NL2010252C2 - Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus. - Google Patents

Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus. Download PDF

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Publication number
NL2010252C2
NL2010252C2 NL2010252A NL2010252A NL2010252C2 NL 2010252 C2 NL2010252 C2 NL 2010252C2 NL 2010252 A NL2010252 A NL 2010252A NL 2010252 A NL2010252 A NL 2010252A NL 2010252 C2 NL2010252 C2 NL 2010252C2
Authority
NL
Netherlands
Prior art keywords
semiconductor product
movable insert
force
tool part
pressure
Prior art date
Application number
NL2010252A
Other languages
English (en)
Dutch (nl)
Inventor
Johannes Cornelis Beijer
Michiel Hendrikus Antonius Wilhelmus Rutten
Ger Huizing
Mike Louis Theodoor Hoedemaker
Original Assignee
Boschman Tech Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boschman Tech Bv filed Critical Boschman Tech Bv
Priority to NL2010252A priority Critical patent/NL2010252C2/en
Priority to EP14703936.6A priority patent/EP2954550B1/en
Priority to CN201480015287.3A priority patent/CN105247671B/zh
Priority to PCT/NL2014/050069 priority patent/WO2014123413A1/en
Priority to JP2015556898A priority patent/JP6420259B2/ja
Priority to KR1020157024180A priority patent/KR102205248B1/ko
Priority to US14/766,161 priority patent/US9536760B2/en
Priority to TW103103948A priority patent/TWI642118B/zh
Application granted granted Critical
Publication of NL2010252C2 publication Critical patent/NL2010252C2/en

Links

Classifications

    • H10P72/0441—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/82—Hydraulic or pneumatic circuits
    • H10P72/0428—
    • H10P72/0446—
    • H10P72/0604—
    • H10P74/20—
    • H10W70/40—
    • H10W70/60—
    • H10W72/0198—
    • H10W74/014—
    • H10W74/111—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/82—Hydraulic or pneumatic circuits
    • B29C2045/822—Pneumatic circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
NL2010252A 2013-02-06 2013-02-06 Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus. NL2010252C2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL2010252A NL2010252C2 (en) 2013-02-06 2013-02-06 Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
EP14703936.6A EP2954550B1 (en) 2013-02-06 2014-02-05 Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus
CN201480015287.3A CN105247671B (zh) 2013-02-06 2014-02-05 半导体晶粒封装或载体装载方法与相应的设备
PCT/NL2014/050069 WO2014123413A1 (en) 2013-02-06 2014-02-05 Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus
JP2015556898A JP6420259B2 (ja) 2013-02-06 2014-02-05 半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置
KR1020157024180A KR102205248B1 (ko) 2013-02-06 2014-02-05 반도체 다이 봉지 또는 캐리어 실장 방법 및 장치
US14/766,161 US9536760B2 (en) 2013-02-06 2014-02-05 Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus
TW103103948A TWI642118B (zh) 2013-02-06 2014-02-06 半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2010252A NL2010252C2 (en) 2013-02-06 2013-02-06 Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
NL2010252 2013-02-06

Publications (1)

Publication Number Publication Date
NL2010252C2 true NL2010252C2 (en) 2014-08-07

Family

ID=47891868

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2010252A NL2010252C2 (en) 2013-02-06 2013-02-06 Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.

Country Status (8)

Country Link
US (1) US9536760B2 (enExample)
EP (1) EP2954550B1 (enExample)
JP (1) JP6420259B2 (enExample)
KR (1) KR102205248B1 (enExample)
CN (1) CN105247671B (enExample)
NL (1) NL2010252C2 (enExample)
TW (1) TWI642118B (enExample)
WO (1) WO2014123413A1 (enExample)

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IT201700000191A1 (it) 2017-01-02 2018-07-02 Amx Automatrix S R L Pressa e metodo di sinterizzazione di componenti elettronici su un substrato
JP6304517B1 (ja) * 2017-02-14 2018-04-04 第一精工株式会社 樹脂封止方法及び樹脂封止装置
US11227779B2 (en) * 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
DE102017216545A1 (de) 2017-09-19 2018-11-29 Conti Temic Microelectronic Gmbh Vorrichtung und Verfahren zur Herstellung einer Niedertemperatur-Drucksinterverbindung für eine elektronische Baugruppe
EP3791700A1 (en) * 2018-05-08 2021-03-17 W.L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
NL2021137B1 (en) * 2018-06-15 2019-12-20 Boschman Tech Bv Sintering Process Product Carrier
IT201800006846A1 (it) * 2018-07-02 2020-01-02 Gruppo di pressatura per una pressa di sinterizzazione di componenti elettronici su un substrato
IT201800007256A1 (it) * 2018-07-17 2020-01-17 Organo pressore, gruppo di pressatura e pressa di sinterizzazione di componenti elettronici su un substrato
US11227807B2 (en) 2018-11-16 2022-01-18 Hewlett-Packard Development Company, L.P. Two-step molding for a lead frame
JP6667879B1 (ja) * 2018-12-19 2020-03-18 アサヒ・エンジニアリング株式会社 電子部品の実装装置
DE102018133456A1 (de) 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018133420A1 (de) 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018010352B4 (de) 2018-12-21 2021-05-12 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018133434B4 (de) 2018-12-21 2021-03-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats
JP2020119983A (ja) * 2019-01-23 2020-08-06 トヨタ自動車株式会社 半導体素子接合装置、及び半導体素子接合方法
JP6762578B2 (ja) * 2019-02-09 2020-09-30 アサヒ・エンジニアリング株式会社 電子部品実装装置
NL2024038B1 (en) * 2019-10-17 2021-06-22 Boschman Tech B V Component Processing Apparatus, such as a Pressure Sintering Apparatus or a Component Encapsulation Apparatus
KR102196397B1 (ko) * 2020-05-13 2020-12-30 제엠제코(주) 메탈포스트, 이를 포함하는 반도체 패키지 및 반도체 패키지 제조방법
DE102020114442A1 (de) 2020-05-29 2021-12-02 Danfoss Silicon Power Gmbh Halbleiterbauelement
DE102020207343A1 (de) 2020-06-15 2021-12-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung optischer und/oder optoelektronischer Systeme mit verbesserter Wärmeabfuhr und verbesserter thermischer und/oder mechanischer Stabilität, sowie mittels dieses Verfahrens erhaltene optische und/oder optoelektronische Systeme
US11676937B2 (en) * 2021-05-04 2023-06-13 Asmpt Singapore Pte. Ltd. Flexible sinter tool for bonding semiconductor devices
US12072251B2 (en) * 2022-03-01 2024-08-27 Asmpt Singapore Pte. Ltd. Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device
CN116631917B (zh) * 2023-07-19 2023-12-19 江苏快克芯装备科技有限公司 气压膜压接装置
AT527921B1 (de) 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

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Also Published As

Publication number Publication date
US20150371880A1 (en) 2015-12-24
KR102205248B1 (ko) 2021-01-21
WO2014123413A1 (en) 2014-08-14
US9536760B2 (en) 2017-01-03
EP2954550A1 (en) 2015-12-16
EP2954550B1 (en) 2017-06-28
JP6420259B2 (ja) 2018-11-07
CN105247671B (zh) 2017-12-22
TWI642118B (zh) 2018-11-21
TW201438117A (zh) 2014-10-01
CN105247671A (zh) 2016-01-13
JP2016507164A (ja) 2016-03-07
KR20150136476A (ko) 2015-12-07

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