chemical nickel plating on nonmetallic materials
US2956901A (en) * 1958-08-06 1960-10-18 Alpha Metal Lab Inc Copper coating composition and method of coating
NL7001820A (ja) * 1970-02-10 1971-08-12
CA954391A (en) * 1971-06-14 1974-09-10 Western Electric Company, Incorporated Method of improving adhesive properties of a polymeric material to a species deposited thereon
US4084968A (en) * 1973-03-30 1978-04-18 U.S. Philips Corporation Method of manufacturing electrically conductive metal layers on substrates
US4085285A (en) * 1973-11-29 1978-04-18 U.S. Philips Corporation Method of manufacturing printed circuit boards
US4298636A (en) * 1978-10-12 1981-11-03 Licentia Patent-Verwaltungs-G.M.B.H. Process for activating plastic surfaces for metallization thereof by treatment with a complex forming solution
JPS5831760B2 (ja) * 1981-01-09 1983-07-08 株式会社東芝 プリント配線板の製造方法

Also Published As

Publication number Publication date
EP0066330B1 (en) 1985-11-21
CA1170889A (en) 1984-07-17
EP0066330A2 (en) 1982-12-08
FI73860B (fi) 1987-07-31
ATE16612T1 (de) 1985-12-15
JPS57199294A (en) 1982-12-07
FI73860C (fi) 1987-11-09
US4451505A (en) 1984-05-29
DE3267541D1 (en) 1986-01-02
EP0066330A3 (en) 1983-01-05
FI821877A0 (fi) 1982-05-26

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